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Filled / Reinforced Leveling and Filling Compounds

7 Results
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Composition: Filled
  • Type / Form: Liquid
  • Cure / Technology: Single Component; Dual Curing
  • Features: Adhesive; High Dielectric; Non-corrosive; Sealant
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Composition: Filled
  • Features: Adhesive; Flexible; Electrically Conductive; Non-corrosive; Sealant
  • Cure / Technology: Thermoset; Two Component  ; Addition Cure
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Cure / Technology: Thermoset; Single Component
  • Composition: Filled
  • Type / Form: Liquid
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Composition: Filled
  • Type / Form: Liquid
Metal Repair and Patching Compound -- Hi-Temp Lab-metal
from Dampney Company, Inc.

Hi-Temp Lab-metal is ready-to-use right from the can. Developed for difficult repairs subject to excessive heat, Hi-Temp Lab-metal withstands temperatures as high as 1000ºF. [See More]

  • Composition: Filled
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Cure / Technology: Thermoset
  • Industry: Automotive; Construction; Welding
Pyro-Putty® -- 657
from Aremco Products, Inc.

Used for repairing metal components, pinholes, cracks, and filling seams. [See More]

  • Chemical System: Ceramic
  • Cure / Technology: Thermoset
  • Composition: Filled
  • Features: Sealant; Water Based 
Metal Repair Putty -- Lab-metal
from Dampney Company, Inc.

Ready-to-use metal repair putty, dent filler and patching compound. Durable metal filler for fast, permanent repairs. A unique, quality problem-solver! Lab-metal ready-to-use repair compound spreads like paste and hardens quickly into metal. [See More]

  • Composition: Filled
  • Industry: Automotive; Marine; Construction; OEM or Industrial
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Use Temperature: -40 to 350