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  • MICRO: Sutton (April 2001)
    as volume, dispense time, and spin speeds as well as the solvent type and the vapor primer were examined and found to be significant. Implementation of the solvent prewet technique for reducing photoresist dispense volumes was accomplished at the AMD fab using existing facilities and equipment
  • MICRO: Special apps
    - coating efficiency. The efficiency values cited here were derived from tests on 100-mm silicon wafers. The article estimates resist costs only. It does not consider equipment- and maintenance-related costs. Photoresist has two main components: solids and solvent (or aqueous solution, in the case
  • MICRO: Critical Materials?Chemicals
    Wafer processing requires the use of proper amounts of chemicals during photoresist, etch, planarization, and cleaning steps. Manufacturing steps demand that appropriate combinations of chemicals, temperature, and time be repeated for every process cycle. Abnormal flow conditions can create process

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