Single Component System Leveling and Filling Compounds

Capillary Underfill -- ALPHA® HiTech™ CU11-3127
from MacDermid Alpha Electronics Solutions

ALPHA ® HiTech ™ CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA ® HiTech ™ CU11-3127 protects the solder joints from mechanical stresses such as drop... [See More]

  • Cure / Technology: Single Component
  • Substrate Compatibility: FR4
  • Chemical System: Epoxy
  • Industry: Electronics
Electrically Conductive Adhesives -- LOCTITE ABLESTIK CE 3104WXL
from Henkel Corporation - Industrial

LOCTITE ABLESTIK CE 3104WXL, Epoxy, Electrically Conductive Adhesive LOCTITE ® ABLESTIK CE 3104WXL is an electrically conductive epoxy adhesive that is a Pb-free alternative to solder. This product uses a unique blend of fillers with tightly controlled particle sizes to provide ultra-fine pitch... [See More]

  • Cure / Technology: Single Component
  • Features: Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Metal
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type / Form: Liquid
Bostik Chem-Calk 1200 Silicone Sealant Clear 10.1 oz Cartridge -- K198210 [30852223 from Bostik, Inc.]
from Ellsworth Adhesives

Bostik Chem-Calk 1200 Clear is a one component, moisture curing, silicone sealant that is used for bonding nonporous materials, aluminum, glass, plastics, and ceramics. It is typically used for sealing doors, windows, skylights, and other building components. 10.1 oz Cartridge. [See More]

  • Cure / Technology: Single Component
  • Substrate Compatibility: Ceramic, Glass
  • Features: Sealant
  • Tensile (Break): 290
Electrically Conductive Adhesives -- LOCTITE ABLESTIK XCE 3104XL
from Henkel Corporation - Industrial

LOCTITE ABLESTIK XCE 3104XL, Epoxy, Assembly LOCTITE ® ABLESTIK XCE 3104XL is an electrically conductive adhesive with tin compatibility for fine stencil and screen print applications. It uses a unique blend of fillers with tightly controlled particle sizes to provide fine pitch printing... [See More]

  • Cure / Technology: Single Component
  • Features: Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Metal
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Cure / Technology: Single Component; Dual Curing
  • Type / Form: Liquid
  • Composition: Filled
  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant
Industrial Sealants -- LOCTITE NS 5109
from Henkel Corporation - Industrial

Gasket sealant paste with resin, isopropanol and fillers. It remains pliable and flexible and seals flanges, threaded connections and fasteners. LOCTITE ® NS 5109 (known as LOCTITE GASKET MAKER HIGH TEMPERATURE) is a gray, solvent-based, slow drying, viscous gasket sealant paste with resin,... [See More]

  • Cure / Technology: Single Component
  • Features: Sealant
  • Type / Form: Liquid
  • Use Temperature: 50 to 600
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Composition: Filled
  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Type / Form: Liquid
Metal Rebuilding Material -- LOCTITE SF 8220
from Henkel Corporation - Industrial

Urethane liquid designed to thoroughly clean rubber, urethane or metal surfaces before priming. LOCTITE ® SF 8220 (known as LOCTITE FIXMASTER FLEX CLEANER) is a colorless, urethane liquid designed to thoroughly clean rubber, urethane or metal surfaces before priming. Non-toxic. Dries quickly. [See More]

  • Cure / Technology: Single Component
  • Type / Form: Liquid
  • Chemical System: Polyurethane
High Strength UV Curable Adhesive -- UV15
from Master Bond, Inc.

Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
Potting Compounds -- LOCTITE SI 5089
from Henkel Corporation - Industrial

UV-cured alkoxy silicone used for gasketing and sealing that requires a rapid-curing, post-applied sealant that facilitates immediate on-part inspection. LOCTITE ® SI 5089 is a straw-colored, medium viscosity, fluorescent UV-cured alkoxy silicone used for gasketing and sealing applications. It... [See More]

  • Cure / Technology: Single Component
  • Features: Sealant
  • Type / Form: Liquid
  • Viscosity: ? to 125000
High Strength, Chemically Resistant UV Curable System -- UV18S
from Master Bond, Inc.

Master Bond UV18S is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile liquid at ambient temperatures which does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Retaining Compounds -- LOCTITE 232
from Henkel Corporation - Industrial

Methacrylate ester acrylic retaining compound. Its lubricating properties facilitate assembly when heavy interference or high torque values are used. LOCTITE ® 232 is a brown, opaque, methacrylate ester acrylic retaining compound. Its lubricating properties facilitate assembly when heavy... [See More]

  • Cure / Technology: Single Component
  • Type / Form: Liquid
  • Chemical System: Acrylic
  • Viscosity: 5000
High Strength, Non-Yellowing UV Curable -- UV15-7NV
from Master Bond, Inc.

Master Bond Polymer system UV15-7NV is a new one component, optically clear, non yellowing UV curable polymer system for high performance bonding, sealing and coating. It is 100% reactive and does not contain any solvents or other volatiles. When exposed to a source of UV light of adequate wave... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Retaining Compounds -- LOCTITE 6001
from Henkel Corporation - Industrial

Thixotropic acrylic methacrylate ester liquid adhesive designed for the bonding of cylindrical fitting parts. LOCTITE ® 6001 is a rose beige to off-white thixotropic acrylic methacrylate ester liquid adhesive designed for the bonding of cylindrical fitting parts. It cures when confined between... [See More]

  • Cure / Technology: Single Component
  • Type / Form: Liquid
  • Chemical System: Acrylic
  • Features: Adhesive
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Retaining Compounds -- LOCTITE 609
from Henkel Corporation - Industrial

High strength methacrylate ester acrylic retaining compound designed for the bonding of cylindrical fitting parts. LOCTITE ® 609 is a green, high strength methacrylate ester acrylic retaining compound designed for the bonding of cylindrical fitting parts. The product cures in the absence of air... [See More]

  • Cure / Technology: Single Component
  • Type / Form: Liquid
  • Chemical System: Acrylic
  • Substrate Compatibility: Metal
One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation -- Supreme 3HTND-2DM
from Master Bond, Inc.

Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant
Sealer -- McLube Mold
from McGee Industries, Inc. / McLube Division

McLube mold sealer is effective on new and seasoned molds of all types. Our sealer will reduce or effectively eliminate porosity on the surface of your mold and leave a high-gloss finish. [See More]

  • Cure / Technology: Single Component
  • Features: Sealant; Solvent Based
  • Type / Form: Liquid
3M™ Scotch-Weld™ Core Splice Film -- AF 3070 FST
from 3M Aerospace and Aircraft Maintenance Division

Dual-cure 120c or 180c curing, low-density, expandable product for these applications: honeycomb sandwich edge finishing, filling mismatched areas, and core splicing and reinforcing honeycomb core. Fulfills stand-alone fire, smoke and toxic gas emission (FST) requirements according to FAR 25.853 or... [See More]

  • Cure / Technology: Single Component
  • Type / Form: Sheet or Film
  • Chemical System: Epoxy
  • Features: Adhesive; Sealant
ArmorSeal® 5020 Resurfacer
from Sherwin-Williams Protective & Marine Coatings

ArmorSeal ®5020 EPOXY FLOOR RESURFACER is a trowelable epoxy surfacing and leveling compound for new and old floors of concrete, wood, or steel where a high degree of chemical and abrasion resistance is required. The physical properties of ArmorSeal ®5020 are much higher than those of... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type / Form: Liquid
Self-levelling Silicone Adhesive -- ELASTOSIL® E 952
from Wacker Chemical Corp.

EL E952 *PLP,BL OH,18 is a self-levelling one-component silicone rubber with very good mechanical properties, which cures at room temperature under the influence of atmospheric moisture. Special features. acetic acid-curing system. self-levelling. excellent primerless adhesion to many substrates. [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Features: Adhesive; Sealant
  • Chemical System: Elastomeric
  • Industry: OEM or Industrial
SubstrateResurfacer -- No. F-121
from Sauereisen, Inc.

SubstrateResurfacerTM No. F-121 by Sauereisen is a high strength substrate repair material and waterproofing barrier. for prevention of inflow and infiltration in concrete or brick manholes. SubstrateResurfacerTM is portland cement-based and primarily specified for municipal wastewater environments... [See More]

  • Cure / Technology: Single Component
  • Composition: Unfilled
  • Chemical System: Ceramic
  • Type / Form: Powder
3M™ Scotch-Weld™ Void Filling Compound -- SW 3450 FST
from 3M Aerospace and Aircraft Maintenance Division

Structural one-part low weight void filler for aircraft interiors. One-part low weight filler combining extreme low density with high extrusion rate for manual and automatic applications. Pumpable. Full stand alone FST properties with patented non-halogen based FST system. Low flow for ease of... [See More]

  • Cure / Technology: Single Component
  • Features: Sealant
  • Chemical System: Epoxy
  • Substrate Compatibility: Honeycomb Core
Cement Based, Industrial Topping -- TPM® #707 POLY-FLO
from Sherwin-Williams Protective & Marine Coatings

General Polymers TPM #707 POLY-FLO is a single component, cement based, industrial topping that requires only the addition of water to produce a self-leveling mortar. Ideally suited for leveling or resurfacing distresed, rough and unevern concrete floors. Advantages. Easy mixing and placement. [See More]

  • Cure / Technology: Single Component
  • Industry: OEM or Industrial
  • Substrate Compatibility: Concrete, Masonry; Metal; Wood
  • Use Temperature: 50 to 90
Heavy Duty Block Filler
from Sherwin-Williams Protective & Marine Coatings

HEAVY DUTY BLOCK FILLER is a pure acrylic resin block filler for use on interior and exterior poured and precast concrete, concrete block, and cinder block. Excellent moisture resistance. Excellent filling characteristics. Suitable for use in USDA inspected facilities. Resurface spalled and... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Chemical System: Acrylic
  • Type / Form: Liquid
KEM® Cati-Coat® Epoxy Filler/Sealer
from Sherwin-Williams Protective & Marine Coatings

KEM ® Cati-Coat ® HS EPOXY FILLER/SEALER is a high performance, interior/exterior, VOC compliant, epoxy block filler. Designed for tenacious adhesion to masonry substrates while filling voids and crevices to smooth the surface. Excellent resistance to moisture, humidity, impact, and... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type / Form: Liquid
Repair and Leveling Mortar -- TPM® #721
from Sherwin-Williams Protective & Marine Coatings

General Polymers TPM #721 REPAIR AND LEVELING MORTAR is a single component polymer-modified, shrinkage-compensated cement-based mortar. It is designed for horizontal concrete surfaces where high early strength gain is required. The blend of special cements, aggregates, fibers and polymers produce a... [See More]

  • Cure / Technology: Single Component
  • Industry: OEM or Industrial
  • Substrate Compatibility: Concrete, Masonry; Metal; Wood
  • Use Temperature: 40 to 90