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Supplier: DigiKey
Description: "SN60/PB40 .031"" SOLDER WIRE 1OZ"
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
- Melting Range: 361 to 370 F
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Supplier: DigiKey
Description: "SN63/PB37 .031"" SOLDER WIRE 1OZ"
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
- Melting Range: 361 F
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Supplier: Indium Corporation
Description: Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 183ºC Eutectic Solidus Melting Temperature: 183ºC Eutectic
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire,
- Alloy: Tin-Lead (Sn-Pb)
- Approvals / Conformance: ASTM / UNS
- Conductivity: 5.86E10 µS/cm
- Form / Shape: Paste, Powder, Preform, Wire
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Supplier: Indium Corporation
Description: Widely used solder for electronics. Good for silver metallization. Has improved strength and fatigue properties. Alloy: 62Sn 36Pb 2Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 179ºC Eutectic Solidus Melting Temperature: 179ºC Eutectic Pb-Free: No
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
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Supplier: DigiKey
Description: "SOLDER SPHERES SN63/PB37 .0256"""
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
- Melting Range: 361 F
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Supplier: Indium Corporation
Description: Solder wire from Indium Corporation is manufactured to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation and research quantities to full-scale production volumes.
- Alloy: Indium (In), Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag), Other
- Form / Shape: Wire
- Lead Free: Yes
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Supplier: DigiKey
Description: Leaded No-Clean Wire Solder Sn63Pb37 (63/37) 23 AWG, 24 SWG Spool, 1 lb (454 g)
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
- Melting Range: 361 F
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester lead solder wire is another quality product from Kester. Total composition for this lead solder wire is sn50/pb50.
- Form / Shape: Wire
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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders Soldering is a process in which two or more
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
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Supplier: RS Components, Ltd.
Description: Sn60Pb39Cu1 alloy with flux core. Reduced wear of soldering iron tips, thus more productive soldering of copper wires. Solidus at 183 °C, liquidus at 215 °C. Flux content of 3.5% Wire Diameter = 0.5mm Percent Lead = 40% Product Form = Wire Percent Tin
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester lead solder wire is another quality product from Kester. Total composition for this lead solder wire is sn60/pb40.
- Form / Shape: Solid Wire
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Supplier: Henkel Corporation - Electronics
Description: MULTICORE Hydro-X water soluble flux cored solder wires are suitable for use in normal hand soldering operations where the components have been assessed as being able to withstand the necessary washing procedures. Hydro-X cored wires are available in a variety of alloys
- Alloy: Tin-Lead (Sn-Pb), Other
- Approvals / Conformance: Other
- Form / Shape: Wire
- Lead Free: Yes
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Supplier: SAE International
Description: This specification covers a tin-lead solder in the form of wire, strip, bars, and pigs.
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Supplier: Indium Corporation
Description: High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Aries Electronics, Inc.
Description: FEATURES For mounting liquid crystal displays and other high pin count or odd centered components Available in several sizes with bifurcated contacts in solder pin tails or wire wrap pins For Wire Wrap Pins, consult Data Sheet 12009 Optional spacer
- Contact / Pin Type: Solder Tail Pins, Wire Wrap Pins
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 2.54 mm
- Current Rating: 1 amps
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Supplier: TE Connectivity
Description: Material : Tin (Sn) Contact Type : Pin Mating Pin Diameter : 1.59 MM [.063 INCH ] Dimensions Connector Length : 34.98 MM [1.377 INCH
- Automotive Connector: Yes
- Contact Pitch: 4.44 mm
- Current Rating: 13 amps
- Number of Contacts: 12 #
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Supplier: MacDermid Alpha Electronics Solutions
Description: ORH1 per J-STD-004, this cored solder wire can be used with an open torch or a soldering iron. It will solder copper as well as more difficult materials such as brass and nickel. This wire is suitable for applications involving pipes or tubing, such as
- Fluxes & Cleaners: Soldering Flux / Rosin
- Welding Process / Form: Flux Cored Wire
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Supplier: Radwell International
Description: SOLDER WIRE, 60/40 SN/PB, 190C, 0.5LB; FLUX TYPE:ROSIN ACTIVATED RA; SOLDER ALLOY:60, 40 SN, PB; EXTERNAL DIAMETER - METRIC:0.635MM; EXTERNAL DIAMETER - IMPERIAL:0.025; MELTING TEMPERATURE:190C; WEIGHT - METRIC:226.796G ROHS COMPLIANT: NO. FREE 2 YEAR
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Supplier: TE Connectivity
Description: Plating Material : Tin (Sn) Contact Type : Pin Mating Pin Diameter : 1.59 MM [.063 INCH ] Dimensions Connector Length : 34.29 MM [1
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Supplier: TE Connectivity
Description: : Tin (Sn) Contact Size : Size 16 Contact Type : Pin Mating Pin Diameter : 1.59 MM [.063 INCH ] Dimensions Connector Length : 22
- Contacts Pitch: 5.45 mm
- Current Rating: 13 amps
- Mounting: Other
- Number of Contacts: 24
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Supplier: Win Source Electronics
Description: HTSUS: 8536.69.4040 Mfr: JST Sales America Inc. Other Names: Q2237678,B4BPHKLFSNP P,B4B-PH-K (LF) (SN) (PP),B4B-PH-KLFSN,B4 B-PH-KLFSNPP,(D)B4B- PH-K(LF)(SN)(PP) Base Product Number: B4B-PH-K
- Contact Plating: Other
- Contacts Pitch: 2.01 mm
- Current Rating: 2 amps
- Mounting: Through-hole, Other
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Supplier: Radwell International
Description: SOLDER WIRE, P1.02IN 1LB SPOOL, NO-CLEAN TELECORE, SN63PB37. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Werbel Microwave LLC
Description: remains minimally sized at 3.600 x 0.600 x 0.38 inches with SMA-Female connectors. The device is RoHS compliant, and Sn/Pb solder is available on special order. The device has coverage of the upper band of UHF as well as L-band. The mainline and coupled arm VSWR is 1.15:1 typical,
- Coupler Type: Uni-Directional
- Frequency Range: 500 to 2000 MHz
- Package Type: Other
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Supplier: HAVE, Inc.
Description: : HEX crimp (5.4mm) acc. toIEC 803 Wire size: 0.25 mmâ-" / AWG 24 Cable O.D.: 4.8 mm max. Solderability: complies with IEC 68-2-20 Materials Shell: Brass CuZn39Pb3, 2 â•¡m Ni (Su) plated / PA 6 30% GR Insulation: PA 6.6 30% GRContacts: CuZn39Pb3 / CuSn6 (Tip), 2
- Gender: Male / Plug
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Supplier: Umicore Metal Deposition Solutions
Description: protection layer up to 0.3 µm feasible Reliable Pb-free and Sn/Pb soldering Excellent Al- and Au-wire bondability Applications Flexboard PCB (FPC) Medical technology High frequency technology
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Supplier: RS Components, Ltd.
Description: 4100 Series SMT Inductors with a toroidal construction to minimises EMI. Designed for use in switching power supplies and DC/DC converters. UL94 V-0 Package materials. Inductors are backward compatible with Sn / Pb soldering systems Inductance = 68 μH Maximum DC Current = 1
- DCR: 0.1100 ohms
- Inductance Range: 68 microH
- Operating Temperature: -40 C
- Rated DC Current: 1750 milliamps
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Supplier: RS Components, Ltd.
Description: 4100 Series SMT Inductors with a toroidal construction to minimises EMI. Designed for use in switching power supplies and DC/DC converters. UL94 V-0 Package materials. Inductors are backward compatible with Sn / Pb soldering systems Inductance = 68 μH Maximum DC Current = 1
- DCR: 0.1100 ohms
- Inductance Range: 68 microH
- Operating Temperature: -40 C
- Rated DC Current: 1750 milliamps
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, high directivity, and excellent return loss performance. Stripline design handles much higher power than equivalent core-and-wire models, while the enclosure remains minimally sized at 3.600 x 0.600 x 0.38 inches with SMA-Female connectors. The device is RoHS compliant, and Sn/Pb solder is (read more)
Browse RF Couplers Datasheets for Werbel Microwave LLC -
bump-on-polymer processes Single and multiple layer Cu redistribution with several polymer repassivation material choices Eutectic Sn/Pb, Pb-free and high-Pb solder alloys Design services and custom test vehicle fabrication Downloads (read more)
Browse IC Interfaces Datasheets for Micross Components, Inc. -
failures have been linked to tin whiskers. Tin remains essential in electronics (solder, connectors, plating), so the solution is SnPb plating, which inhibits whisker growth. DLA states: “Alloys of 3% lead, by mass, have shown to inhibit the (read more)
Browse Current Sensing Resistors Datasheets for Isabellenhutte USA -
; different surface finishes for contact pads (HASL, PbFree HASL, immersion coatings (ImAu, ImAg, ImSn), HardGold, OSP, and others). Get Bulk Rigid PCB at Best Cost We work with any volume of orders – we supply prototypes, test batches and large series of printed (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd.
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Novel conductive adhesives for surface mount applications
Changes of joint resistance of these conductive adhesives with Sn / Pb solder wire during 85°C/85% RH aging are given in Fig- ure 11.
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Investigations on Zn-Al-Ge alloys as high temperature die attach material
Fig. 7: Through scan x-ray image of die attach samples: a) Standard Pb - Sn solder wire was used, and Zn AI-Ge solder wire was used at b) 370°C, c) 380°C, & d) 390°C Fig. 7 shows the X-ray images …
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Integrated thin-film dc SQUID sensors
25pm diameter Pb - Sn solder wires are thermalcompression bonded40from the Pbinput coil pads on the chip the PC board leads to form therequired supercon- ducting interconnections.
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http://absimage.aps.org/image/NWS08/MWS_NWS08-2008-000029.pdf
The second material we studied was the 50/50 solder wire ( Pb / Sn alloy).
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http://absimage.aps.org/image/MAR08/MWS_MAR08-2007-000446.pdf
The experiments were conducted on three different materials: We treated 6 carat white gold (Au/Ag alloy, 1:3 ratio by weight) with 70% HNO3 to grow Au nanoporous, the 50/50 solder wire ( Pb / Sn alloy) with 93% H2SO4 to create Pb …
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APS -2008 APS March Meeting - Event - Fabrication of Metallic Nanoporous Films by Selective Chemical Etching
The experiments were conducted on three different materials: We treated 6 carat white gold (Au/Ag alloy, 1:3 ratio by weight) with 70{\%} HNO$_{3}$ to grow Au nanoporous, the 50/50 solder wire ( Pb / Sn alloy) with 93{\% …
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APS -10th Annual Meeting of the Northwest Section of APS - Event - Microstructures of Bi-alloy Metal Films by Dealloying
The second material we studied was the 50/50 solder wire ( Pb / Sn alloy).
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Highly electrically conductive and injection moldable polymeric composites
Tin–lead (Sn-Pb) (20/80) alloy solder wires with a diameter of 1.2 mm were purchased from Sellery Tools, and Sn - Pb (40/60) solder wires with a diameter of 1.2 mm were purchased from RS Com- ponents.
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The effects of apparent contact area on thermal and electrical properties of Ag-MoS2-C/sub graphite/ brushes in contact with coin-silver slip rings
A thermocouple junction was formed using K-type, PTFE- insulated, 36AWG special limits of error wire by soldering (all soldering was done using standard eutectic Sn - Pb solder ) twisted wires to the side of the slipring (Figure 5, T,).
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Enhancement of interfacial reaction between solid iron and molten tin by mechanical actions
Repeated rubbing with the metal wire, such as the tungsten wire and the eutectic Pb – Sn alloy solder wire , severely damaged the reaction layer, and its thickness was decreased to that of the dense layer.