Semiconductor Hot Plates

Description: JST's Spinner and Hot Plate workstations are designed for ease of use and service. Spinner modules and/or Hot Plate modules are mounted in a sealed deck area with easily accessible storage and maintenance thru hinged doors. A stainless steel enclosure is nitrogen purged

Description: to its ability to absorb neutrons without generating long-lived radionuclides. Because it is a p-type semiconductor, boron carbide may be a good candidate material for high-temperature electronic devices. Boron Carbide is also a good p-type thermoelectric material. Typical Features Low

Description: to its ability to absorb neutrons without generating long-lived radionuclides. Because it is a p-type semiconductor, boron carbide may be a good candidate material for high-temperature electronic devices. Boron Carbide is also a good p-type thermoelectric material. Typical Features Low

• Specialty Ceramic Type: Boron Carbide
• Shape / Form: Plate / Board (e.g., Fiberboard), Tile
• Features: Specialty Ceramic

Description: ALN ceramic components purity is 99.5% aluminum nitride and its density is about 3.3g/cm3. The thermal conductivity is 140-170 W/(m·k). The forming way of hot-pressed aluminum nitride ceramics is vacuum hot pressing sintering. After high temperature and high pressure, hot

• Specialty Ceramic Type: Aluminum Nitride
• Performance Features: Metallized / Silvered (Electrode, Mirror)
• Features: Other, Sintered / Fired, Specialty Ceramic
• Shape / Form: Plate / Board (e.g., Fiberboard)

Description: Low thermal resistance: low-pressure drop, all at a low price! Ideal for use with thermoelectric modules, power semiconductors and other direct cooling applications. Patented and patent-pending design allows for efficient heat transfer at a low cost. Uniform thermal resistance over entire

• Primary Material: Aluminum
• Application / Industry: Electronics / Power Supply Cooling
• Connection Options: NPT
• Technology: Plate

Description: Low thermal resistance: low-pressure drop, all at a low price! Ideal for use with thermoelectric modules, power semiconductors and other direct cooling applications. Patent and patent-pending design allows for efficient heat transfer at a low cost. Uniform thermal resistance over entire

• Primary Material: Aluminum
• Application / Industry: Electronics / Power Supply Cooling
• Connection Options: NPT
• Technology: Plate

Description: Low thermal resistance: designed for < 1 gpm coolant flow. Ideal for use with thermoelectric modules, power semiconductors and other direct cooling applications. Patented and patent-pending designs allows for efficient heat transfer at low cost. Uniform thermal resistance over entire surface

• Primary Material: Aluminum
• Application / Industry: Electronics / Power Supply Cooling
• Connection Options: NPT
• Technology: Plate

Description: Low thermal resistance: very low pressure drop, all at a low price! Ideal for use with IGBT modules, power semiconductors, thermoelectric and other direct cooling applications. Patented and patent-pending design allows for efficient heat transfer at a low cost. Uniform thermal resistance over

• Primary Material: Aluminum
• Application / Industry: Electronics / Power Supply Cooling
• Features: Other
• Technology: Plate

Description: shock resistance Low dielectric constant and loss tangent Excellent machinability Chemically inert Corrosion resistant Not wet by most molten metals Extremely high working temperature Applications High-temperature furnace setter plates Molten glass and metal crucibles High-temperature and

• Material Type: Boron Nitride
• Shape / Form: Tube / Sheath - Immersion (Closed End)

Description: coefficient of thermal expansion Chemical and thermal stability Excellent thermal shock resistance Applications Blasting nozzle Heat exchanger Mechanical seal Plunger Semiconductor processing Kiln furniture Grinding balls Wintrustek Advanced Materials is a leading ceramic materials supplier.

• Shape / Form: Plate / Board (e.g., Fiberboard)
• Specialty Ceramic Type: Silicon Carbide
• Features: Specialty Ceramic

Description: equipment Clean bearings that do not generate impurities by wear, etc. through lubrication in a vacuum are adopted in the vacuum chamber of the ion implantation equipment. Bearing for spattering equipment For the hot vacuum section of the spattering equipment, a bearing of the hot

• Features: Other
• Primary Bearing Category: Radial Ball Bearing

Description: are ideal for analytical instrumentation, medical devices, and semiconductor process equipment components due to their outstanding radiation stability, and resistance to acidic and salt solutions, detergents, hot water, and steam.

• Tensile Strength (Break): 10,200 psi
• Tensile Modulus: 390 ksi
• Use Temperature: 300 F
• Industry: Medical / Food (FDA, USDA), Semiconductors / ICs

Description: Roughening The enhanced bond between the soldermask coating and copper prevents adhesion loss during subsequent processes such as immersion tin plating, Hot Air Solder Levelling (HASL), and final assembly. Excellent Compatibility MultiPrep 200 is compatible with all final finish chemistries,

• Industry: Electronics, Semiconductors / IC Packaging
• Features: Film / Sheet, Liquid, Other
• Substrate Compatibility: Metal

Description: PVIC ACE24511 electrically conductive die attach adhesive is specially designed for tantalum condenser application. This single component, fast cure adhesive also can be snap cured in hot plate or in-line snap cure system and its excellent electrical conductivity and flexibility are

• Viscosity: 18,180 cP
• Thermal Conductivity: 8.61 W/m-K
• Features: Die Bonding Adhesive / Compound, Electrically Conductive, Filled, Flexible / Dampening, Liquid, Thermal / Heat Conductive
• Industry: Electrical Power / HV, Electronics, OEM / Industrial, Semiconductors / IC Packaging

Description: attack by acids and liquid metals. Manufacture and repair of chemical process equipment and heat exchangers Rupture discs Capacitors Semiconductors Medical implants Medical Devices

• UNS Number: 5,200 to 5,400
• Tensile Strength (UTS, Break): 25,000 psi
• Yield Strength (YS): 15,000 psi
• Elongation: 25 %

Description: to -270°C), high pressure (up to 1500kgf/cm2), high vacuum (up to 1E-9 mmHg), and other extreme static sealing conditions due to their unique structure and composition. Applications: Aerospace equipment, Semiconductors, Cryogenics, Engines, Nuclear instruments, Heat exchangers, Reactors,

• Temperature: -454 to 1,472 F
• Pressure: 0 to 43,511.0518071591 psi
• Outside Diameter: 0.2362206 to 177.16545 inch
• Application / Industry: Aerospace, Chemical & Processing, Cryogenic Application, MIL-SPEC, Nuclear, Oil & Gas, Power Generation, Semiconductor, Vacuum Application

Description: Semiconductors, Cryogenics, Engines, Nuclear instruments, Heat exchangers, Reactors, Hot Runners, Oil & Gas, Flow meters, Chemical fibers, Food & Medicine equipment etc. Specifications: Working temperature: -270°C ~ +800°C Working Pressure: Ultra-vacuum ~ +1500 bar Suitable medium:

• Temperature: -454 to 1,472 F
• Pressure: 0 to 21,755.52590357955 psi
• Outside Diameter: 0.2362206 to 177.16545 inch
• Application / Industry: Aerospace, Chemical & Processing, Cryogenic Application, MIL-SPEC, Nuclear, Oil & Gas, Power Generation, Semiconductor, Vacuum Application

Description: effect since the tube has vented holes. Balanced Metal O-Ring Seal is a preferable choice if the pressure from the inner or outer medium is relatively high. Applications: Aerospace equipment, Semiconductors, Cryogenics, Engines, Nuclear instruments, Heat exchangers, Reactors, Hot

• Temperature: -454 to 1,472 F
• Pressure: 0 to 21,755.52590357955 psi
• Outside Diameter: 0.2362206 to 177.16545 inch
• Application / Industry: Aerospace, Chemical & Processing, Cryogenic Application, MIL-SPEC, Nuclear, Oil & Gas, Power Generation, Semiconductor, Vacuum Application

Description: also available as Multi-Convolution Seals. JE series E-Seals are intended for sealing hot combustion gas and aggressive acid or base liquids. JH series E-Seals require higher loads to compress than JE series seals. JH series E-Seals generate higher sealing contact stresses allowing platings

• Temperature: -320 to 1,300 F
• Pressure: 10,000 psi
• Outside Diameter: 0.974 to 13.51 inch
• Application / Industry: Aerospace, Chemical & Processing, Cryogenic Application, MIL-SPEC, Nuclear, Oil & Gas, Piping and Valves, Power Generation, Semiconductor, Vacuum Application

Description: sealing. Specifically, Spring Energized Metal C-Ring is an enhanced Metal C-Ring. With a spring inside the substrate, Spring Energized Metal O-Ring can bear much greater loads for rough surfaces and can also achieve much lower leakage rates. Applications: Aerospace equipment, Semiconductors,

• Temperature: -454 to 1,472 F
• Pressure: 0 to 21,755.52590357955 psi
• Outside Diameter: 0.2362206 to 177.16545 inch
• Application / Industry: Aerospace, Chemical & Processing, Cryogenic Application, MIL-SPEC, Nuclear, Oil & Gas, Power Generation, Semiconductor, Vacuum Application

Description: Plate: 410 x 440mm (1 Hot Plate/Process Chamber) IR Heating: Assy of 18 IR lamps (1KVA each) Power connection: 3Ph-N-PE 230/400V, 50/60 Hz Peak Power: 20 KW (1 Process Chamber), 58 KW (3 Process Chambers) Features SRO i-Line High Throughput Short cycle times Vacuum level 10¯²

• Temperature Range: 450 F
• External: Bench / Cabinet

Description: proof of our expertise is us! We coat many of our products such as semiconductor base plates and x-ray targets in-house using the PVD, CVD, APS and VPS coating processes.

• Type: Sputtering Target

Description: many of our products such as semiconductor base plates and x-ray targets in-house using the PVD, CVD, APS and VPS coating processes. Raw material: sure and certain. Ever since 1921, our customers have been able to rely on Plansee as an independent private company. Like us, they place

• Type: Sputtering Target

Description: the development of new coating materials. The best proof of our expertise is us! We coat many of our products such as semiconductor base plates and x-ray targets in-house using the PVD, CVD, APS and VPS coating processes.

• Type: Sputtering Target

Description: many of our products such as semiconductor base plates and x-ray targets in-house using the PVD, CVD, APS and VPS coating processes. Planar molybdenum targets. For more than 20 years, our materials have proved their worth as thin films in TFT displays. Extremely pure Maximum density

• Type: Sputtering Target

Description: enhances the system’s overall performance. Heat sink PCB can absorb and dissipate high surface temperatures. Resistors, diodes, and power semiconductors produce this temperature. Today, this kind of PCB is rising in popularity around the globe. Heat sink PCB is best to use in electronic