Thermal / Heat Insulating Leveling and Filling Compounds

High Strength UV Curable Adhesive -- UV15
from Master Bond, Inc.

Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
High Strength, Chemically Resistant UV Curable System -- UV18S
from Master Bond, Inc.

Master Bond UV18S is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile liquid at ambient temperatures which does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Single Component
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
High Strength, Non-Yellowing UV Curable -- UV15-7NV
from Master Bond, Inc.

Master Bond Polymer system UV15-7NV is a new one component, optically clear, non yellowing UV curable polymer system for high performance bonding, sealing and coating. It is 100% reactive and does not contain any solvents or other volatiles. When exposed to a source of UV light of adequate wave... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Single Component
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
High Strength, UV Curable Epoxy System -- UV16
from Master Bond, Inc.

Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
High Temperature Resistant, One Component Epoxy Adhesive -- EP17HT-100
from Master Bond, Inc.

Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220 °F. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates. It is... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
High Temperature Resistant, Optically Clear, Two Part Epoxy -- EP121CL-LO
from Master Bond, Inc.

Two component, low viscosity EP121CL-LO features an extraordinary long open time at room temperature of at least 2-3 days. This heat curable epoxy has excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, rubbers and plastics. EP121CL-LO is noteworthy for... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Low Stress, NASA Low Outgassing Silicone Adhesive -- MasterSil 920-LO
from Master Bond, Inc.

MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has very good flow properties and outstanding electrical insulation values, which enhance... [See More]

  • Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Type / Form: Liquid
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Solvent Based; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Low Viscosity, Non-Yellowing Two Component Epoxy -- EP112LS
from Master Bond, Inc.

EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55. This electrically insulative system is resistant to chemicals including water, oils, fuels, acids and bases. Featuring a mixed viscosity of 50-200 cps, EP112LS is serviceable over the... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Low Viscosity, Two Component Epoxy with Low Exotherm -- EP21LVSP6
from Master Bond, Inc.

EP21LVSP6 is a two component system that is also well suited for potting and encapsulation applications. It offers a very convenient one to one mix ratio, by weight or volume and is formulated to cure at room temperature. It has a desirable combination of a long open time of 3-5 hours, low mixed... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
NASA Low Outgassing Approved, One Component Epoxy -- EP17HT-LO
from Master Bond, Inc.

Passing ASTM E595 testing for NASA low outgassing, EP17HT-LO is widely used in a variety of applications in the aerospace, oil/chemical processing, optical, opto-electronic and specialty OEM industries. This single component, thermally stable system has a glass transition temperature of 225 °C. [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Type / Form: Liquid
One Component Low Viscosity, Optically Clear UV Curable -- UV19
from Master Bond, Inc.

Master Bond Polymer System UV19 is a newly developed UV curable, low viscosity optically clear compound specifically designed for high performance laminating, sealing, bonding and coating. This remarkable acrylic based polymer composition can effectively replace conventional heat and/or solvent... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Elastomeric
  • Type / Form: Liquid
One Component UV Curable Compound -- UV15-7SP4
from Master Bond, Inc.

Master Bond Polymer System UV15-7SP4 is a new one component, optically clear, toughened UV and/or curable polymer system with extended service capability of -80 °F to +250 °F. It is 100% reactive, does not contain any solvents or other volatiles and does not embrittle even upon exposure to... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Elastomeric
  • Type / Form: Liquid
One Component, Biocompatible UV Curable Adhesive -- UV10Med
from Master Bond, Inc.

Master Bond UV10Med is a one component, UV curable system that fully meets USP Class VI specifications. This low viscosity, optically clear system is a superior adhesive, sealant and coating and is castable beyond 1/8" thick. The cured system has good chemical resistant properties particularly to... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Polyurethane
  • Type / Form: Liquid
One Component, High Viscosity UV Curable Compound -- UV15X-5
from Master Bond, Inc.

Master Bond Polymer System UV15X-5 is a newly developed one component, non-yellowing, UV curable urethane elastomer system possessing high flexibility and outstanding abrasion resistance. This high viscosity system can be used for bonding, sealing, coating and casting. Master Bond UV15X-5 offers... [See More]

  • Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Elastomeric
  • Type / Form: Liquid
One Component, High Viscosity UV Curable Polymer -- UV11-3
from Master Bond, Inc.

Master Bond UV11-3 is an extra-hard, super-abrasion resist-radiation curable coating system for plastic substrates. It is a low viscosity, clear, 100% reactive liquid that can be cured readily by exposure to UV lamps or EB radiation. The cure can be effected in air or under an inert atmosphere such... [See More]

  • Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Single Component
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
One Component, Highly Flexible UV Curable Urethane -- UV21
from Master Bond, Inc.

Master Bond Polymer System UV21 is an easy to use one component UV curable urethane elastomer compound. It has been used for bonding, sealing, casting and formed in place high performance seals and gaskets. The UV21 is a solvent free system and has an excellent six month shelf life at ambient... [See More]

  • Features: Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Elastomeric
  • Type / Form: Liquid
One Component, Low Viscosity UV Curable System -- UV15LV
from Master Bond, Inc.

Master Bond UV15LV is a new one component, high strength UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive, medium viscosity liquid at ambient temperatures which does not contain any solvents or other... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
One Component, Moderate Viscosity LED Curable -- LED401LV
from Master Bond, Inc.

Featuring breakthrough LED curing technology, LED401LV will cure completely tack-free when exposed to a light source emitting 405 nm wavelength in sections of 1/8 inch thick and beyond. Once cured, it has impressive physical properties, including outstanding dimensional stability, very good... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Type / Form: Liquid
One Component, Moderate Viscosity UV Curable System for High Performance Bonding, Sealing, Coating and Casting -- UV25
from Master Bond, Inc.

With a glass transition temperature exceeding 180 °C, UV25 offers impressive thermal stability over the broad service temperature range of -60 °F to +500 °F. This one part, fast curing, moderate viscosity UV curable system bonds well to glass, surface treated metals, plastics such as... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Type / Form: Sheet or Film; Liquid
One Component, Non-Yellowing UV Curable Adhesive -- UV15X-2
from Master Bond, Inc.

Master Bond UV15X-2 is a new one component, non-yellowing UV curable polymer system for high performance coatings, adhesives and sealants with exceptionally fast response to UV radiation. It is 100% reactive moderate viscosity liquid at ambient temperatures which does not contain any solvents or... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Single Component
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Thermally Stable Electrically Insulating Epoxy -- EP121CL
from Master Bond, Inc.

Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Two Component, Thermal Shock And Heat Resistant Epoxy System -- EP121
from Master Bond, Inc.

Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with good electrical... [See More]

  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component