Semiconductor Adhesives

Description: Deepmaterial provide customized adhesive services on your demand, custom electronic adhesives, PUR structural adhesive, UV moisture curing adhesive, epoxy adhesive, conductive silver glue, epoxy underfill adhesive, epoxy encapsulant, functional protective

Description: Structural adhesive for additional bonding of components to flexible and formable circuit tracks. Product Overview XtraForm A9000 is a structural adhesive designed for use with polyethylene terephthalate (PET) and polycarbonate (PC) films to attach active and passive components for

• Features: Electrically Conductive
• Industry: Electronics, Semiconductors / IC Packaging

Description: Premium adhesive for garment and textile screen printing, used to secure the substrate onto the platen when printing. Product Overview Low Tack Platen Adhesive is a premium water-based adhesive for textile printers, capable of holding over 500 garments between applications. To

• Industry: Electronics, Semiconductors / IC Packaging

Description: Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive

• Features: Electrically Conductive, Specialty / Other
• Chemical System: Epoxy (EP), Silicone
• Industry: Semiconductors / IC Packaging

Description: PVIC ACE34033 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb rheology allows minimum

• Viscosity: 8,500 cP
• Thermal Conductivity: 9.23 W/m-K
• Use: Die Bonding Adhesive / Compound
• Industry: Electrical Power / HV, Electronics, Semiconductors / IC Packaging

Description: Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and higher or lower viscosities.Passes NASA outgassing requirements.

• Viscosity: 40,000 cP
• Use Temperature: -55 to 140 F
• Tensile Strength (Break): 4,500 psi
• Dielectric Constant (Relative Permittivity): 4.3

Description: ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing

• Viscosity: 200 cP
• Use Temperature: -40 to 347 F
• Dielectric Constant (Relative Permittivity): 4.3
• Water Absorption: 1 %

Description: h-old P.3410/LINER is a 23 micron polyester film coated with a high quality acrylic adhesive and protected by clear polyester liner. P.3410 is regularly used as cover tape during packing operations of electronic components & semiconductor devices in Tape-and-Real configurations.

• Thickness: 0.002362204724409449 inches
• Temperature Resistance: -40 C
• Adhesive: Acrylic
• Features: Electrically Conductive, Electronics (PCB, Semiconductor), Single-Sided Adhesive

Description: PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and

• Viscosity: 5,000 cP
• Use Temperature: -55 to 120 F
• Tensile Strength (Break): 2,000 psi
• Dielectric Constant (Relative Permittivity): 4.41 to 4.63

Description: CHR K100 is manufactured from polyimide film with high-temperature silicone adhesive on both sides. CHR K100 has excellent mechanical and electrical properties. Applications: Electronic assembly Electrical insulation applications Used in high voltage insulation

• Thickness: 0.004488188976377953 inches
• Temperature Resistance: -73 C
• Features: Electrical, Electronics (PCB, Semiconductor), Single-Sided Adhesive
• Backing: Polyimide (e.g., Kapton^®)

Description: A one-component, fast-curing surface mount adhesive, specifically designed for screen printing. Product Overview ALPHA HiTech SM42-120P is suitable for both screen printing and dispensing applications. It is the primary product recommended for customers requiring a screen-printable

• Industry: Electronics, Semiconductors / IC Packaging

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical,

• Viscosity: 1,800 to 3,600 cP
• Use Temperature: 572 F
• Thermal Conductivity: 12.6 to 26.3 W/m-K
• Coeff. of Thermal Expansion (CTE): 21.11111111111111 to 52.22222222222222 µin/in-F

Description: We offer a complete line of insulation Tapes for use in producing Flat Flexible Cables (FFC's) and a broad range of adhesive types that allow users to balance final product performance with lamination processes. Applications include clock spring cables, jumpers, and any application requiring

• Thickness: 0.001 to 0.002 inches
• Peel Strength / Adhesion: 6 lbs/in
• Features: Dielectric / Insulating, Electronics (PCB, Semiconductor), Specialty / Other

Description: Electrically and thermally conductive adhesives for microelectronic applications Working in partnership with valued customers, we have carried out extensive development programmes to customize silver flakes and powders to suit many electronic applications. We are acknowledged as a leading

• Features: Electrically Conductive, Electronics (PCB / SMT Assembly)

Description: Low Flow PBDE FREE Flame Retardant Unsupported Adhesive Free Film Description T4350 is our proprietary low-flow ROHS compliant self-extinguishing adhesive on a release liner, creating an isolated adhesive suitable for use as a bonding layer. T4350 tapes are engineered for

• Thickness: 0.001 to 0.002 inches
• Peel Strength / Adhesion: 8 lbs/in
• Features: Abrasion / Scratch Resistant, Adhesive Tape, Dielectric / Insulating, Electronics (PCB, Semiconductor) Tape, Industrial Tape, Other, Specialty / Other, Thermally Insulating / Insulative, UV / Weather Resistant

Description: LOCTITE ABLESTIK 84-1LMISR4, Epoxy, Die attach LOCTITE® ABLESTIK 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of LOCTITE ABLESTIK 84-1LMISR4 adhesive allows minimum adhesive

• Viscosity: 8,000 cP
• Thermal Conductivity: 2.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 22.22222222222222 µin/in-F

Description: It is a single component, high-end adhesive with dual curing mechanism, specially designed for the optical device industry, typical applications include PLC packaging, semiconductor laser packaging, collimator lens bonding, filter bonding, optical detector lens and fiber bonding,

• Cure / Technology: Thermoplastic / Hot Melt, UV / Radiation Cured (EB, Light)

Description: LOCTITE STYCAST OS 8300, two components - requires mixing, epoxy LOCTITE STYCAST OS 8300 is a two-component adhesive formulated to enhance productivity in the assembly of semiconductor, optical, fiber optic, and optoelectronic devices. High spectral transmission Excellent adhesion Low

• Chemical System: Epoxy (EP)
• Industry: Optical Grade / Material
• Cure / Technology: Two Component System

Description: Master Bond Polymer Adhesive EP21D is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000

• Use Temperature: -60 to 250 F
• Thermal Conductivity: 0.288 to 0.432 W/m-K
• Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
• Elongation: 5 %

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical,

• Viscosity: 25,000 to 45,000 cP
• Use Temperature: 482 F
• Thermal Conductivity: 2.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 51.99999999999999 to 88.99999999999999 µin/in-F

Description: Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10 minutes,

• Viscosity: 8,000 to 10,000 cP
• Use Temperature: -80 to 400 F
• Features: Aerospace, Anti-static / ESD Control, Automotive, Ceramic / Glass, Composites, EMI / RFI Shielding Material, Electrical Insulating / Dielectric, Electrically Conductive, Gap Filling Sealant / FIP Gasket, Marine, Metal, OEM / Industrial, Other, Plastic, Porous Surfaces, Rubber / Elastomer, Specialty
• Use: Die Bonding Adhesive / Compound

Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.  More recently, solar cells require our UV curing resin

• Viscosity: 350 to 550 cP
• Use Temperature: 572 F
• Coeff. of Thermal Expansion (CTE): 21.666666666666668 to 97.22222222222221 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.74

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical,

• Viscosity: 2,200 to 3,200 cP
• Use Temperature: 572 F
• Thermal Conductivity: 2.5 to 29 W/m-K
• Coeff. of Thermal Expansion (CTE): 17.22222222222222 to 87.77777777777777 µin/in-F

Description: Master Bond Polymer System EP126 is a two component toughened epoxy resin based high temperature resistant adhesive system with continuous service capability at 500°F and outstanding chemical resistance. This unique high performance epoxy adhesive compound can also withstand

• Tensile Strength (Break): 2,200 psi
• Features: Aerospace, Automotive, Ceramic / Glass, Composites, Dissimilar Substrates, Flame Retardant (e.g. UL 94 Rated), Marine, Metal, Non-corrosive Cure, OEM / Industrial, Other, Plastic, Specialty / Other, Tooling / Mold Material
• Industry: Electrical Power / HV, Electronics, Semiconductors / IC Packaging
• Chemical System: Epoxy (EP)

Description: LOCTITE ABLESTIK ABP 8068TA, Semi-sintering, Semiconductor, Conductive adhesive LOCTITE® ABLESTIK ABP 8068TA is a semi-sintering die attach adhesive designed for semiconductor packages requiring high thermal and electrical conductivity. This material’s epoxy assisted

• Viscosity: 9,000 cP

Description: camera module housing and LCP-magnet drop impact tests. This adhesive also offers excellent adhesion on Nylon (PA9T) and metal substrates, bonding effectively with Liquid Crystal Polymer (LCP) and Polycarbonate surfaces.

• Industry: Electronics, Semiconductors / IC Packaging
• Features: Metal, Other, Plastic

Description: Presently available adhesives for temporary bonding such as waxes, hot melts, and various solvent compositions lack heat resistance, strength, dimensional stability and are difficult to remove without surface contamination. Master Bond's newly developed MB600 adhesive provides an

• Viscosity: 400 to 420 cP
• Features: Aerospace, Automotive, Ceramic / Glass, Composites, Marine, Metal, OEM / Industrial, Other, Plastic, Rubber / Elastomer, Tooling / Mold Material
• Industry: Electrical Power / HV, Electronics, Semiconductors / IC Packaging
• Form / Shape: Liquid

Description: Thermalbond™ is a thermally conductive, high strength epoxy adhesive. Green in color, it provides exceptional adhesion to copper, aluminum, steel, glass, ceramics and most plastics. Thermalbond™ also has a coefficient of thermal expansion compatible with aluminum, copper and brass, making it

Description: Semiconductor devices - Microelectromechanical devices Part 13: Bend - and shear - type test methods of measuring adhesive strenght for MEMS structures

Description: ACT20 is an unsupported solvent acrylic transfer PSA that conducts electricity anisotropically through the adhesive thickness. This adhesive system offers good quick stick and shear properties with extremely low electrical resistance. Z-axis conductivity Conformable and flexible

• Thickness: 0.002 inches
• Peel Strength / Adhesion: 4.0625 lbs/in
• Temperature Resistance: -40 to 121.11111111111111 C
• Adhesive: Acrylic, Pressure Sensitive (PSA), Transfer

Description: ISO 16525-1:2014 specifies general test methods for isotropic electrically conductive adhesives used in wiring, die attach of semiconductors, and surface assembly of printed circuit boards.

Description: Semiconductor devices - Micro-electromechanical devices - Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

Description: adhesive residue. Excellent chemical resistance Fine line definition Clean removal / no adhesive residue Good conformability Maximum Service Temperature 350°F (177°C) Minimum Service Temperature -60°F (-51°C) Peel Adhesion 35 oz/in (9.72 N/25mm) Product Thickness (Total) 3.50 mils

• Thickness: 0.0035 inches
• Peel Strength / Adhesion: 2.1875 lbs/in
• Temperature Resistance: -51.11111111111111 to 176.66666666666666 C
• Features: Electronics (PCB, Semiconductor), Removable