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  • Effect of color pigments on the hardness of thermoplastics at different temperatures
    the electronic components inside meet demanding specifications, the housings of switches and fuses should also resist varied environmental factors such as. moisture, UV radiation and heat/cold. To ensure long service life and proper insulation of the electronics encased therein, it is necessary to monitor
  • Tracking the performance of photolithographic processes with excursion monitoring
    photocluster performance is vital, and the individual tools are typically monitored by means of numerous tool checks (inspection procedures designed to evaluate specific components of the process). Examples include resist-film-thickness and hot-plate temperature uniformity measurements on the track
  • MICRO:Facilities Technologies by Oleg P. Kishkovich p.61 (June '99)
    Wafers are susceptible to molecular base contamination from the moment resist is coated until the postexposure bake step. Elevated concentrations of molecular bases cause image degradation (for example, T-topping), reduce production output, and necessitate wafer rework, as depicted in Figures 1
  • Miniature Linear Encoders
    The Aspen III eHighlands dry strip system handles critical front-end-of-line (FEOL) and back-end-of-line (BEOL) process applications, including photo-resist strip over low-k materials. Available in 200- and 300-mm versions, the tool helps chipmakers overcome the integration challenges associated
  • MICRO:
    as European distributor Japanese firm orders Entegris FOUPs; 300-mm wafer toolmakers to see eightfold jump in revenues; FEI inspection tools installed at pilot facility; electronics manufacturer buys Axcelis dry resist removal tools Electronica 2000, Semicon Japan, and more Corning to focus on ULE glass

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