Products & Services
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview STAYCHIP F614-3A is a thermosetting adhesive with electrical insulating properties. It is designed for attaching or sealing high-reliability semiconductor packages and electronic assemblies, with the capability to attach a metal can or lid onto a package. STAYCHIP
- Features: Electrical Insulation / Dielectric Material, Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics, Semiconductors / IC Packaging
- Cure / Technology: Thermosetting / Crosslinking
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Description: Deepmaterial provide customized adhesive services on your demand, custom electronic adhesives, PUR structural adhesive, UV moisture curing adhesive, epoxy adhesive, conductive silver glue, epoxy underfill adhesive, epoxy encapsulant, functional protective
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Supplier: MacDermid Alpha Electronics Solutions
Description: Structural adhesive for additional bonding of components to flexible and formable circuit tracks. Product Overview XtraForm A9000 is a structural adhesive designed for use with polyethylene terephthalate (PET) and polycarbonate (PC) films to attach active and passive components for
- Features: Electrically Conductive
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ALPHA HiTech SM42-120P is suitable for both screen printing and dispensing applications. It is the primary product recommended for customers requiring a screen-printable adhesive.
- Industry: Electronics, Semiconductors / IC Packaging
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Description: production costs and waste. It is suitable for automatic adhesive dispensing, has a good adhesive output speed, and improves the production cycle.
- Features: Electrically Conductive, Specialty / Other
- Chemical System: Epoxy (EP), Silicone
- Industry: Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and higher or lower viscosities.Passes NASA outgassing requirements.
- Viscosity: 40,000 cP
- Use Temperature: -55 to 140 F
- Tensile Strength (Break): 4,500 psi
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Protavic America, Inc.
Description: PVIC ACE34033 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb rheology allows minimum
- Viscosity: 8,500 cP
- Thermal Conductivity: 9.23 W/m-K
- Use: Die Bonding Adhesive / Compound
- Industry: Electrical Power / HV, Electronics, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and
- Viscosity: 5,000 cP
- Use Temperature: -55 to 120 F
- Tensile Strength (Break): 2,000 psi
- Dielectric Constant (Relative Permittivity): 4.41 to 4.63
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Supplier: Saint-Gobain Tape Solutions
Description: CHR K100 is manufactured from polyimide film with high-temperature silicone adhesive on both sides. CHR K100 has excellent mechanical and electrical properties. Applications: Electronic assembly Electrical insulation applications Used in high voltage insulation
- Thickness: 0.004488188976377953 inches
- Temperature Resistance: -73 C
- Features: Electrical, Electronics (PCB, Semiconductor), Single-Sided Adhesive
- Backing: Polyimide (e.g., Kapton®)
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Supplier: Protavic America, Inc.
Description: ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing
- Viscosity: 200 cP
- Use Temperature: -40 to 347 F
- Dielectric Constant (Relative Permittivity): 4.3
- Water Absorption: 1 %
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Supplier: Saint-Gobain Tape Solutions
Description: h-old P.3410/LINER is a 23 micron polyester film coated with a high quality acrylic adhesive and protected by clear polyester liner. P.3410 is regularly used as cover tape during packing operations of electronic components & semiconductor devices in Tape-and-Real configurations.
- Thickness: 0.002362204724409449 inches
- Temperature Resistance: -40 C
- Adhesive: Acrylic
- Features: Electrically Conductive, Electronics (PCB, Semiconductor), Single-Sided Adhesive
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview STAYSTIK 581 is a thermoplastic adhesive designed for a variety of electronic applications, offering excellent bonding performance. It is well suited for substrate attachment in hybrid or Multi-Chip Modules (MCMs). Its reworkable formulation provides key advantages in
- Industry: Electronics, Semiconductors / IC Packaging
- Form / Shape: Film / Sheet
- Cure / Technology: Thermoplastic / Hot Melt, Thermosetting / Crosslinking
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical,
- Viscosity: 1,800 to 3,600 cP
- Use Temperature: 572 F
- Thermal Conductivity: 12.6 to 26.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 21.11111111111111 to 52.22222222222222 µin/in-F
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Description: We offer a complete line of insulation Tapes for use in producing Flat Flexible Cables (FFC's) and a broad range of adhesive types that allow users to balance final product performance with lamination processes. Applications include clock spring cables, jumpers, and any application requiring
- Thickness: 0.001 to 0.002 inches
- Peel Strength / Adhesion: 8 lbs/in
- Features: Dielectric / Insulating, Electronics (PCB, Semiconductor), Specialty / Other
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Description: Flame Retardant Modified Acrylic Unsupported Bonding Adhesive Description T1649 Bus Bond® free film adhesive uses our proprietary flame retardant, RoHS compliant, high temperature, modified acrylic adhesive on a carrier with a release liner, creating an isolated adhesive
- Width: 24 inches
- Thickness: 0.0005 to 0.002 inches
- Peel Strength / Adhesion: 10 to 11 lbs/in
- Dielectric Strength: 78,740,157.4803148 V/m
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21D is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
- Elongation: 5 %
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Supplier: Metalor Technologies USA Corporation
Description: Electrically and thermally conductive adhesives for microelectronic applications Working in partnership with valued customers, we have carried out extensive development programmes to customize silver flakes and powders to suit many electronic applications. We are acknowledged as a leading
- Features: Electrically Conductive, Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK QMI2569, Silver Glass, Semiconductor, Conductive Adhesive LOCTITE® ABLESTIK QMI2569 is a silver glass die attach adhesive used for attachment of integrated circuits in both solder seal glass seal hermetic packages. The material allows for simultaneous processing
- Viscosity: 35,800 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST OS 8300, two components - requires mixing, epoxy LOCTITE STYCAST OS 8300 is a two-component adhesive formulated to enhance productivity in the assembly of semiconductor, optical, fiber optic, and optoelectronic devices. High spectral transmission Excellent adhesion Low
- Chemical System: Epoxy (EP)
- Industry: Optical Grade / Material
- Cure / Technology: Two Component System
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10 minutes,
- Viscosity: 8,000 to 10,000 cP
- Use Temperature: -80 to 400 F
- Features: Aerospace, Anti-static / ESD Control, Automotive, Ceramic / Glass, Composites, EMI / RFI Shielding Material, Electrical Insulating / Dielectric, Electrically Conductive, Gap Filling Sealant / FIP Gasket, Marine, Metal, OEM / Industrial, Other, Plastic, Porous Surfaces, Rubber / Elastomer, Specialty
- Use: Die Bonding Adhesive / Compound
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical,
- Viscosity: 3,500 to 6,000 cP
- Use Temperature: 527 F
- Thermal Conductivity: 10.9 to 23 W/m-K
- Coeff. of Thermal Expansion (CTE): 29.444444444444443 to 44.44444444444444 µin/in-F
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Description: It is a single component, high-end adhesive with dual curing mechanism, specially designed for the optical device industry, typical applications include PLC packaging, semiconductor laser packaging, collimator lens bonding, filter bonding, optical detector lens and fiber bonding,
- Cure / Technology: Thermoplastic / Hot Melt, UV / Radiation Cured (EB, Light)
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Supplier: Epoxy Technology
Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs. More recently, solar cells require our UV curing resin
- Viscosity: 350 to 550 cP
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 21.666666666666668 to 97.22222222222221 µin/in-F
- Dielectric Constant (Relative Permittivity): 3.74
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical,
- Viscosity: 2,200 to 3,200 cP
- Use Temperature: 572 F
- Thermal Conductivity: 2.5 to 29 W/m-K
- Coeff. of Thermal Expansion (CTE): 17.22222222222222 to 87.77777777777777 µin/in-F
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP126 is a two component toughened epoxy resin based high temperature resistant adhesive system with continuous service capability at 500°F and outstanding chemical resistance. This unique high performance epoxy adhesive compound can also withstand
- Tensile Strength (Break): 2,200 psi
- Features: Aerospace, Automotive, Ceramic / Glass, Composites, Dissimilar Substrates, Flame Retardant (e.g. UL 94 Rated), Marine, Metal, Non-corrosive Cure, OEM / Industrial, Other, Plastic, Specialty / Other, Tooling / Mold Material
- Industry: Electrical Power / HV, Electronics, Semiconductors / IC Packaging
- Chemical System: Epoxy (EP)
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ABP 8068TB, Silver-filled, Semi-sintering, Semiconductor, Conductive adhesive LOCTITE® ABLESTIK ABP 8068TB is a silver-filled semi-sintering die attach adhesive designed for semiconductor packages with high thermal and electrical requirements. It is
- Viscosity: 11,500 cP
- Coeff. of Thermal Expansion (CTE): 13.88888888888889 µin/in-F
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Supplier: Accuris
Description: Semiconductor devices - Microelectromechanical devices Part 13: Bend - and shear - type test methods of measuring adhesive strenght for MEMS structures
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Supplier: Master Bond, Inc.
Description: Presently available adhesives for temporary bonding such as waxes, hot melts, and various solvent compositions lack heat resistance, strength, dimensional stability and are difficult to remove without surface contamination. Master Bond's newly developed MB600 adhesive provides an
- Viscosity: 400 to 420 cP
- Features: Aerospace, Automotive, Ceramic / Glass, Composites, Marine, Metal, OEM / Industrial, Other, Plastic, Rubber / Elastomer, Tooling / Mold Material
- Industry: Electrical Power / HV, Electronics, Semiconductors / IC Packaging
- Form / Shape: Liquid
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Supplier: Allied Electronics, Inc.
Description: Thermalbond™ is a thermally conductive, high strength epoxy adhesive. Green in color, it provides exceptional adhesion to copper, aluminum, steel, glass, ceramics and most plastics. Thermalbond™ also has a coefficient of thermal expansion compatible with aluminum, copper and brass, making it
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Supplier: CSA Group
Description: ISO 16525-1:2014 specifies general test methods for isotropic electrically conductive adhesives used in wiring, die attach of semiconductors, and surface assembly of printed circuit boards.
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Supplier: Adhesive Applications
Description: ACT20 is an unsupported solvent acrylic transfer PSA that conducts electricity anisotropically through the adhesive thickness. This adhesive system offers good quick stick and shear properties with extremely low electrical resistance. Z-axis conductivity Conformable and flexible
- Thickness: 0.002 inches
- Peel Strength / Adhesion: 4.0625 lbs/in
- Temperature Resistance: -40 to 121.11111111111111 C
- Adhesive: Acrylic, Pressure Sensitive (PSA), Transfer
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Supplier: Adhesive Applications
Description: adhesive residue. Excellent chemical resistance Fine line definition Clean removal / no adhesive residue Good conformability Maximum Service Temperature 350°F (177°C) Minimum Service Temperature -60°F (-51°C) Peel Adhesion 35 oz/in (9.72 N/25mm) Product Thickness (Total) 3.50 mils
- Thickness: 0.0035 inches
- Peel Strength / Adhesion: 2.1875 lbs/in
- Temperature Resistance: -51.11111111111111 to 176.66666666666666 C
- Features: Electronics (PCB, Semiconductor), Removable
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Supplier: Accuris
Description: Semiconductor devices - Micro-electromechanical devices - Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
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Mitsui Chemicals' ICROS™ TAPE is a surface protective tape used in silicon wafer-back-grinding processes in semiconductor manufacturing for the manufacturer of integrated circuits. ICROS Tape can be processed using a "no rinse" process, which is shorter than (read more)
Browse Adhesive Tapes Datasheets for Mitsui Chemicals America, Inc. -
High-precision adhesive dispensing processes SUNTECH remains dedicated to delivering high-quality, application-optimized dispensing solutions that meet the evolving demands of the semiconductor industry. For technical specifications or customization inquiries, please contact SUNTECH. (read more)
Browse Semiconductor Wire and Wedge Bonders Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
Suntech specializes in the design and manufacture of high-precision dispensing nozzles tailored for the die bonding process in semiconductor packaging. These nozzles are engineered to deliver consistent and accurate adhesive dispensing, directly enhancing bonding (read more)
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adhesives, demands extremely flat and smooth surfaces, and AIN substrates deliver on these fronts. Aluminum Nitride Wafer Substrates are indispensable in the modern semiconductor industry, offering a combination of thermal conductivity, electrical insulation, and mechanical strength that few (read more)
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for sterile gas filtration, vent filtration, and aggressive chemical applications. Hydrophilic PTFE membrane options are also available for high-purity liquid filtration. Manufactured using thermal bonding technology without adhesives or surfactants, the (read more)
Browse Filter Elements Datasheets for Harbory Filtration -
. This core technical advantage enables stable, high-precision micron and submicron-level measurement for various difficult-to-test transparent scenarios, including glass warpage and gap detection, adhesive glue thickness and overflow inspection, optical film multi (read more)
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Electroluminescent Backlighting Electroluminescence is a Solid State phenomenon in which semiconductor crystals, known as phosphors, convert electrical energy directly into (read more)
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ESPEC North America Inc | Qualmark Products and Services
HAST - Highly Accelerated Stress Test Chambers
HAST (Highly Accelerated Stress Test) chambers reduce the time it takes to complete humidity testing for semiconductors. By elevating temperatures above 100°C and increasing the pressure, simulation of normal humidity tests can be made while maintaining the same failure mechanisms. Tests can (read more)
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The new confocalDT IFS2407-xHT/VAC high-temperature sensor is the first optical sensor in Micro-Epsilon's portfolio that can withstand high temperatures up to 200 °C. By dispensing with organic adhesives, the stainless steel high-temperature sensors are low-outgassing and therefore (read more)
Browse Photoelectric Sensors Datasheets for Micro-Epsilon Group -
OPTMC series pleated filter cartridge is made of imported modified hydrophobic polytetrafluoroethylene filter membrane through advanced hot melt sealing technology under the associated controlled clean environment without any adhesives or surfactants. The modified hydrophobic PTFE filter (read more)
Browse Filter Elements Datasheets for Harbory Filtration
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Things To Remember When Buying An Electronic Assembly Adhesive Glue And PCB Assembly Materials
on waste in industries like PCB, electronic assembly, and OEM. Deep Material offers different adhesive types, including semiconductor adhesives, die attachments, conformal coatings, surface mount adhesives, and underfill encapsulates.
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DeepMaterial Adhesive Solutions for Industrial
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Hybrid Microelectronic Semiconductor Die Attached Adhesives and Encapsulants in Innovation
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Do We Still Need SMT Adhesives?
SMT Adhesives are used in the semiconductor industry to bond films and other materials to substrates. This article will discuss what SMT adhesives are, their importance in the electronics industry, how they are made, and whether another technology can replace them.
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Die Attach Adhesives Impact Product Quality Well Beyond Manufacturing
Die attach adhesives serve a critical role in semiconductor assembly and throughout the product lifecycle. Beyond their ability to form a tight bond between die and various substrates, these adhesives...
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Tech Tip 22 - Using Mold Release Agents with Epoxy Adhesives
Epoxy adhesives are universally known for their high strength and toughness in bonding a wide variety of substrates found in semiconductor and electronics assembly. Although an epoxy's inherent nature is to provide a strong bond, there may be some areas where. adhesion is unwanted or unintended
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Best electronics assembly adhesives sealants glue with RFID bonding for semiconductor and microchip manufacturers
Electronic innovations are everywhere and, in every facet, of life. Today, everything is inspired by technology, and things keep getting better and better with time. We now have driver-assisted systems, electric and hybrid cars, smartphones, augmented reality headsets, on-screen entertainment,
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Case In India: Adhesives For Smart Phone And Mobile Devices Assembly
The Indian government has intensified its push for Made in India products. And one of the major sectors pushing this campaign ahead is the tech sector with smartphones and semiconductors taking the charge. In a bid to ramp up its efforts, the government is also offering companies subsidies
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Dielectric Coating Thermal Stabilization During GaAs-Based Laser Fabrication for Improved Device Yield
Based on the results of process observations and experiments, a dielectric-coating thermal-anneal procedure was developed, contributing to greatly improved metal– dielectric– semiconductor adhesion and device yield.
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Adhesives, Sealants, and Coatings for Semiconductor Assembly Applications by Master Bond
Applications of Master Bond’s Semiconductor Adhesives .
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Development of pick-and-place assembly techniques for monolithic optopill integration
This last observation is not unexpected considering the optopill metal-to- semiconductor adhesion issues discussed earlier in Section 5.5..
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Abstract listings
Freescale Semiconductor Adhesion performance between silicon die back and paste is one of major concerns in die attach process during semiconductor assembly.
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Handbook of Adhesion 2nd Edition Complete Document
In this device, small particles of semiconductor adhere to a plate that has been selectivity discharged by exposing it to light.4 .
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Control system for glassing hot presses
The combination of these three parameters must be precisely controlled to obtain glass- semiconductor adherence , to avoid cracking of semiconductor elements, and to obtain proper glass thickness.
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Characteristics of He + ‐irradiated Ni Schottky diodes based on 4H‐SiC epilayer grown by sublimation
Both, results of the capacitance-voltage characterisa- tion and direct observation of SDs by electron microscope do not support hypothesis of decreasing of SD’s area as a result of irradiation leading to deterioration metal to semi- conductor adhesion .
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Molecular Self‐Assembled Monolayers and Multilayers for Organic and Unconventional Inorganic Thin‐Film Transistor Applications
…surface dipoles, the insulating nature of semiconductor side chains, or physical delamination/dewetting.[221] Therefore, a major potential enhancement of SAMs in bottom contact TFTs is the possibility of reducing contact resistances by enhancing the semicon- ductor adhesion and growth orientation relative…