Electrical Insulating / Dielectric Leveling and Filling Compounds

Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Addition Cure
  • Composition: Unfilled
  • Type / Form: Liquid
Ultra Clear Epoxy Adhesive -- 10-3713
from Epoxies Etc...

10-3713 used as a two component ultra clear epoxy adhesive designed for a variety of bonding applications. 10- 3713 forms a crystal clear bond line and is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This adhesive when UV aged in a QUV Weatherometer... [See More]

  • Features: Adhesive; High Dielectric
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing