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Supplier: Indium Corporation
Description: Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 183ºC Eutectic Solidus Melting Temperature: 183ºC Eutectic Pb-Free: No
- Diameter / Thickness: 0.3 inch
- Features: Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Allied Electronics, Inc.
Description: Activated Rosin Cored Solder Wire, Sn63Pb37 Alloy, 1 lbs. Weight Solder Wire, Sn63Pb37, .031 inches, Flux-Cored Solder Wire, 1 Lb. Kester 44 rosin flux has virtually dominated the field of activated rosin core solders for well over four decades. An
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Supplier: Allied Electronics, Inc.
Description: Activated Rosin Cored Solder Wire, Sn63Pb37 Alloy, 1 lbs. Weight Solder Wire, Sn60Pb40, .062 inches, Flux-Core Solder Wire, 1 lb. Kester 44 rosin flux has virtually dominated the field of activated rosin core solders for well over four decades. An
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Supplier: Allied Electronics, Inc.
Description: Activated Rosin Cored Solder Wire, Sn63Pb37 Alloy, 1 lbs. Weight Wire Solder, Sn60Pb40, .050 inches, Flux Cored Solder Wire, 1 Lb Kester 44 rosin flux has virtually dominated the field of activated rosin core solders for well over four decades. An
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Supplier: Allied Electronics, Inc.
Description: Activated Rosin Cored Solder Wire, Sn63Pb37 Alloy, 1 lbs. Weight Wire Solder, Sn60Pb40, .025 inches, Flux Cored Solder Wire, 1 Lb. Kester 44 rosin flux has virtually dominated the field of activated rosin core solders for well over four decades. An
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Supplier: Newark, An Avnet Company
Description: SOLDER WIRE, 60/40 SN/PB, 1LB; Leaded / Lead Free:Leaded; Flux Type:-; Solder Alloy:60, 40 Sn, Pb; External Diameter - Metric:3.175mm; External Diameter - Imperial:0.125"; Melting Temperature:190°C; Weight - Metric:453.592g RoHS Compliant: No
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Supplier: Newark, An Avnet Company
Description: SOLDER WIRE, 63/37 SN/PB, 1LB; Leaded / Lead Free:Leaded; Flux Type:Rosin Activated RA; Solder Alloy:63, 37 Sn, Pb; External Diameter - Metric:1.016mm; External Diameter - Imperial:0.04"; Melting Temperature:183°C; Product Range:- RoHS Compliant: No
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Supplier: Newark, An Avnet Company
Description: SOLDER WIRE, 50/50 SN/PB, 1LB; Leaded / Lead Free:Leaded; Flux Type:Rosin Activated RA; Solder Alloy:50, 50 Sn, Pb; External Diameter - Metric:1.575mm; External Diameter - Imperial:0.062"; Melting Temperature:212°C; Product Range:- RoHS Compliant: No
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Supplier: Newark, An Avnet Company
Description: SOLDER WIRE, 40/60 SN/PB, 1LB; Leaded / Lead Free:Leaded; Flux Type:Rosin Activated RA; Solder Alloy:40, 60 Sn, Pb; External Diameter - Metric:1.575mm; External Diameter - Imperial:0.062"; Melting Temperature:234°C; Product Range:- RoHS Compliant: No
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester lead solder wire is another quality product from Kester. Melting point is reached at a temperature of +361 F. It's manufactured as a solder without flux core. Total composition for this lead solder wire is sn63/pb37.
- Features: Other, Solid Wire
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire, strip,
- Melting Range: 460 F
- Conductivity: 58,580,000,000 µS/cm
- Approvals / Conformance: ASTM / UNS
- Product Form: Paste, Powder, Preform
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester lead solder wire is another quality product from Kester. Total composition for this lead solder wire is sn60/pb40.
- Features: Solid Wire
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Supplier: DigiKey
Description: "SN63/PB37 .031"" SOLDER WIRE 1OZ"
- Melting Range: 361 F
- Features: Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester lead solder wire is another quality product from Kester. Total composition for this lead solder wire is sn50/pb50.
- Features: Solid Wire
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester lead solder wire is another quality product from Kester. It's manufactured as an activated rosin flux core. Total composition for this lead solder wire is sn63/pb37.
- Features: Solid Wire
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview Kester OR-421 is more heat stable, exhibits better wetting capabilities, and has less odor than competitive products. The residues left by OR-421 are near neutral pH and therefore less corrosive. Classified as ORH1 per J-STD-004, this cored solder wire can be used with
- Features: Flux Cored Wire, Soldering Flux / Rosin
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Supplier: SAE International
Description: This specification covers a tin-lead solder in the form of wire, strip, bars, and pigs.
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Supplier: SAE International
Description: This specification covers a tin-lead solder in the form of wire, strip, bars, and pigs.
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Supplier: RS Components, Ltd.
Description: Soldering Wire Sn62/Pb36/2Ag 500 g
- Diameter / Thickness: 0.04724412 inch
- Melting Range: 366.8 F
- Features: Other, Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
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Supplier: SAE International
Description: This specification covers a tin-lead alloy in the form of bars, ingots, pellets, ribbon, and round wire.
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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders Soldering is a process in which two or more metal
- Features: Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Henkel Corporation - Electronics
Description: (Known as Multicore C400 Flux Cored Wire ) LOCTITE C 400 cored solder wire has been specially formulated to complement no clean wave and reflow soldering processes. Multicore C400 wires provide fast soldering on copper, brass and solder coated materials. It is
- Solder Alloy: Lead Free, Tin-Lead (Sn-Pb)
- Features: Other, Solid Wire
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Supplier: Henkel Corporation - Electronics
Description: (Known as Multicore C502 Cored Wire ) LOCTITE C 502 cored solder wire has been specially formulated to complement no clean wave and reflow soldering processes. LOCTITE C 502 is also well suited for soldering applications requiring high melting temperature alloys. It is
- Solder Alloy: Lead Free, Tin-Lead (Sn-Pb)
- Features: Other, Solid Wire
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Supplier: Henkel Corporation - Electronics
Description: (Known as Multicore C511 ) LOCTITE C 511 cored solder wire has been specially formulated to compliment no clean wave and reflow soldering processes. It is available in several tin/lead alloys as well as Lead Free. It is available with Sn63, Sn62, Sn60, 96SC (SAC387), 97SC (SAC305) ,
- Solder Alloy: Lead Free, Tin-Lead (Sn-Pb)
- Features: Other, Solid Wire
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Supplier: Radwell International
Description: SOLDER WIRE, 60/40 SN/PB, 190C, 0.5LB; FLUX TYPE:ROSIN ACTIVATED RA; SOLDER ALLOY:60, 40 SN, PB; EXTERNAL DIAMETER - METRIC:0.635MM; EXTERNAL DIAMETER - IMPERIAL:0.025; MELTING TEMPERATURE:190C; WEIGHT - METRIC:226.796G ROHS COMPLIANT: NO. FREE 2 YEAR
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Supplier: Aries Electronics, Inc.
Description: B545-97(2004)e1 over 50µ Ni per SAE AMS-QQ-N-290B; “0TL”50-130µ 90/10 Sn/Pb per MIL-T-10727 Type 1 over 50µ Ni per SAE AMS-QQ-N-290B; “1” 10µ [0.25µ] min. Au per MIL-G-45204 over 50µ Ni per SAE AMS-QQ-N-290B CURRENT RATING: 1 amp OPERATING TEMPERATURE: -67°F to 221°F [-55°C to 105°C]
- Current Rating: 1 amps
- Operating Temperature: -55 to 125 C
- Number of Contacts: 20 to 40
- Contacts Pitch: 2.54 mm
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Supplier: Aries Electronics, Inc.
Description: FEATURES Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for 0.100 [2.54] grid or matrix patterns Available with solder pin tails or wire wrap pins For Wire Wrap Pins, consult Data Sheet 12014 ”Break” feature allows strips to be
- Current Rating: 3 amps
- Operating Temperature: 125 C
- Number of Contacts: 1 to 25
- Contacts Pitch: 2.54 mm
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Supplier: Aries Electronics, Inc.
Description: either 10µ [0.25µ] min. Au per MIL-G-45204 or 200µ [5.08µ] min. 93/7 Sn/Pb per ASTM B545 or 200µ [5.08µ] min. Sn per ASTM B545 Type 1 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290B 4-FINGER COLLET CONTACT: BeCu per UNS C17200 ASTM B194-08 CONTACT PLATING: either 200µ [5.08µ]
- Current Rating: 3 amps
- Operating Temperature: 125 C
- Number of Contacts: 2 to 64
- Contacts Pitch: 2.54 mm
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Supplier: TE Connectivity
Description: Cable Connector Product Type : Connector Assembly Connector Shape : Rectangular Connector System : Wire-to-Board Header Type : Fully Shrouded Mixed & Hybrid Header : No Sealable : Yes Termination Features Termination Method to PCB : Through Hole - Solder Usage Conditions Operating
- Voltage Rating: 250 volts
- Current Rating: 13 amps
- Number of Contacts: 12 #
- Contact Pitch: 4.4449975997012965 mm
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Supplier: Radwell International
Description: SOLDER WIRE, P1.02IN 1LB SPOOL, NO-CLEAN TELECORE, SN63PB37. FREE 2 YEAR RADWELL WARRANTY
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Supplier: TE Connectivity
Description: Type : Box Product Type Features Connector & Contact Terminates To : Wire & Cable Connector & Housing Shape : Rectangular Connector System : Wire-to-Board Header Type : Fully Shrouded Hybrid Header : No PCB Connector Assembly Type : PCB Mount Header Sealable : Yes Termination Features
- Voltage Rating: 250 volts
- Current Rating: 13 amps
- Operating Temperature: -55 to 125 C
- Number of Contacts: 24
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Supplier: Aries Electronics, Inc.
Description: FEATURES Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for 0.100 [2.54] grid or matrix patterns Available with wire wrap or solder tail pins For Solder Pin Tails, consult Data Sheet 12013 Break feature allows strips to be cut to
- Current Rating: 3 amps
- Operating Temperature: 125 C
- Number of Contacts: 1 to 25
- Contacts Pitch: 2.54 mm
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1293287-B4B-PH-K(LF)(SN) Category: Connectors, Interconnects>Rectangular Connectors - Headers, Male Pins Series: PH Number of Positions: 4 Connector Type: Header Contact Type: Male Pin Number of Positions Loaded: All Number of Rows: 1 Termination: Press-Fit,
- Voltage Rating: 100 volts
- Current Rating: 2 amps
- Operating Temperature: -25 to 85 C
- Contacts Pitch: 2.0065999999999997 mm
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Supplier: Umicore Metal Deposition Solutions
Description: regulations. Advantages Nickel free coating High conductivity Thin and very uniform electroless desposition Suitable for (ultra) fine pitch layouts Ductile final finish compatible for flex PCB Dense and homogenous gold protection layer up to 0.3 μm feasible Reliable Pb-free and
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, high directivity, and excellent return loss performance. Stripline design handles much higher power than equivalent core-and-wire models, while the enclosure remains minimally sized at 3.600 x 0.600 x 0.38 inches with SMA-Female connectors. The device is RoHS compliant, and Sn/Pb solder is (read more)
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bump-on-polymer processes Single and multiple layer Cu redistribution with several polymer repassivation material choices Eutectic Sn/Pb, Pb-free and high-Pb solder alloys Design services and custom test vehicle fabrication Downloads (read more)
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failures have been linked to tin whiskers. Tin remains essential in electronics (solder, connectors, plating), so the solution is SnPb plating, which inhibits whisker growth. DLA states: “Alloys of 3% lead, by mass, have shown to inhibit the (read more)
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; different surface finishes for contact pads (HASL, PbFree HASL, immersion coatings (ImAu, ImAg, ImSn), HardGold, OSP, and others). Get Bulk Rigid PCB at Best Cost We work with any volume of orders – we supply prototypes, test batches and large series of printed (read more)
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Novel conductive adhesives for surface mount applications
Changes of joint resistance of these conductive adhesives with Sn / Pb solder wire during 85°C/85% RH aging are given in Fig- ure 11.
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Investigations on Zn-Al-Ge alloys as high temperature die attach material
Fig. 7: Through scan x-ray image of die attach samples: a) Standard Pb - Sn solder wire was used, and Zn AI-Ge solder wire was used at b) 370°C, c) 380°C, & d) 390°C Fig. 7 shows the X-ray images …
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Integrated thin-film dc SQUID sensors
25pm diameter Pb - Sn solder wires are thermalcompression bonded40from the Pbinput coil pads on the chip the PC board leads to form therequired supercon- ducting interconnections.
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http://absimage.aps.org/image/NWS08/MWS_NWS08-2008-000029.pdf
The second material we studied was the 50/50 solder wire ( Pb / Sn alloy).
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http://absimage.aps.org/image/MAR08/MWS_MAR08-2007-000446.pdf
The experiments were conducted on three different materials: We treated 6 carat white gold (Au/Ag alloy, 1:3 ratio by weight) with 70% HNO3 to grow Au nanoporous, the 50/50 solder wire ( Pb / Sn alloy) with 93% H2SO4 to create Pb …
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APS -2008 APS March Meeting - Event - Fabrication of Metallic Nanoporous Films by Selective Chemical Etching
The experiments were conducted on three different materials: We treated 6 carat white gold (Au/Ag alloy, 1:3 ratio by weight) with 70{\%} HNO$_{3}$ to grow Au nanoporous, the 50/50 solder wire ( Pb / Sn alloy) with 93{\% …
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APS -10th Annual Meeting of the Northwest Section of APS - Event - Microstructures of Bi-alloy Metal Films by Dealloying
The second material we studied was the 50/50 solder wire ( Pb / Sn alloy).
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Highly electrically conductive and injection moldable polymeric composites
Tin–lead (Sn-Pb) (20/80) alloy solder wires with a diameter of 1.2 mm were purchased from Sellery Tools, and Sn - Pb (40/60) solder wires with a diameter of 1.2 mm were purchased from RS Com- ponents.
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The effects of apparent contact area on thermal and electrical properties of Ag-MoS2-C/sub graphite/ brushes in contact with coin-silver slip rings
A thermocouple junction was formed using K-type, PTFE- insulated, 36AWG special limits of error wire by soldering (all soldering was done using standard eutectic Sn - Pb solder ) twisted wires to the side of the slipring (Figure 5, T,).
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Enhancement of interfacial reaction between solid iron and molten tin by mechanical actions
Repeated rubbing with the metal wire, such as the tungsten wire and the eutectic Pb – Sn alloy solder wire , severely damaged the reaction layer, and its thickness was decreased to that of the dense layer.