Specialty / Other Leveling and Filling Compounds
from DigiKey
Thermal Pad 288.00mm x 192.00mm Rectangular [See More]
- Thermal Conductivity: 2.5
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Composition: Filled
- Type / Form: Liquid
- Cure / Technology: Single Component; Dual Curing
- Features: Adhesive; High Dielectric; Non-corrosive; Sealant
from RS Components, Ltd.
Interface material PCM Triumphant 3.5 W/ [See More]
- Features: Sealant
- Thermal Conductivity: 3.5
from DigiKey
Thermal Pad Black 200.00mm x 150.00mm Rectangular Tacky - Both Sides [See More]
- Thermal Conductivity: 2.5
from Master Bond, Inc.
Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from RS Components, Ltd.
Thermal Putty, 3.0 W/m K, non silicone, [See More]
- Features: Sealant
- Thermal Conductivity: 3
- Use Temperature: -22 to 302
from DigiKey
Thermal Pad Gray 200.00mm x 150.00mm Rectangular Tacky - Both Sides [See More]
- Thermal Conductivity: 2
from Master Bond, Inc.
Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Type / Form: Liquid
from RS Components, Ltd.
Silicon Putty,5.0 W/m K,55ml [See More]
- Features: Sealant
- Thermal Conductivity: 5
- Use Temperature: -58 to 392
from DigiKey
Thermal Pad Gray 400.00mm x 300.00mm Rectangular Tacky - Both Sides [See More]
- Thermal Conductivity: 2
from Master Bond, Inc.
Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, UV curable adhesive system with excellent strength properties. [See More]
- Composition: Unfilled
- Features: Adhesive; Flexible; High Dielectric; Sealant
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from RS Components, Ltd.
Thermal Putty with EMI, 2.0 W/m K, 55ml [See More]
- Features: Sealant
- Thermal Conductivity: 2
- Use Temperature: -58 to 392
from DigiKey
Thermal Pad Pink 200.00mm x 150.00mm Rectangular Tacky - Both Sides [See More]
- Thermal Conductivity: 1
from RS Components, Ltd.
Thermal Putty, 2.0 W/m K, 55ml [See More]
- Features: Sealant
- Thermal Conductivity: 2
- Use Temperature: -58 to 392
from DigiKey
Thermal Pad Yellow 200.00mm x 150.00mm Rectangular Tacky - Both Sides [See More]
- Thermal Conductivity: 1
from RS Components, Ltd.
Silicon Putty,3.0 W/m K,55ml [See More]
- Features: Sealant
- Thermal Conductivity: 3
- Use Temperature: -58 to 392
from DigiKey
Thermal Pad Pink 152.40mm x 152.40mm Square Tacky - Both Sides [See More]
from RS Components, Ltd.
Silicone putty, 2.0 W/m K 1kg [See More]
- Features: Sealant
- Thermal Conductivity: 2
- Use Temperature: -58 to 392
from DigiKey
Thermal Pad Gray 14.00mm x 14.00mm Square Tacky - Both Sides [See More]
from RS Components, Ltd.
Silicone putty, 3.0 W/m K 1kg [See More]
- Features: Sealant
- Thermal Conductivity: 3
- Use Temperature: -58 to 392
from DigiKey
Thermal Pad Gray 14.00mm x 14.00mm Square Tacky - Both Sides [See More]
from RS Components, Ltd.
Thermal Putty [See More]
- Features: Sealant
- Thermal Conductivity: 2
- Use Temperature: -40 to 392
from DigiKey
THERM-A-GAP PAD80LO 8.0W/MK LOW [See More]
- Thermal Conductivity: 8.3
from RS Components, Ltd.
Thermal Putty [See More]
- Features: Sealant
- Thermal Conductivity: 3
- Use Temperature: -40 to 392
from DigiKey
Thermal Pad Gray 457.20mm x 228.60mm Rectangular Tacky - Both Sides [See More]
- Thermal Conductivity: 3
from RS Components, Ltd.
Thermal Putty [See More]
- Features: Sealant
- Thermal Conductivity: 5
- Use Temperature: -40 to 392
from DigiKey
Thermal Pad Black 45.00mm x 15.00mm Rectangular Adhesive - Both Sides [See More]
- Thermal Conductivity: 400
from RS Components, Ltd.
Thermal Putty [See More]
- Features: Sealant
- Thermal Conductivity: 7
- Use Temperature: -58 to 392
from DigiKey
Thermal Pad Pink 228.60mm x 215.90mm Rectangular Tacky - One Side [See More]
- Thermal Conductivity: 2.8
from DigiKey
Thermal Pad Pink 228.60mm x 215.90mm Rectangular Tacky - One Side [See More]
- Thermal Conductivity: 3
from DigiKey
Thermal Pad Pink 228.60mm x 215.90mm Rectangular Tacky - One Side [See More]
- Thermal Conductivity: 3
from DigiKey
Thermal Pad Gray 228.60mm x 228.60mm Square Tacky - One Side [See More]
- Thermal Conductivity: 2
from DigiKey
Thermal Pad Pink 228.60mm x 228.60mm Rectangular [See More]
- Thermal Conductivity: 3
from DigiKey
Thermal Pad Pink 228.60mm x 215.90mm Rectangular [See More]
- Thermal Conductivity: 3
from DigiKey
THERM PAD 406.4X406.4MM GRAY [See More]
- Thermal Conductivity: 6
from DigiKey
THERM PAD 203.2X203.2MM BLUE [See More]
- Thermal Conductivity: 6
from DigiKey
THERM PAD 457.2X457.2MM WHT [See More]
- Thermal Conductivity: 3
from DigiKey
Thermal Pad Gray 127.00mm x 76.00mm Rectangular [See More]
- Thermal Conductivity: 34
from DigiKey
TFLEX SF4,0.50 457X457MM [See More]
- Thermal Conductivity: 4
from DigiKey
Thermal Pad Gray 228.60mm x 228.60mm Square Tacky - Both Sides [See More]
- Thermal Conductivity: 7.8
from DigiKey
Thermal Pad Pink 228.60mm x 228.60mm Square [See More]
- Thermal Conductivity: 3
from Dampney Company, Inc.
Hi-Temp Lab-metal is ready-to-use right from the can. Developed for difficult repairs subject to excessive heat, Hi-Temp Lab-metal withstands temperatures as high as 1000ºF. [See More]
- Composition: Filled
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Cure / Technology: Thermoset
- Industry: Automotive; Construction; Welding
from Sherwin-Williams Protective & Marine Coatings
General Polymers TPM #707 POLY-FLO is a single component, cement based, industrial topping that requires only the addition of water to produce a self-leveling mortar. Ideally suited for leveling or resurfacing distresed, rough and unevern concrete floors. Advantages. Easy mixing and placement. [See More]
- Cure / Technology: Single Component
- Industry: OEM or Industrial
- Substrate Compatibility: Concrete, Masonry; Metal; Wood
- Use Temperature: 50 to 90
from Sauereisen, Inc.
SubstrateResurfacerTM No. F-121 by Sauereisen is a high strength substrate repair material and waterproofing barrier. for prevention of inflow and infiltration in concrete or brick manholes. SubstrateResurfacerTM is portland cement-based and primarily specified for municipal wastewater environments... [See More]
- Chemical System: Ceramic
- Cure / Technology: Single Component
- Composition: Unfilled
- Type / Form: Powder
from Dampney Company, Inc.
Ready-to-use metal repair putty, dent filler and patching compound. Durable metal filler for fast, permanent repairs. A unique, quality problem-solver! Lab-metal ready-to-use repair compound spreads like paste and hardens quickly into metal. [See More]
- Composition: Filled
- Industry: Automotive; Marine; Construction; OEM or Industrial
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Use Temperature: -40 to 350
from Sherwin-Williams Protective & Marine Coatings
GENERAL POLYMERS 4687 Ultra high solids aliphatic urethane is specifically designed to allow for maximum flow and leveling for large expansive applications. It offers chemical resistance, and hardness combined with flexibility to provide outstanding wear resistance. Also capable of adding fine... [See More]
- Industry: OEM or Industrial
- Use Temperature: 50 to 90
from Sherwin-Williams Protective & Marine Coatings
General Polymers FasTop S URETHANE SLURRY SYSTEM is a self-leveling slurry to be applied at 3/16 ” thickness and broadcast to yield a 1/4 ” - 3/8 ” finished system. FasTop S can be applied with a pin rake, screed rake or flat trowel. It is designed to protect concrete, wood and... [See More]
- Substrate Compatibility: Concrete, Masonry; Metal; Wood
- Use Temperature: 50 to 90
- Industry: OEM or Industrial
- Tensile (Break): 550 to 600