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Supplier: SAE International
Description: This SAE Recommended Practice describes a method for measuring Roughness Average (R a ) and Peak Count (PC) of the surface of cold-rolled steel sheet.
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Supplier: Accuris
Description: Non-destructive testing of thermally sprayed coatings - Roughness measurement
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Supplier: Mahr Inc.
Description: and 30 profiles 16 languages (including 3 Asian languages) Integrated thermal graphics printer with high print quality Print the R-profile via the thermal graphics printer Printed log either by pressing a button or automatically Data transfer of results and
- Display & Special Features: Digital Readout
- Measurement Capability: Roughness Parameters (Ra, RMS / Rq, Rz, etc.)
- Mounting / Loading: Handheld / Portable
- Operating Temperature: 23 to 104 F
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Supplier: Mahr Inc.
Description: "sMAHRtSurf" - Simple, smart and mobile Compact roughness measuring instrument for mobile use Simple and intuitive to use: As easy to use as a smart phone Large, illuminated 4.3" TFT touch display Adjustable display Start button also
- Display & Special Features: Video / Graphic Display
- Measurement Capability: Roughness Parameters (Ra, RMS / Rq, Rz, etc.)
- Mounting / Loading: Handheld / Portable
- Standards Compliance: ISO / EN, DIN
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Supplier: Mahr Inc.
Description: management Integrated roughness standard for the standard pick-up PHT 6-350 Dynamic calibration function Date and/or time of measurement Software marsurf PS1/M300 explorer for recording measurements (option)
- Display & Special Features: Digital Readout
- Measurement Capability: Roughness Parameters (Ra, RMS / Rq, Rz, etc.)
- Mounting / Loading: Handheld / Portable
- Operating Temperature: 23 to 104 F
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Supplier: Bruker Corporation
Description: The world's first CMM that can provide surface roughness, shape, and size data ” all with one measurement technique. Bruker™s Contour CMM system is specifically designed to measure the small features found in the increasing number of applications that require both precise
- Application: Dimensional Measurement, Profile Measurement, Angularity / Orientation, Depth Mapping
- Mounting Options: Free Standing
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Supplier: Carl Zeiss Industrial Metrology, LLC
Description: 3-in-1 form, contour and surface measurement in one setting For large, precision parts for the wind, power and bearing industries Precision rotary table on air bearings with 80 nanometer rotation accuracy Form tester, contour measuring instrument and
- Display & Special Features: Computer Interface / Networkable, SPC / Software Capability
- Industrial Applications: Other
- Measurement Capability: Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Specialty / Custom
- Mounting / Loading: Floor / Free Standing
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Supplier: SAE International
Description: This SAE Recommended Practice describes a method for measuring Roughness Average (R a ) and Peak Count (PC) and other variables of the surface of metallic coated and uncoated steel sheet/strip.
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Supplier: ASTM International
Description: 1.1 This practice covers the mathematical processing of longitudinal profile measurements to produce a road roughness statistic called the International Roughness Index (IRI). 1.2 The intent is to provide a standard practice for computing and reporting an estimate of road
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Supplier: ASTM International
Description: 1.1 This practice covers the mathematical processing of longitudinal profile measurements to produce a road roughness statistic called the International Roughness Index (IRI). 1.2 The intent is to provide a standard practice for computing and reporting an estimate of road
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Supplier: ASTM International
Description: 1.1 This practice covers the mathematical processing of longitudinal profile measurements to produce a road roughness statistic called the International Roughness Index (IRI). 1.2 The intent is to provide a standard practice for computing and reporting an estimate of road
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Supplier: ASTM International
Description: 1.1 This practice covers the mathematical processing of longitudinal profile measurements to produce a road roughness statistic called the International Roughness Index (IRI). 1.2 The intent is to provide a standard practice for computing and reporting an estimate of road
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Supplier: MTI Instruments Inc.
Description: The Proforma 300SA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning for thickness, thickness variation, bow
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Wafer Probing System, Sensor / Sensing Element
- Maximum Wafer / Part Size: 300 mm
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Supplier: Zygo Corporation
Description: The ZeGage™ optical profiler is the ideal non-contact tool for quantitative measurements of 3D form and roughness on precision machined surfaces. The industrial design provides fast, accurate metrology in a compact, cost-effective package that can be located directly on the
- Mounting Options: Benchtop
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Supplier: Zygo Corporation
Description: vibration-prone environments SmartPSI™ technology for ultra-fast profiling of ultra-smooth surfaces 2D and 3D correlation provides confidence in your measurements with results that comply to ISO 25178 and ISO 4287 standards. Mx™ software for instrument control
- Control: PC
- Mounting Options: Free Standing
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Supplier: Zygo Corporation
Description: The NewView™ 9000 3D optical surface profiler provides powerful versatility in non-contact optical surface profiling. With the system, it is easy and fast to measure a wide range of surface types, including smooth, rough, flat, sloped, and stepped. All measurements are nondestructive,
- Control: Manual, PC
- Mounting Options: Benchtop
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Supplier: Marposs Corp
Description: Small measurement spot Synchronized measurement with encoder for dynamic acquisitions Roughness measurements TECH SPECS Optics with tilting angle up to ± 45 ° for profile measurement Optics with reduced diameters Ø4mm,
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Supplier: KEYENCE
Description: 3D Measurement Tools - Height, Roughness, Radius, and More The VR Series includes a cross-sectional profile measurement menu with tools for measuring height, width, angle, radius, etc. A large variety of 3D analysis functions such as height difference, area,
- Application: Semiconductor Inspection
- Computer Interface: Yes
- Digital Display: Yes
- Grade: Benchtop
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Supplier: SAE International
Description: This SAE Recommended Practice describes a method for measuring the surface texture of cold rolled, matte finish sheet steel with a roughness average (R a ) of 20-80 \u03bc in.
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Supplier: LMI Technologies
Description: Gocator displacement sensors are non-contact laser distance measurement devices that are ideal for determining 3D thickness, height, and surface roughness. The sensors operate at speeds up to 32,000 Hz and ideal for closed loop control or inline inspection of manufactured parts.
- Mounting Options: Other
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Supplier: Park Systems, Inc.
Description: Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Measurement Capability: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: LMI Technologies
Description: MikroCAD delivers sub-micron accuracy and repeatability on a variety of challenging scan surfaces such as shiny, reflective and steep edges, in contrast to confocal solutions that are unable to handle steeply angled geometries. With MikroCAD 3D Surface Metrology you can: Measure
- Application: Dimensional Measurement, Profile Measurement
- Features: Reverse Engineering
- Machine Type and Specifications: 3-D Scanning / Profiling
- Mounting Options: Benchtop
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Supplier: MicroSense, LLC
Description: Automated Wafer Thickness Measurement System Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution) Wafer 4” to 12” (100 to 300mm) Thickness range: 50um to 3mm
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 100 to 300 mm
- Measurement Capability: Roughness / Waviness, Thickness - Wafer / Disc (TTV)
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Description: ISO/TR 22335:2007 describes a method for determining ion-sputtering rates for depth profiling measurements with Auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS) where the specimen is ion-sputtered over a region with an area between 0,4 mm2 and 3
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Supplier: Park Systems, Inc.
Description: The XE-WAFER is a fully automated industrial AFM designed specifically to address surface roughness, trench width, depth, and angle measurements on 200mm & 300mm wafers in a production environment. The system provides superior accuracy and precision nanometrology over any other system
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Measurement Capability: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Bruker Corporation
Description: Bruker's Dektak® stylus profilers are the product of over four decades of proprietary technology advances. They provide repeatable, accurate measurements on varied surfaces, from traditional 2D roughness surface characterization and step height measurements to advanced 3D
- Display & Special Features: Computer Interface / Networkable
- Industrial Applications: Electronics, Semiconductor Manufacturing, Other
- Measurement Capability: Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Thickness
- Mounting / Loading: Benchtop, Floor / Free Standing
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Description: these devices can only be used within specified limits of pipe size, roughness, diameter ratio and Reynolds number. ISO 5167-4:2003 is not applicable to the measurement of pulsating flow. It does not cover the use of Venturi tubes in pipes sized less than 50 mm or more than 1 200 mm,
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Supplier: Bruker Corporation
Description: , WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a
- Applications: Semiconductor Wafers, Other
- Measurement Capability: Defects / ADC, Roughness / Waviness
- Technology: Profilometer / AFM, X-ray Diffractometer
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Supplier: Carl Zeiss Industrial Metrology, LLC
Description: Sensors: Surface sensor SURFCOM 2000 Quickly and precisely measure contours and roughness in one measuring run Sensors: Highly accurate, wide-range hybrid probe for contour and surface measurements Measuring range up to 15 mm
- Display & Special Features: Computer Interface / Networkable, SPC / Software Capability
- Measurement Capability: 3D / Areal Topography, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (Wa,Wt )
- Mounting / Loading: Benchtop
- Standards Compliance: ASME, ISO / EN, DIN, JIS, Other
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Supplier: Carl Zeiss Industrial Metrology, LLC
Description: Topography measurements up to seven times faster than systems with a spindle drive Can be used with numerous sensors: surface, contour, hybrid and white light sensors Topography function or lead twist measurement function quickly upgradeable on site Optional
- Display & Special Features: Computer Interface / Networkable, SPC / Software Capability
- Measurement Capability: 3D / Areal Topography, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (Wa,Wt )
- Mounting / Loading: Benchtop
- Standards Compliance: ASME, ISO / EN, DIN, JIS, Other
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Supplier: Phenom-World BV
Description: image interpretation. Some examples are Fibermetric - automated measurements and classification of fiber and filter samples, 3D Roughness Reconstruction, and Automated Image Mapping - an automated way of collecting high-resolution overview images. A large variety of sample
- Applications: Semiconductor Wafers, CVD / PVD Films, Packaged ICs / Ceramic Substrates
- Area Mapping: Yes
- FIB / Ion Mill: Yes
- Form Factor: Monitor / Instrument
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Supplier: Zygo Corporation
Description: The APM650™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Depth Profiling: Yes
- Form Factor: Monitor / Instrument
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Supplier: Polytec, Inc.
Description: The MSA-500 Micro System Analyzer is the premier measurement technology for the analysis and visualization of structural vibrations and surface topography in micro structures such as MEMS (Micro-Electro-Mecha nical Systems) devices. By fully integrating a microscope with Scanning Laser
- Applications: Other
- Form Factor: Sensor / Sensing Element
- Measurement Capability: Roughness / Waviness, Shape / Flatness, Other
- Mounting / Loading: Manual Loading
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Supplier: Polytec, Inc.
Description: Roughness (Ra) overthe full surface with results comparable to an AFM, but in a fraction of the time. You can achieve repeatablenano and micro waviness measurements when measuring the same target on different machines and the capability to not only find defects, but to classify
- Display & Special Features: Computer Interface / Networkable, SPC / Software Capability, Video / Graphic Display
- Measurement Capability: 3D / Areal Topography, Defects / ADC, Flatness, Runout, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Thickness, Waviness Parameters (Wa,Wt )
- Mounting / Loading: Floor / Free Standing
- Standards Compliance: ASME, ISO / EN
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Supplier: Carl Zeiss Industrial Metrology, LLC
Description: Quickly and precisely measure contours and roughness in one measuring run Sensors: Highly accurate, wide-range hybrid probe for contour and surface measurements Measuring range up to 15 mm SURFCOM 1900 CNC measuring station with
- Display & Special Features: Computer Interface / Networkable, SPC / Software Capability
- Measurement Capability: 2D / Line Profiles, 3D / Areal Topography, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (Wa,Wt )
- Mounting / Loading: Benchtop
- Standards Compliance: ASME, ISO / EN, DIN, JIS, Other
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Supplier: Mahr Inc.
Description: measurements Traversing lengths up to 26 mm Over 50 R , W and P surface parameters Automatic choice of cut-off and traversing length in accordance with standard Dynamic calibration function Cable and Bluetooth connection between drive unit and evaluation instrument (4 m) Magnetic probe
- Display & Special Features: Digital Readout
- Measurement Capability: Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (Wa,Wt )
- Mounting / Loading: Handheld / Portable
- Scan Rate: 0.0079 to 0.0394 in/sec
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Supplier: CSA Group
Description: ISO/TR 22335:2007 describes a method for determining ion-sputtering rates for depth profiling measurements with Auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS) where the specimen is ion-sputtered over a region with an area between 0,4 mm2 and 3
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Supplier: Park Systems, Inc.
Description: Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the
- Application: Semiconductor Inspection
- Digital Display: Yes
- Grade: Benchtop
- Image Analysis Processing Software: Yes
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Supplier: Phenom-World BV
Description: With the 3D Roughness Reconstruction application, the Phenom desktop SEM systems are able to generate three-dimensional images and submicrometer roughness measurements. 3D imaging helps to interpret sample characteristics and makes images understandable for a
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3D optical profilers equipped with Coherence Scanning Interferometry (CSI) and smart software solutions make this process both efficient and reliable. By taking advantage of these tools, manufacturers can confidently control surface quality and ensure their products perform at their best. For more on how Zygo’s optical profilers can meet your specific roughness measurement needs, visit www.zygo.com. (read more)
Browse Surface Profilometers Datasheets for Zygo Corporation -
Many ZYGO metrology instruments rely on interferometry combined with imaging systems to measure surface form, waviness, and roughness. Although these instruments have advanced software that performs data (read more)
Browse Interferometers Datasheets for Zygo Corporation -
WEBINAR: Precise Measurement of Polished Surfaces Precision manufacturing has come a long way in the past several years, with ultra-machining and super-polishing processes routinely creating surfaces with sub-angstrom roughness and topography. In this webinar, ZYGO Applications (read more)
Browse Surface Metrology Equipment Datasheets for Zygo Corporation -
sensor controller and one or more sensor heads. Features: 3kHz sampling rate 04um static repeatability Non-contact measurement One controller can support up to 4 sensor heads simultaneously Perfect for (read more)
Browse Linear Position Sensors Datasheets for Hypersen Technologies Co., Ltd. -
you want to measure. The Nexview NX2 profiler measures topography of virtually any surface from a super polished optical surface with sub-Angstrom surface roughness, to steep machined angles up to 85 degrees. It does all this in 3D, without contact, and provides the best qualities of (read more)
Browse Dimensional and Profile Scanners Datasheets for Zygo Corporation -
. Correlates to 2D and 3D standards, and complies with ISO 25178 surface roughness parameters. High-resolution 1 million pixel image sensor provides fast areal measurements in seconds, for excellent surface detail and visualization. Integrated autofocus and focus aid simplify (read more)
Browse Surface Metrology Equipment Datasheets for Zygo Corporation -
fully automated with encoded travel. Regardless of your configuration, all NewView 9000 systems offer high-accuracy measurements, ease of use, and fast measurements, all at an attractive price point that make it the ideal choice for versatility and value in 3D optical profilers. Some (read more)
Browse Dimensional and Profile Scanners Datasheets for Zygo Corporation -
Repeatability and Reproducibility (R & R) CMS - Coordinate Measurement System CMM- Coordinate Measurement Machines Specializing in: Part Layouts Inspection Reports/Warrants ISW (read more)
Browse Machine Shop Services Datasheets for Protomatic, Inc. -
, and surface roughness. To address these challenges, Marposs offers thickness measurement sensors capable of covering extremely wide ranges, from just a few tens of nanometers up to one millimeter. Our interferometric products stand out for (read more)
Browse Dimensional Gages and Instruments Datasheets for Marposs Corp -
ZeGageTM Pro 3D optical profiler in Brazil due to the government granting the product an import tax reduction. The company’s 3D optical profilers are used to measure height variations — such as surface roughness — on surfaces with exceptional precision using light to (read more)
Browse Metrology Fixtures and CMM Fixtures Datasheets for Zygo Corporation
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ZCP2002HT001
… thermochemically treated samples surfaces have been analysed as to their surface appearance (with a stereoscopic lens 50x magnification and with the scanning electron microscope), their surface roughness (RA, RZ, Rmax, RT and R3Z ) has been determined and the microhardness (100gf load) measured .
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ZCP2005ITSC0399
The Surftest 301 unit provides digital readout of the measuring conditions and results for nine types of roughness parameters including Ra (arithmetic mean deviation of the profile), Rq (RMS deviation of the profile), R3z (mean peak-to-valley height), Rt (maximum peak …
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A comparison of surface roughness of pipes as measured by two profilometers and atomic force microscopy
lm = evaluation length x = distance coordinate along the measurement axis y = distance coordinate perpendicular to the measure- ment axis Ra = arithmetic average roughness Rmax = maximum individual peak-to-valley height … … roughness RZD = mean peak-to-valley height R3Z = arithmetic average of third …
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AMST’05 Advanced Manufacturing Systems and Technology
… diameter of the jet, at 2 mm below the primary nozzle, has been measured , that is at … ^^^ To the aim to make inquiries about the maximum and minimum value on the roughness profile, the parameter R3Z is liked better than Ra because it protects from possible local imperfections of the material or exceptional data.
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Quantitative surface roughness measurements using multivariate data analysis in speckle interferometry
A profile zðxÞ has been acquired over 4 mm of measurement length with the stylus measurement system. In this work, the results for five roughness parameters Rq, Ra, R3z , Rp, and Mr1 are presented exemplarily.
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Effect of grit-blasting on substrate roughness and coating adhesion
The Surftest 301 unit provides digital readout of the measuring conditions and results for a significant number of surface texture parameters including Ra (arithmetic mean deviation of the profile), Rq (RMS deviation of the profile), R3z (mean peak-to-valley height), Rt … Rz was used for the primary roughness measurement since it most closely matches ANSI standard B46.1 …
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Micro-scale mass-transfer variations during electrodeposition
3320 ' 3330 DATA Mode,Cutoff, Magnification,Assessed, Measurement ,Run,Rti,Rpi 3340 DATA Rvi,Ra,Rq,Ry,Rt,Rtm,Rv,Rp,Sm,LamQ,DelQ,Rsk,Rku,S, R3z ,Rz 3350 DATA Rpm,Rvm,R3y,Wa,Wq,Wt,Wc,Wp,HSCa,HSCb … 3470 ' 3480 DATA " Roughness ISO", "Roughness PC", "Waviness PC", "Unfiltered" 3490 DATA WAVINESS ISO,Roughness …
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Preliminary study in the evaluation of anti‐aging cosmetic treatment using two complementary methods for assessing skin surface
R2/ R3z Average roughness estimated form several measurements .
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Understanding Surface Texture Parameters
Among the largest set of parameters, roughness parameters include Swedish height (H), areal flatness deviation (ISO flatness), total peak-to-valley profile height (Pt ISO), base roughness depth (R3z), base roughness profile depth ( R3z ISO), arithmetical mean deviation (Ra), Kurtosis (Rku),maximum … … peak-to-valley areal roughness (SRz ISO), the average of individual Rz results, measured by slicing the …
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Textbook of Aging Skin
After the treatment period, the differences between active and placebo for Rzmax, R3z , and RzISO were statistically … The differ- ences between active and placebo for Ra, (Although the average roughness Ra is one of the most frequently used parameters in surface measurement , this parameter does not inform about all aspects of the surface.