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Description: Deepmaterial provide customized adhesive services on your demand, custom electronic adhesives, PUR structural adhesive, UV moisture curing adhesive, epoxy adhesive, conductive silver glue, epoxy underfill adhesive, epoxy encapsulant, functional protective
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 10 to 41.67 µin/in-F
- Dielectric Constant (Relative Permittivity): 4.5 to 5.5
- Dielectric Strength: Over 381 kV/in
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. Its good fluidity enables it to flow at 20°C into cavities about 1 mm in width. The glass transition temperature is over 150°C, which helps to improve the
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 9.44 to 36.11 µin/in-F
- Dielectric Constant (Relative Permittivity): 4.5 to 5.5
- Dielectric Strength: Over 381 kV/in
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Description: Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive
- Industry: Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and higher or lower viscosities.Passes NASA outgassing requirements.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Flexible / Dampening
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Description: Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire drawing problems, greatly saving production costs and waste. It is suitable for automatic adhesive dispensing, with excellent
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive
- Industry: Semiconductors / IC Packaging
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Description: Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive
- Industry: Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include automotive,
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Dielectric Constant (Relative Permittivity): 4.7 to 4.8
- Dielectric Strength: 635 kV/in
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Supplier: MacDermid Alpha Electronics Solutions
Description: Structural adhesive for additional bonding of components to flexible and formable circuit tracks. Product Overview XtraForm A9000 is a structural adhesive designed for use with polyethylene terephthalate (PET) and polycarbonate (PC) films to attach active and passive components for
- Features: Electrically Conductive
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: MacDermid Alpha Electronics Solutions
Description: Premium adhesive for garment and textile screen printing, used to secure the substrate onto the platen when printing. Product Overview Low Tack Platen Adhesive is a premium water-based adhesive for textile printers, capable of holding over 500 garments between applications. To
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Epoxy Technology
Description: used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 21.11 to 52.22 µin/in-F
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
- Filled / Reinforced: Yes
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Supplier: Epoxy Technology
Description: used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 29.44 to 44.44 µin/in-F
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
- Filled / Reinforced: Yes
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Supplier: Epoxy Technology
Description: used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.22 to 87.78 µin/in-F
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material
- Filled / Reinforced: Yes
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Supplier: Epoxy Technology
Description: used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22.78 to 90 µin/in-F
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
- Filled / Reinforced: Yes
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Supplier: Richardson RFPD
Description: DeltaBond™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies which require high
- Features: Thermal / Heat Conductive
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Supplier: Richardson RFPD
Description: DeltaBond™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies which require high
- Features: Thermal / Heat Conductive
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Supplier: Richardson RFPD
Description: DeltaBond™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies which require high
- Features: Thermal / Heat Conductive
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK QMI2569, Silver Glass, Semiconductor, Conductive Adhesive LOCTITE® ABLESTIK QMI2569 is a silver glass die attach adhesive used for attachment of integrated circuits in both solder seal glass seal hermetic packages. The material allows for simultaneous processing
- Viscosity: 35800 cP
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Supplier: MacDermid Alpha Electronics Solutions
Description: A one-component, fast-curing surface mount adhesive, specifically designed for screen printing. Product Overview ALPHA HiTech SM42-120P is suitable for both screen printing and dispensing applications. It is the primary product recommended for customers requiring a screen-printable
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Henkel Corporation - Industrial
Description: dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry. Conductive Box oven cure Excellent dispensability, minimal
- Coeff. of Thermal Expansion (CTE): 22.22 µin/in-F
- Thermal Conductivity: 2.5 W/m-K
- Viscosity: 8000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK NCA 3710H, High Viscosity, Epoxy, Semiconductor, Non-conductive adhesive LOCTITE® ABLESTIK NCA 3710H high viscosity epoxy adhesive is designed for use in camera module applications. It is formulated to cure rapidly when exposed to the appropriate intensity of UV
- Features: Electrically Insulating / Dielectric
- Viscosity: 8700 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST OS 8300, two components - requires mixing, epoxy LOCTITE STYCAST OS 8300 is a two-component adhesive formulated to enhance productivity in the assembly of semiconductor, optical, fiber optic, and optoelectronic devices. High spectral transmission Excellent adhesion
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Industry: Optical Grade / Material
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Supplier: MacDermid Alpha Electronics Solutions
Description: when tested on camera module housing and LCP-magnet drop impact tests. This adhesive also offers excellent adhesion on Nylon (PA9T) and metal substrates, bonding effectively with Liquid Crystal Polymer (LCP) and Polycarbonate surfaces.
- Industry: Electronics, Semiconductors / IC Packaging
- Substrate / Material Compatibility: Metal, Plastic, Other
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10 minutes,
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Anti-static / ESD Control, Electrically Conductive Compound (Adhesive, Grease), Electrical Insulation / Dielectric Material, EMI / RFI Shielding Material
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP126 is a two component toughened epoxy resin based high temperature resistant adhesive system with continuous service capability at 500°F and outstanding chemical resistance. This unique high performance epoxy adhesive compound can also withstand
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Features: Flame Retardant (e.g. UL 94 Rated), Non-corrosive Cure
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
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Supplier: Metalor Technologies USA Corporation
Description: Electrically and thermally conductive adhesives for microelectronic applications Working in partnership with valued customers, we have carried out extensive development programmes to customize silver flakes and powders to suit many electronic applications. We are acknowledged as a leading
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics
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Description: We offer a complete line of insulation Tapes for use in producing Flat Flexible Cables (FFC's) and a broad range of adhesive types that allow users to balance final product performance with lamination processes. Applications include clock spring cables, jumpers, and any application requiring
- Adhesive: Specialty / Other
- Backing: Specialty / Other
- Peel Strength / Adhesion: 8 lbs/in
- Performance Features: Dielectric / Insulating
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Anti-static / ESD Control, Electrically Conductive Compound (Adhesive, Grease), Electrical Insulation / Dielectric Material, EMI / RFI Shielding Material
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Anti-static / ESD Control, Electrically Conductive Compound (Adhesive, Grease), Electrical Insulation / Dielectric Material, EMI / RFI Shielding Material
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 3-6752 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used to cool electronic applications and bond with metals, ceramics, filled plastics, epoxy laminates, and organic substrates. It is flame resistant, self leveling, flowable, thixotropic,
- Cure Type / Technology: Single Component System
- Dielectric Strength: 400 kV/in
- Elongation: 15 %
- Features: Thermal / Heat Conductive
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 3-6752 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used to cool electronic applications and bond with metals, ceramics, filled plastics, epoxy laminates, and organic substrates. It is flame resistant, self leveling, flowable, thixotropic,
- Cure Type / Technology: Single Component System
- Dielectric Strength: 400 kV/in
- Elongation: 15 %
- Features: Thermal / Heat Conductive
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Description: Flame Retardant Modified Acrylic Unsupported Bonding Adhesive Description T1649 Bus Bond® free film adhesive uses our proprietary flame retardant, RoHS compliant, high temperature, modified acrylic adhesive on a carrier with a release liner, creating an isolated
- Adhesive: Acrylic, Specialty / Other
- Backing: Specialty / Other
- Dielectric Strength: 7.87E7 V/m
- Features: Abrasion / Scratch Resistant, Dielectric / Insulating, UV / Weather Resistant, Other
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Supplier: Saint-Gobain Tape Solutions
Description: h-old P.3410/LINER is a 23 micron polyester film coated with a high quality acrylic adhesive and protected by clear polyester liner. P.3410 is regularly used as cover tape during packing operations of electronic components & semiconductor devices in Tape-and-Real configurations
- Adhesive: Acrylic
- Backing: PET / Polyester
- Features: Electrically Conductive
- Temperature Resistance: -40 C
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Supplier: Saint-Gobain Tape Solutions
Description: h-old 8102 is a 12 micron polyester film coated on both side with a solvent based acrylic adhesive system and protected by white siliconized release paper liner. Can be used for splicing, bonding and laminating foams, papers, plastics, films, foils, for mounting of nameplates, electronic
- Adhesive: Acrylic
- Backing: PET / Polyester
- Temperature Resistance: -30 C
- Thickness: 0.0037 inches
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Supplier: Adhesive Applications
Description: -temperature masking applications. High temperature resistant Clean removal / no adhesive residue Chemical and abrasion-resistant Good conformability Meets ASTM D5213 Type 1 item A Maximum Service Temperature 500°F (260°C) Minimum
- Adhesive: Silicone
- Backing: Polyimide (e.g., Kapton®)
- Features: Abrasion / Scratch Resistant, Dielectric / Insulating, Removable
- Peel Strength / Adhesion: 1.62 lbs/in
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Mitsui Chemicals' ICROS™ TAPE is a surface protective tape used in silicon wafer-back-grinding processes in semiconductor manufacturing for the manufacturer of integrated circuits. ICROS Tape can be processed using a "no rinse" process, which is shorter than (read more)
Browse Adhesive Tapes Datasheets for Mitsui Chemicals America, Inc. -
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Suntech specializes in the design and manufacture of high-precision dispensing nozzles tailored for the die bonding process in semiconductor packaging. These nozzles are engineered to deliver consistent and accurate adhesive dispensing, directly enhancing bonding (read more)
Browse Nozzles Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
adhesives, demands extremely flat and smooth surfaces, and AIN substrates deliver on these fronts. Aluminum Nitride Wafer Substrates are indispensable in the modern semiconductor industry, offering a combination of thermal conductivity, electrical insulation, and mechanical strength that few (read more)
Browse Specialty Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
. This core technical advantage enables stable, high-precision micron and submicron-level measurement for various difficult-to-test transparent scenarios, including glass warpage and gap detection, adhesive glue thickness and overflow inspection, optical film multi (read more)
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Electroluminescent Backlighting Electroluminescence is a Solid State phenomenon in which semiconductor crystals, known as phosphors, convert electrical energy directly into (read more)
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ESPEC North America Inc | Qualmark Products and Services
HAST - Highly Accelerated Stress Test Chambers
HAST (Highly Accelerated Stress Test) chambers reduce the time it takes to complete humidity testing for semiconductors. By elevating temperatures above 100°C and increasing the pressure, simulation of normal humidity tests can be made while maintaining the same failure mechanisms. Tests can (read more)
Browse Environmental Test Chambers and Rooms Datasheets for ESPEC North America Inc | Qualmark Products and Services -
The new confocalDT IFS2407-xHT/VAC high-temperature sensor is the first optical sensor in Micro-Epsilon's portfolio that can withstand high temperatures up to 200 °C. By dispensing with organic adhesives, the stainless steel high-temperature sensors are low-outgassing and therefore (read more)
Browse Photoelectric Sensors Datasheets for Micro-Epsilon Group -
NY66MC pleated filter cartridge is made of natural hydrophilic nylon membrane with high porosity through advanced hot melt sealing technology under the associated controlled clean environment, without any adhesives or surfactants. Material Composition (read more)
Browse Filter Elements Datasheets for Harbory Filtration -
OPTMC series pleated filter cartridge is made of imported modified hydrophobic polytetrafluoroethylene filter membrane through advanced hot melt sealing technology under the associated controlled clean environment without any adhesives or surfactants. The modified hydrophobic PTFE filter (read more)
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Conduct Research Top
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Things To Remember When Buying An Electronic Assembly Adhesive Glue And PCB Assembly Materials
on waste in industries like PCB, electronic assembly, and OEM. Deep Material offers different adhesive types, including semiconductor adhesives, die attachments, conformal coatings, surface mount adhesives, and underfill encapsulates.
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DeepMaterial Adhesive Solutions for Industrial
Based on the core technology of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhesives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials
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Hybrid Microelectronic Semiconductor Die Attached Adhesives and Encapsulants in Innovation
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Do We Still Need SMT Adhesives?
SMT Adhesives are used in the semiconductor industry to bond films and other materials to substrates. This article will discuss what SMT adhesives are, their importance in the electronics industry, how they are made, and whether another technology can replace them.
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Die Attach Adhesives Impact Product Quality Well Beyond Manufacturing
Die attach adhesives serve a critical role in semiconductor assembly and throughout the product lifecycle. Beyond their ability to form a tight bond between die and various substrates, these adhesives...
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Tech Tip 22 - Using Mold Release Agents with Epoxy Adhesives
Epoxy adhesives are universally known for their high strength and toughness in bonding a wide variety of substrates found in semiconductor and electronics assembly. Although an epoxy's inherent nature is to provide a strong bond, there may be some areas where. adhesion is unwanted or unintended
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Best electronics assembly adhesives sealants glue with RFID bonding for semiconductor and microchip manufacturers
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Case In India: Adhesives For Smart Phone And Mobile Devices Assembly
The Indian government has intensified its push for Made in India products. And one of the major sectors pushing this campaign ahead is the tech sector with smartphones and semiconductors taking the charge. In a bid to ramp up its efforts, the government is also offering companies subsidies
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Dielectric Coating Thermal Stabilization During GaAs-Based Laser Fabrication for Improved Device Yield
Based on the results of process observations and experiments, a dielectric-coating thermal-anneal procedure was developed, contributing to greatly improved metal– dielectric– semiconductor adhesion and device yield.
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Adhesives, Sealants, and Coatings for Semiconductor Assembly Applications by Master Bond
Applications of Master Bond’s Semiconductor Adhesives .
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Development of pick-and-place assembly techniques for monolithic optopill integration
This last observation is not unexpected considering the optopill metal-to- semiconductor adhesion issues discussed earlier in Section 5.5..
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Abstract listings
Freescale Semiconductor Adhesion performance between silicon die back and paste is one of major concerns in die attach process during semiconductor assembly.
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Handbook of Adhesion 2nd Edition Complete Document
In this device, small particles of semiconductor adhere to a plate that has been selectivity discharged by exposing it to light.4 .
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Control system for glassing hot presses
The combination of these three parameters must be precisely controlled to obtain glass- semiconductor adherence , to avoid cracking of semiconductor elements, and to obtain proper glass thickness.
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Characteristics of He + ‐irradiated Ni Schottky diodes based on 4H‐SiC epilayer grown by sublimation
Both, results of the capacitance-voltage characterisa- tion and direct observation of SDs by electron microscope do not support hypothesis of decreasing of SD’s area as a result of irradiation leading to deterioration metal to semi- conductor adhesion .
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Molecular Self‐Assembled Monolayers and Multilayers for Organic and Unconventional Inorganic Thin‐Film Transistor Applications
…surface dipoles, the insulating nature of semiconductor side chains, or physical delamination/dewetting.[221] Therefore, a major potential enhancement of SAMs in bottom contact TFTs is the possibility of reducing contact resistances by enhancing the semicon- ductor adhesion and growth orientation relative…