Products & Services
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Supplier: JST Manufacturing, Inc.
Description: JST's Spinner and Hot Plate workstations are designed for ease of use and service. Spinner modules and/or Hot Plate modules are mounted in a sealed deck area with easily accessible storage and maintenance thru hinged doors. A stainless steel enclosure is nitrogen purged
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Description: detectors due to its ability to absorb neutrons without generating long-lived radionuclides. Because it is a p-type semiconductor, boron carbide may be a good candidate material for high-temperature electronic devices. Boron Carbide is also a good p-type thermoelectric material. Typical
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Supplier: Solid State Cooling Systems
Description: Low thermal resistance: low-pressure drop, all at a low price! Ideal for use with thermoelectric modules, power semiconductors and other direct cooling applications. Patented and patent-pending design allows for efficient heat transfer at a low cost.
- Applications: Electronics / Power Supply Cooling
- Connection Type: NPT
- Primary Exchanger Material: Aluminum
- Type: Plate
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Supplier: Solid State Cooling Systems
Description: Low thermal resistance: low-pressure drop, all at a low price! Ideal for use with thermoelectric modules, power semiconductors and other direct cooling applications. Patent and patent-pending design allows for efficient heat transfer at a low cost. Uniform
- Applications: Electronics / Power Supply Cooling
- Connection Type: NPT
- Primary Exchanger Material: Aluminum
- Type: Plate
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Description: mm Hot- Pressed aluminum nitride ceramic components features: Excellent thermal conductivity High electrical insulation High dielectric strength Resist high temperature and corrosion Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors Suit for rigorous or abrasive
- Applications: Other
- Material Type: Aluminum Nitride, Specialty Ceramic
- Performance Features: Metallized / Silvered
- Shape / Form: Plate / Board (e.g., Fiberboard)
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Description: detectors due to its ability to absorb neutrons without generating long-lived radionuclides. Because it is a p-type semiconductor, boron carbide may be a good candidate material for high-temperature electronic devices. Boron Carbide is also a good p-type thermoelectric material. Typical
- Material Type: Boron Carbide, Specialty Ceramic
- Shape / Form: Plate / Board (e.g., Fiberboard), Tile
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Supplier: Solid State Cooling Systems
Description: Low thermal resistance: designed for < 1 gpm coolant flow. Ideal for use with thermoelectric modules, power semiconductors and other direct cooling applications. Patented and patent-pending designs allows for efficient heat transfer at low cost. Uniform
- Applications: Electronics / Power Supply Cooling
- Connection Type: NPT
- Primary Exchanger Material: Aluminum
- Type: Plate
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Supplier: Solid State Cooling Systems
Description: Low thermal resistance: very low pressure drop, all at a low price! Ideal for use with IGBT modules, power semiconductors, thermoelectric and other direct cooling applications. Patented and patent-pending design allows for efficient heat transfer at a low cost.
- Applications: Electronics / Power Supply Cooling
- Connection Type: Other
- Primary Exchanger Material: Aluminum
- Type: Plate
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Description: Plunger Semiconductor processing Kiln furniture Grinding balls Wintrustek Advanced Materials is a leading ceramic materials supplier. We provide high-quality Silicon Carbide ceramics at a competitive price. More Materials: Our
- Shape / Form: Plate / Board (e.g., Fiberboard)
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Description: Applications High-temperature furnace setter plates Molten glass and metal crucibles High-temperature and high-voltage electrical insulators Vacuum feedthroughs Fittings and the lining of the plasma chamber Nonferrous metal and alloy
- Material Type: Boron Nitride
- Shape / Form: Tube / Sheath - Immersion (Closed End)
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Supplier: MCA - Advanced Materials Division
Description: . Sultron™ PSU shapes are ideal for analytical instrumentation, medical devices, and semiconductor process equipment components due to their outstanding radiation stability, and resistance to acidic and salt solutions, detergents, hot water, and steam.
- Chemical / Polymer System Type: Polysulphone
- Industry: Semiconductors / ICs, Medical / Food (FDA, USDA), Other
- Tensile Modulus: 390 ksi
- Tensile Strength (Break): 10200 psi
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Supplier: JTEKT North America, Inc.
Description: For the semiconductor and LCD production equipment, various performance is needed in high-temperature, corrosion resistance, magnetism resistance and low dust generation characteristics according to each process as well as cleanliness. JTEKT supplies special specification bearings for each
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Supplier: Protavic America, Inc.
Description: PVIC ACE24511 electrically conductive die attach adhesive is specially designed for tantalum condenser application. This single component, fast cure adhesive also can be snap cured in hot plate or in-line snap cure system and its excellent electrical conductivity and flexibility are
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Features: Electrically Conductive, Flexible / Dampening, Thermal / Heat Conductive
- Filled / Reinforced: Yes
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Description: : Aerospace equipment, Semiconductors, Cryogenics, Engines, Nuclear instruments, Heat exchangers, Reactors, Hot Runners, Oil & Gas, Flow meters, Chemical fibers, Food & Medicine equipment etc. Specifications: Working temperature: -270°C ~ +800°C
- Application / Industry: Aerospace, Chemical & Processing, Power Generation, Oil & Gas, MIL-SPEC, Nuclear, Semiconductor, Specialized
- Cryogenic Application: Yes
- Material: Aluminum, Copper, Nickel / Nickel-Based Alloy, Stainless Steel, Steel, Titanium, Specialized or Other
- Material Features: Heat-Treated, Plated / Coated
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Description: . Applications: Aerospace equipment, Semiconductors, Cryogenics, Engines, Nuclear instruments, Heat exchangers, Reactors, Hot Runners, Oil & Gas, Flow meters, Chemical fibers, Food & Medicine equipment etc. Specifications: Working temperature: -270°C
- Application / Industry: Aerospace, Chemical & Processing, Power Generation, Oil & Gas, MIL-SPEC, Nuclear, Semiconductor, Specialized
- Cryogenic Application: Yes
- Material: Aluminum, Copper, Nickel / Nickel-Based Alloy, Stainless Steel, Steel, Titanium, Specialized or Other
- Material Features: Heat-Treated, Plated / Coated
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Description: . Spring Energized Metal O-Ring seals can withstand significantly larger loads for rough surfaces and have a much lower leakage rate because of the spring inside the tube. Applications: Aerospace equipment, Semiconductors, Cryogenics, Engines, Nuclear instruments, Heat exchangers
- Application / Industry: Aerospace, Chemical & Processing, Power Generation, Oil & Gas, MIL-SPEC, Nuclear, Semiconductor, Specialized
- Cryogenic Application: Yes
- Material: Aluminum, Copper, Nickel / Nickel-Based Alloy, Stainless Steel, Steel, Titanium, Specialized or Other
- Material Features: Heat-Treated, Plated / Coated
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Description: to energize the sealing effect since the tube has vented holes. Balanced Metal O-Ring Seal is a preferable choice if the pressure from the inner or outer medium is relatively high. Applications: Aerospace equipment, Semiconductors, Cryogenics, Engines, Nuclear instruments, Heat
- Application / Industry: Aerospace, Chemical & Processing, Power Generation, Oil & Gas, MIL-SPEC, Nuclear, Semiconductor, Specialized
- Cryogenic Application: Yes
- Material: Aluminum, Copper, Nickel / Nickel-Based Alloy, Stainless Steel, Steel, Titanium, Specialized or Other
- Material Features: Heat-Treated, Plated / Coated
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Supplier: JETSEAL, Inc.
Description: -Seals are also available as Multi-Convolution Seals. JE series E-Seals are intended for sealing hot combustion gas and aggressive acid or base liquids. JH series E-Seals require higher loads to compress than JE series seals. JH series E-Seals generate higher sealing contact stresses allowing
- Application / Industry: Aerospace, Chemical & Processing, Piping and Valves, Power Generation, Oil & Gas, MIL-SPEC, Nuclear, Semiconductor, Specialized
- Cryogenic Application: Yes
- Material: Nickel / Nickel-Based Alloy, Stainless Steel, Specialized or Other
- Material Features: Heat-Treated, Plated / Coated
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Description: Tantalum Shaped, Flat, Square, Round, Fine Wire, Plated and Un-plated ASTM B 365, ASTM B708, ASTM F 560 R05200: Electron beam or vacuum-arc cast tantalum R05400: Sintered tantalum TANTALUM WIRE DESCRIPTION Tantalum Alloy Description
- Alloy: Yes
- Applications: Biocompatible / Biomaterial, Chemical / Materials Processing, Electronics / RF-Microwave, Other
- Coil Stock: Yes
- Features: Corrosion Resistant, Cold Work (Die / Mold), Heat Resistant / Hot Work, Vacuum Arc Melted (E, VAR, etc.)
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Supplier: ATV Technologie GmbH
Description: individual Process Chambers) Weight: 1.000kg (1 Process Chamber) up to 1.500kg (3 Process Chambers) Hot Plate: 410 x 440mm (1 Hot Plate/Process Chamber) ?IR Heating: Assy of 18 IR lamps (1KVA each) ?Power connection
- Configuration: Bench / Cabinet
- Temperature Range: 450 F
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Supplier: FX PCB Co., Ltd.
Description: management lowers the possibility of board failure and enhances the system’s overall performance. Heat sink PCB can absorb and dissipate high surface temperatures. Resistors, diodes, and power semiconductors produce this temperature. Today, this kind of PCB is rising in popularity around the
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Supplier: Plansee SE
Description: proof of our expertise is us! We coat many of our products such as semiconductor base plates and x-ray targets in-house using the PVD, CVD, APS and VPS coating processes. Raw material: sure and certain. Ever since 1921, our customers have been able to rely on Plansee as an
- Type: Sputtering Target
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Supplier: Plansee SE
Description: collaboration with you and a wide range of development institutes, we can minimize the time to market required for the development of new coating materials. The best proof of our expertise is us! We coat many of our products such as semiconductor base plates and x-ray targets in-house
- Type: Sputtering Target
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Supplier: Plansee SE
Description: wide range of development institutes, we can minimize the time to market required for the development of new coating materials. The best proof of our expertise is us! We coat many of our products such as semiconductor base plates and x-ray targets in-house using the PVD, CVD, APS and
- Type: Sputtering Target
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Supplier: Plansee SE
Description: minimize the time to market required for the development of new coating materials. The best proof of our expertise is us! We coat many of our products such as semiconductor base plates and x-ray targets in-house using the PVD, CVD, APS and VPS coating processes. Planar molybdenum
- Type: Sputtering Target
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generate a eutectic melt with the ceramic, resulting in metal bonded ceramic substrates; and lastly, circuit substrates are produced. They are primarily used in high-temperature gaskets, chilling plate, and packaging of power semiconductor modules. DPC Ceramic (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
Peltier Inside, a Peltier module has P-type and N-type semiconductor pellets. These pellets connect electrically in series and thermally in parallel, sandwiched between two ceramic plates. When current flows, electrons move from the P-type to the N (read more)
Browse Human Machine Interfaces Datasheets for ODG (Origin Data Global) -
Aerospace equipment, Semiconductors, Cryogenics, Engines, Nuclear instruments, Heat exchangers, Reactors, Hot Runners, Oil & Gas, Flow meters, Chemical fibers, Food & Medicine equipment etc. You can benefit from Sonkit with: (read more)
Browse Metal Ring Seals Datasheets for Sonkit (Shanghai) Industry Technology Co., Ltd. -
enhance the structural properties, the metal fibers may be reinforced by sintering to screen mesh or perforated plate. View Products Product Features (read more)
Browse Soundproofing and Acoustic Materials Datasheets for Technetics Group -
properties, the metal fibers may be reinforced by sintering to screen mesh or perforated plate. FELTMETAL™ Acoustic Media is produced from Austenitic stainless steels (Types 316L and 347) and FeCrAIY fibers having diameters ranging from 50 to 150 microns (read more)
Browse Dynamic Seals Datasheets for Technetics Group
Conduct Research Top
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Hot Pressing Aluminum Nitride Used For Semiconductor Fabrication Equipments
Hot pressing Aluminum Nitride (AlN) ceramics are used as wafer heating plates and wafer holding electrostatic chucks in semiconductor fabrication equipments.
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Abstracters
-The cell comprises a p-type semicon- ductor plate and an n-type semiconductor plate hot -pressed into a single body at 300'-600°C and 10-1000 kg/cmz.
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LabX.com New and Used Laboratory Equipment and Scientific Instruments
C&D Semiconductor Hot Plate Oven model 8636 3-6" w .
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Deposition Equipment | New and Used Semiconductor Equipment | LabX
C&D Semiconductor Hot Plate Oven model 8636 3-6" w...
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LabX.com New and Used Laboratory Equipment and Scientific Instruments
C&D Semiconductor Hot Plate Oven model 8636 3-6" w .
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http://dspace.mit.edu/bitstream/handle/1721.1/61875/706130597-MIT.pdf?sequence=2
Cold plate Semiconductor elements Hot plate Electric current .
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Thermo-Electron Ballistic Coolers or Heaters - Nasa Tech Briefs :: NASA Tech Briefs
The closed electric circuit would maintain charge neutrality, supplying electrons to the hot plate and semiconductor layers to replace those removed by thermionic emission and applied electric fields.
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Polymer Waveguide Fabrication Techniques
Acetone - Semiconductor Grade Toluene - Semiconductor Grade Adjustable Hot Plate Blower .
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A General Model for the Electric Power and Energy Efficiency of a Solar Thermoelectric Generator
The simplest thermoelectric generator comprises junctions of p- and n-type semiconductors , a hot plate , a cold plate, and a heat collector.
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Molybdenum (Mo) | AMERICAN ELEMENTS®
Commercial products that benefit from the use of molybdenum include armor, aircraft engine components, glass melting electrodes, valves, boiler plates, ribbons and wires for lighting, semiconductor base plates , hot -zones and heat sinks, sputtering targets for photovoltaic cell coatings and flat …
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Fluid-solid interaction in electrostatically actuated carbon nanotubes
[13] T. K. Lim and S. H. Rhi, Experimental study on nanofludic heat pipe hot chuck plate in semiconductor wafer baking process, Journal of Mechanical Science and Technology, 24 (2010) 1501-1509.