Thermosetting / Crosslinking Leveling and Filling Compounds
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
- Type / Form: Liquid
- Composition: Unfilled
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Cure / Technology: Thermoset; Two Component ; Addition Cure
- Features: Adhesive; Flexible; Electrically Conductive; Non-corrosive; Sealant
- Composition: Filled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Composition: Unfilled
- Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Powder
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Dampney Company, Inc.
Hi-Temp Lab-metal is ready-to-use right from the can. Developed for difficult repairs subject to excessive heat, Hi-Temp Lab-metal withstands temperatures as high as 1000ºF. [See More]
- Cure / Technology: Thermoset
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Composition: Filled
- Industry: Automotive; Construction; Welding
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a one-component, thermosetting epoxy resin. It is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stress in handheld electronic devices. [See More]
- Cure / Technology: Thermoset; Single Component; Heat Curing
- Industry: Electronics
- Chemical System: Epoxy
- Viscosity: 2000 to 4500
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. [See More]
- Cure / Technology: Thermoset; Two Component
- Features: Adhesive; Sealant
- Chemical System: Epoxy
- Substrate Compatibility: Honeycomb Core
from Aremco Products, Inc.
Used for repairing metal components, pinholes, cracks, and filling seams. [See More]
- Cure / Technology: Thermoset
- Composition: Filled
- Chemical System: Ceramic
- Features: Sealant; Water Based
from Sauereisen, Inc.
ConoCrete - Fast Patch No. 149 is a three-component, fast setting epoxy monolithic that is designed for patching cracks and holes. This material is ideal for use on highways, bridge decks,. docks, ramps, traffic aisles, industrial floors and airport runways. Fast Patch No. 149 produces extremely... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Powder
from Epoxies Etc...
10-3713 used as a two component ultra clear epoxy adhesive designed for a variety of bonding applications. 10- 3713 forms a crystal clear bond line and is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This adhesive when UV aged in a QUV Weatherometer... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173... [See More]
- Cure / Technology: Thermoset
- Features: Adhesive
- Chemical System: Epoxy
- Industry: OEM or Industrial
from Wacker Chemical Corp.
EL E952 *PLP,BL OH,18 is a self-levelling one-component silicone rubber with very good mechanical properties, which cures at room temperature under the influence of atmospheric moisture. Special features. acetic acid-curing system. self-levelling. excellent primerless adhesion to many substrates. [See More]
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Features: Adhesive; Sealant
- Chemical System: Elastomeric
- Industry: OEM or Industrial
from Sherwin-Williams Protective & Marine Coatings
ArmorSeal ®5020 EPOXY FLOOR RESURFACER is a trowelable epoxy surfacing and leveling compound for new and old floors of concrete, wood, or steel where a high degree of chemical and abrasion resistance is required. The physical properties of ArmorSeal ®5020 are much higher than those of... [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Structural Adhesive EC-3587 B/A Gray is a two-part polyurethane that cures at room temperature or with heat to a tough, impact-resistant material. It has excellent adhesion to many metal and plastic substrates. It can be used as structural adhesive, void filler, or as... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: Adhesive; Sealant
- Chemical System: Polyurethane
- Substrate Compatibility: Metal; Plastic
from Sherwin-Williams Protective & Marine Coatings
HEAVY DUTY BLOCK FILLER is a pure acrylic resin block filler for use on interior and exterior poured and precast concrete, concrete block, and cinder block. Excellent moisture resistance. Excellent filling characteristics. Suitable for use in USDA inspected facilities. Resurface spalled and... [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Chemical System: Acrylic
- Type / Form: Liquid
from Sherwin-Williams Protective & Marine Coatings
Cement-Plexl ® 875 is a heavy duty, interior/exterior, VOC compliant, two component, cementitious, acrylic, waterborne block filler, which accepts both conventional and high performance topcoats. When topcoated, this product provides an excellent coating system for moderate service environments... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Ceramic; Acrylic
- Type / Form: Liquid
from Sherwin-Williams Protective & Marine Coatings
KEM ® Cati-Coat ® HS EPOXY FILLER/SEALER is a high performance, interior/exterior, VOC compliant, epoxy block filler. Designed for tenacious adhesion to masonry substrates while filling voids and crevices to smooth the surface. Excellent resistance to moisture, humidity, impact, and... [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid