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Description: It is a low-viscosity, epoxy adhesive industrial product. After mixing, the two-component epoxy resin is cured at room temperature with minimal shrinkage to form an ultra-clear adhesive tape with excellent impact resistance. The fully cured epoxy resin is resistant
- Cure Type / Technology: Two Component System, Room Temperature Curing
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Description: Off-white/universal structural adhesive, low to medium viscosity, good manufacturability, steel sheet bonding strength over 38Mpa, temperature resistance 200 degrees.
- Cure Type / Technology: Single Component System, Specialty / Other
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Description: It is a two-component epoxy resin structural adhesive. At room temperature (25°C), the operating time is 20 minutes, the curing position is 90 minutes, and the curing is complete in 24 hours. After being fully cured, it has the characteristics of high shear, high peeling, and
- Cure Type / Technology: Two Component System, Room Temperature Curing
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Description: It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact
- Cure Type / Technology: Two Component System
- Industry: Electronics
- Use Temperature: -40 to 302 F
- Viscosity: 9000 to 12000 cP
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Supplier: Henkel Corporation - Industrial
Description: 1-part, non-sag, fast cure epoxy adhesive paste. The product is ideal for bonding wires to armatures. LOCTITE® EA 3985 is a black, 1-part, non-sag, fast cure epoxy adhesive paste. The product is ideal for bonding wires to armatures due to its rheological properties which
- Cure Type / Technology: Single Component System
- Viscosity: 50000 cP
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Supplier: Henkel Corporation - Industrial
Description: Epoxy translucent 2-part adhesive for general purpose applications. Bonds most materials and is effective at filling porosities and voids. LOCTITE® EA 9131 is a translucent, 2-part, epoxy, general purpose adhesive liquid suitable for bonding metals, glass, ceramics, most
- Cure Type / Technology: Two Component System
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Wood / Wood Product
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite 1386228 gray E-7570 epoxy structural adhesive is compatible with ceramic, metal and plastic materials. Delivers great performance with a shear strength of 1500 psi. Maximum operating temperature is +250 F. Perfect for bonding applications.
- Use Temperature: 250 F
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Supplier: Henkel Corporation - Industrial
Description: Thixotropic, heat-cured, industrial grade structural epoxy adhesive paste with tough, strong bonds with excellent peel resistance and impact strength. LOCTITE® EA E-214HP is a light gray, thixotropic, heat-cured, industrial grade structural epoxy adhesive
- Cure Type / Technology: Single Component System
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Supplier: Henkel Corporation - Industrial
Description: Room temperature-cure, toughened, medium viscosity, industrial grade structural epoxy adhesive with a medium working life. LOCTITE® EA E-40FL is a gray, opaque, room temperature-cure, toughened, medium viscosity, industrial grade structural epoxy adhesive
- Cure Type / Technology: Two Component System
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Rubber / Elastomer, Wood / Wood Product
- Viscosity: 70000 cP
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Hysol 29340 gray E-214HP epoxy structural adhesive is compatible with ceramic, glass, metal and plastic materials with a 40 min @ 248F cure time. Delivers great performance with a shear strength of 4820 psi and tensile strength of 4460 psi. Maximum operating temperature
- Features: Leveling / Filling Compound
- Use Temperature: 300 F
- Viscosity: 2.00E6 to 3.00E6 cP
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Hysol 29339 gray E-214HP epoxy structural adhesive is compatible with ceramic, glass, metal and plastic materials with a 40 min @ 248F cure time. Delivers great performance with a shear strength of 4820 psi and tensile strength of 4460 psi. Maximum operating temperature
- Features: Leveling / Filling Compound
- Use Temperature: 300 F
- Viscosity: 2.00E6 to 3.00E6 cP
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Supplier: Epoxies Etc...
Description: 10-3008 is a filled, high performance structural epoxy adhesive. 10-3008 is a flexible adhesive with outstanding lap shear and peel strength. It is a great choice for bonding substrates of differing coefficients of thermal expansion. 10-3008 is also an excellent
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Features: Filled
- Industry: OEM / Industrial
- Tensile Strength (Break): 2700 to 3200 psi
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Supplier: Epoxies Etc...
Description: 10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3022 is widely used as a stencil and screen adhesive due to its bonding strength and toughness. It has been used extensively to bond
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.8
- Dielectric Strength: 450 kV/in
- Features: Electrical Insulating / Dielectric
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite EA E-60HP off-white epoxy structural adhesive is compatible with ceramic, metal and plastic materials with a 24 hr cure time. Provides a 60 min working time. Works in a mix ratio of 2:1. Delivers great performance with a shear strength of 4320 psi and tensile strength of
- Features: Leveling / Filling Compound
- Use Temperature: 250 F
- Viscosity: 45000 cP
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electroni cc/ structural applications. The two components are combined in a convenient
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 2.95 to 2.96
- Dielectric Strength: 400 to 450 kV/in
- Dissimilar Substrates: Yes
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Supplier: DigiKey
Description: STRUCTURAL EPOXY ADHESIVE
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Supplier: DigiKey
Description: STRUCTURAL EPOXY ADHESIVE
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Supplier: Accuris
Description: Adhesive - Epoxy Structural - Cold Setting
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Supplier: Accuris
Description: Structural Adhesive, Epoxy, One-Part
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Supplier: ACCRAbond, Inc.
Description: INSTAbond®A894 is a two component; ambient cure epoxy compound designed for structural aerospace metal to metal bonding applications, in particular, aircraft grade aluminum substrates (2024 and 7075) and titanium. Designed after the requirements of MMM-A-132 and MMM-A-134 military
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® N8894 -- A two-component, epoxy laminating adhesive that cures at room temperature. A heat cure is recommended for optimal results. N8894 finds utility in a multitude of applications from laminating skis and snowboards, archery limbs and honeycomb core facing to bonding a
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Supplier: Accuris
Description: Adhesive, Induction Cure, Epoxy, Structural - Metal
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Supplier: Accuris
Description: Adhesive, Two-Part, Epoxy, Structural- Metal
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 810C -- General purpose adhesive that bonds and repairs a variety of materials including metls, most plastics and wood. The cured compound is machinable and sandable, and has high service temperature and excellent environmental resistance.
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® BA82 -- A general purpose, two-part epoxy compound that cures at room temperature. When fully cured, the material produces a durable, resilient bond that is durable under dynamic and static loading as well as after exposure to many solvents and humid environments. N8894 bonds: GRP,
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Supplier: DigiKey
Description: FLAME RETARDANT STRUCTURAL EPOXY
- Features: Flame Retardant (e.g. UL 94 Rated)
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Supplier: DigiKey
Description: FLAME RETARDANT STRUCTURAL EPOXY
- Features: Flame Retardant (e.g. UL 94 Rated)
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Supplier: Ellsworth Adhesives
Description: ResinLab EP962 Brown is a one component, heat curing, paste-like epoxy that is used for bonding structural materials. It has medium viscosity, little sag, and reduces stress on components. 6 oz Cartridge.
- Cure Type / Technology: Single Component System
- Dielectric Strength: 410 kV/in
- Elongation: 2 to 4 %
- Substrate / Material Compatibility: Metal
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Supplier: Epoxies Etc...
Description: 10-3797 is a one component, fast curing structural adhesive. This epoxy system is a non-sag thixotropic product that cures quickly at low temperatures. 10-3797 is a 100% solids system and therefore contains no solvents. This adhesive is a great choice for
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrical Insulating / Dielectric
- Industry: Electronics, OEM / Industrial
- Tensile Strength (Break): 4200 psi
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Supplier: Epoxies Etc...
Description: 10-3044 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3044 is widely used as a stencil and screen adhesive due to its bonding strength and toughness. It has been used extensively to bond
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.8
- Dielectric Strength: 450 kV/in
- Features: Filled
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Epoxy Adhesives - Two Part Epoxy Adhesive for Structural Bonding Features Long Pot Life -- EP21ND-LPSupplier: Master Bond, Inc.
Description: Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas.
- Coeff. of Thermal Expansion (CTE): 2.78E7 to 3.06E7 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): Over 2.92
- Dissimilar Substrates: Yes
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Supplier: Master Bond, Inc.
Description: Serviceable up to +500°F, EP13SPND-2 is a one part epoxy paste for structural bonding applications. This electrically insulative system has a non-drip application feature that delivers high tensile, tensile lap shear and compressive strength of over 8,000 psi, 3,000 psi and 18,000 psi,
- Coeff. of Thermal Expansion (CTE): 13.89 to 16.67 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): Over 4.9
- Dissimilar Substrates: Yes
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Description: 3M™ Scotch-Weld™ Structural Adhesive AF 3185 film is a non-volatile, thermosetting epoxy laminating adhesive and glass cloth combination designed for the structural bonding and for the preparation of reinforced epoxy glass laminate.
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Laminating / Composites
- Industry: Aerospace, OEM / Industrial
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Supplier: SAE International
Description: This specification and its supplementary detail specifications cover film adhesives compounded from modified epoxy resins in the form of ready-to-use sheet, supplied in rolls, either supported by mat or by woven monofilaments or unsupported.
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Supplier: ODG (Origin Data Global)
Description: STRUCTURAL EPOXY ADHESIVE
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DeepMaterial is low temperature cure bga flip chip underfill pcb epoxy process adhesive glue material manufacturer,supply industrial appliance structural bonding epoxy adhesive glue,low refractive index epoxy resin adhesive glue,high refractive index optical adhesive glue,best glue for magnet
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More Information Top
Indicates content that may require registration and/or purchase.
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Handbook of Adhesive Chemical and Compounding Ingredients
Uses: Liq. polymer which cures at room or elevated temps. to solid elas- tomer; improves crack resistance of epoxy, polyester systems, enhances fatigue performance of FRP; good elec. and wetting properties; used as modifier for epoxy structural adhesives ; improves impact resistance of…
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Cranfield University
Structural epoxy adhesives to meet today’s challenge ...................................
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Handbook of Industrial Chemistry and Biotechnology
Epoxy Structural Adhesives .
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Handbook of Adhesion Technology
This type of flat R-curve behavior is typical for many structural epoxy adhesives tested in mode I.
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Kent and Riegel’s Handbook of Industrial Chemistry and Biotechnology
EPOXY STRUCTURAL ADHESIVES .
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Hybrid Adhesive Joints
From 1998 to 1990, [22, 25, 37] mixed a lot of fillers (metallic powders, chopped wires and metallic fine meshes) and came up with recommended formula for improving electrical as well as thermal properties of structural epoxy adhesives .
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Handbook of Adhesion 2nd Edition Complete Document
With structural Epoxide adhesives , recent studies have shown that this boundary polymer may have chemical and mechanical properties radically different from the bulk adhesive material and which are not incorporated within current models.
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Evaluation of Numerical Methods to Model Structural Adhesive Response and Failure in Tension and Shear Loading
The data for three epoxy structural adhesives tested in ten- sion and shear over a range of strain rates (0.001–1000 s-1 ) .