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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire, strip, paste,
- Alloy: Tin-Antimony (Sn-Sb)
- Approvals / Conformance: ASTM / UNS
- Form / Shape: Paste, Powder, Preform, Wire
- Melting Range: 464 F
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester Ultrapure lead solder bar is another quality product from Kester. Total composition for this lead solder bar is sn23/pb75/sb02.
- Approvals / Conformance: Other
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester Ultrapure lead-free solder bar is another quality product from Kester. Total composition for this lead-free solder bar is sn95/sb05.
- Approvals / Conformance: Other
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Supplier: DigiKey
Description: Lead Free Rosin Mildly Activated (RMA) Wire Solder Sn95Sb5 (95/5) 20 AWG, 22 SWG Spool, 1 lb (454 g)
- Form / Shape: Wire
- Melting Range: 450 to 464 F
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Supplier: DigiKey
Description: Lead Free Rosin Activated (RA) Wire Solder Sn95Sb5 (95/5) 14 AWG, 16 SWG Spool, 1 lb (454 g)
- Form / Shape: Wire
- Melting Range: 450 to 464 F
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Supplier: DigiKey
Description: Lead Free Rosin Mildly Activated (RMA) Wire Solder Sn95Sb5 (95/5) 24 AWG, 25 SWG Spool, 1 lb (454 g)
- Form / Shape: Wire
- Melting Range: 450 to 464 F
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Supplier: DigiKey
Description: Lead Free Water Soluble Wire Solder Sn95Sb5 (95/5) 14 AWG, 16 SWG Spool, 18 lbs (8.16kg)
- Form / Shape: Wire
- Melting Range: 450 to 464 F
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester solder without flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a solder without flux core. Total composition for this solder without flux core lead-free
- Approvals / Conformance: Other
- Form / Shape: Wire
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester solder without flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a solder without flux core. Total composition for this solder without flux core lead-free
- Approvals / Conformance: Other
- Form / Shape: Wire
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Supplier: Indium Corporation
Description: Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems. This product formulation offers consistent, repeatable
- Alloy: Other
- Approvals / Conformance: Other
- Form / Shape: Paste
- Lead Free: Yes
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Supplier: MacDermid Alpha Electronics Solutions
Description: Lead-free, high temperature, high reliability alloys targeting Power Electronics applications Product Overview ALPHA Powerbond Solder Preforms are a family of lead-free, high-temperature, high-reliability alloys with antimony content ranging from 5-10%. The SnSb alloy system is an
- Lead Free: Yes
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Supplier: Indium Corporation
Description: Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems. This product formulation offers consistent, repeatable
- Form / Shape: Paste
- Lead Free: Yes
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Supplier: Indium Corporation
Description: Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, SnSb, and other Pb-free alloy systems. This product formulation offers consistent, repeatable
- Alloy: Other
- Approvals / Conformance: Other
- Form / Shape: Paste
- Lead Free: Yes
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Supplier: MacDermid Alpha Electronics Solutions
Description: High lead solder preforms with 4N alloy purity for die attach. Product Overview ALPHA High Lead Die Attach Preforms are constructed with 99.99% (4N) purity PbSn, PbSnAg, and PbSb alloys. To minimize oxidation during storage and shipping, these products are packaged in
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Supplier: Accuris
Description: SOLDER, 50 SN/48 PB/2 SB
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Supplier: MacDermid Alpha Electronics Solutions
Description: ORH1 per J-STD-004, this cored solder wire can be used with an open torch or a soldering iron. It will solder copper as well as more difficult materials such as brass and nickel. This wire is suitable for applications involving pipes or tubing, such as refrigeration coils and
- Fluxes & Cleaners: Soldering Flux / Rosin
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Metallurgy, thermal stability, and failure mode of the commercial Bi-Te-based thermoelectric modules.
The Ni- diffusion barriers used on each side of Sn ( Sb ) solder are different: pure Ni on the Cu side and Ni-P alloy on the TE legs side.
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An evaluation of the spring finger solder joints on
SA1358-10 and SA2052-4 connector assemblies (MC3617,W87).
Instead of the Sn-Ag solder, it appeared that a Sn - Sb solder , most likely the 95Sn- .
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High-temperature variable melting point Sn-Sb lead-free solder pastes using transient liquid-phase powder processing
During this investigation, a high-temperature, variable melting point (VMP) Sn - Sb solder paste was developed.
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An investigation on surface tension of Sn-based lead free solders
From the calculated aggregation of Cu in the Sn–Bi–Cu, Sn–Sb–Cu ternary solder alloys using Eq. (4), we may notice that the aggregated Cu content on the solder surfaces of Sn–Bi and Sn – Sb solders is less, so the effect of Cu …
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Material compatibility and thermal aging of thermoelectric materials.
This loss of integrity was attributed to the metallurgical reaction between the Sn – Sb solder and the Bi2Te3-based TE alloys (Figure 1 – lower left).
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Lowering of Sn−Sb alloy melting points caused by substrate dissolution
Dissolution and interfacial reactions occur when the molten solders come into contact with the substrates.3–6 Binary Sn - Sb solders become ternary Sn-Sb-Ag alloys with intake of Ag.
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Finite Element Thermomechanical Modeling of Large Area Thermoelectric Generators based on Bismuth Telluride Alloys
Illustration of von Mises stress distribution in the legs, for a free-standing 40 9 40 mm2 module of leg length 1.5 mm; Sn - Sb solder , DT of 100°C.
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Lead-Free Electronic Solders
Jang et al. [116] and Takaku et al. [124] examined interfacial reactions of the Sn – Sb solders on Cu substrates.
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Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders
Table V summarizes the measurements of thin film dissolution and intermetallic growth with four differ- ent Cu or Ni/Cu contact metallurgies in the Sn / Sb solder .
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Direct liquid cooling module with high reliability solder joining technology for automotive applications
Sn - Sb solder component Strengthening Mechanism （Content of Sb .