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Supplier: Master Bond, Inc.
Description: quickly at elevated temperatures. EP30LTE represents the long desired technical breakthrough of a significant reduction in the high thermal expansion coefficients characteristic of epoxies and all other organic polymers while retaining their advantageous properties and
- Viscosity: 15,000 to 20,000 cP
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 0.721 W/m-K
- Coeff. of Thermal Expansion (CTE): 19 to 22 µin/in-F
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Supplier: Accuris
Description: STANDARD TEST METHOD FOR LINEAR SHRINKAGE AND COEFFICIENT OF THERMAL EXPANSION OF CHEMICAL-RESISTANT MORTARS, GROUTS, MONOLITHIC SURFACINGS, AND POLYMER CONCRETES
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Supplier: Accuris
Description: Standard Test Method for Linear Shrinkage and Coefficient of Thermal Expansion of Chemical-Resistant Mortars, Grouts, Monolithic Surfacings, and Polymer Concretes
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Supplier: Accuris
Description: Testing of resin and polymer/cement compositions for use in construction - Part 12: Methods for measurement of unrestrained linear shrinkage and coefficient of thermal expansion
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Supplier: Accuris
Description: STANDARD TEST METHOD FOR LINEAR SHRINKAGE AND COEFFICIENT OF THERMAL EXPANSION OF CHEMICAL-RESISTANT MORTARS, GROUTS, MONOLITHIC SURFACINGS, AND POLYMER CONCRETES - INCLUDES STANDARD + REDLINE (PDF)
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Supplier: ASTM International
Description: 1.1 This test method covers the measurement of the linear shrinkage during setting and curing and the coefficient of thermal expansion materials. 1.2 A bar of square cross-section is cast to a prescribed length. The change in length is calculated and shown in percent. The change
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Description: IEC 62047-11:2013 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric, etc.) micro-electro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10
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Supplier: CSA Group
Description: IEC 62047-11:2013 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric, etc.) micro-electro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10
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Supplier: Master Bond, Inc.
Description: plastics. As a thermally conductive adhesive it forms high strength bonds of over 1800 psi tensile shear. EP21AO resists a wide range of chemicals including water, oils, fuels, and some solvents over the temperature range of -60°F to +250°F. It also possesses a low coefficient of
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 1.441 W/m-K
- Coeff. of Thermal Expansion (CTE): 17 to 11 µin/in-F
- Tensile Strength (Break): 5,000 psi
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Supplier: Victrex PLC
Description: Higher temperature tribological applications for high strength and stiffness. Excellent wear resistance, low coefficient of friction, low coefficient of thermal expansion. Chemically resistant to aggressive environments.
- Deflection Temperature (@ 264 psi, 1.8 MPa): 367 F
- Thermal Conductivity: 1.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 9 to 90 µin/in-F
- Tensile Strength (Break): 55 to 190 psi
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Supplier: Master Bond, Inc.
Description: low coefficient of expansion and excellent dimensional stability.
- Use Temperature: -60 to 400 F
- Thermal Conductivity: 1.153 to 1.441 W/m-K
- Coeff. of Thermal Expansion (CTE): 17 to 11 µin/in-F
- Tensile Strength (Break): 5,000 psi
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Supplier: Master Bond, Inc.
Description: EP30AO is also an excellent adhesive/sealant forming durable, rigid bonds that are resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the wide temperature range of -60°F to 250°F. The thermal expansion coefficient is desirably
- Viscosity: 50,000 to 70,000 cP
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 1.441 W/m-K
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
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Supplier: Boyd
Description: make graphite an ideal solution for managing extreme heat in many different formats. Graphite thermal heat spreaders are ideally suited for thermal spreading and shielding applications in minimal dimensional space with very high in-plane thermal conductivity in an
- Features: Other Materials
- Device: Passive Heat Sink
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Description: base mortars, and as a polymer modifier of Portland Cement. The polymer additive allows these mortars to maintain a thermal coefficient of expansion similar to concrete
- Dispensing Method: Brush / Roll-on
- Substrate: Concrete / Masonry
- Form: Liquid
- Cure / Setting Technology: Multicomponent
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Supplier: Anton Paar
Description: TORC 5000 features unique technology in a robust and compact instrument and combines this with powerful measurement software. The Thermo-optical Oscillating Refraction Characterization (TORC) technique enables determination of the coefficient of thermal expansion and monitoring
- Temperature Range: 4.000000000000002 to 125 C
- Accuracy: 0.00002 (%)
- Remote Interface: Computer Interface
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Description: substrate to which it is applied exhibit very similar coefficients of expansion Advantages Water-based, Low VOC Resistance to impact, wear and thermal shock Breatheable mortar for on or below grade installations High aggregate loading accommodates slope-to- drain, irregular
- Max Use Temperature: 70 C
- MOR / Flexural Strength: 1,300 to 2,000 psi
- Compressive / Crushing Strength: 500 to 825 psi
- Applications: Flooring
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Supplier: Port Plastics, Inc.
Description: Semitron® ESd 480 PEEK uses PEEK as a base resin. PEEK offers excellent properties in terms of wear resistance, low coefficient of friction and low coefficient of thermal expansion. As well PEEK provides excellent strength, stiffness, and excellent dimensional stability
- Features: Anti-static, Other
- Filler: Carbon / Graphite
- Industry: Electronics
- Chemical System: PEEK
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Supplier: Port Plastics, Inc.
Description: Semitron® ESd 490 HR PEEK uses PEEK as a base resin. PEEK offers excellent properties in terms of wear resistance, low coefficient of friction and low coefficient of thermal expansion. As well PEEK provides excellent strength, stiffness, and excellent dimensional
- Features: Anti-static, Other
- Filler: Carbon / Graphite
- Industry: Electronics
- Chemical System: PEEK
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Supplier: DeWAL
Description: excellent electrical insulating properties, unsurpassed chemical resistance and excellent thermal resistance. DeWAL’s unsintered PTFE tape has good drape characteristics allowing it to conform smoothly to complicated shapes. DW 203 can be used for gaskets, expansion joints, valve seals
- Width: 0.5 to 11 inches
- Thickness: 0.000002 to 0.00002 inches
- Temperature Resistance: 260 C
- Features: Dielectric / Insulating, Electrical Tape, Single-Sided, Specialty / Other, Specialty Tape, Thermally Insulating / Insulative
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Supplier: IHS ESDU
Description: ESDU 84041 gives approximate values of a number of properties of common materials of interest in tribological calculations. Density, tensile modulus, Poisson's ratio, linear thermal expansion coefficient, thermal conductivity, specific heat capacity, and melting or
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Supplier: Port Plastics, Inc.
Description: Semitron® ESd 520 HR PAI uses Solvay Torlon® PAI polyamide-imide resin as a base resin. PAI offers PAI greater compressive strength and higher impact resistance than most advanced engineering plastics. High creep resistance and an extremely low coefficient of linear thermal
- Features: Anti-static
- Chemical System: Polyamide-imide (PAI)
- Type: Thermoplastic
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Supplier: Linseis Inc.
Description: measuring systems are made out of quartz with an expansion coefficient of approx. 5 x 10E-7/K and is thus very small compared to the normal expansion coefficient of the polymer samples, the expansion of the measuring system can be neglected. For very high
- Temperature Range: -40 to 160 C
- Operating Temperature: 0 to 40 C
- User Interface: Analog Front Panel
- Display: Analog Meter, Video Display
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Supplier: Jinshiling (Heyuan) Technology Co., Ltd.
Description: Glass-filled PTFE will exhibit less distortion as a result of temperature changes. This ensures reliable performance during thermal cycling. Table 4. Coefficients for Thermal Expansion Glass-filled PTFE is the ultimate in durability and performance, exhibiting Good
- Chemical System: Fluoropolymer (PTFE / PVDF)
- Industry: General Industrial, Medical / Food (FDA, USDA)
- Features: Other, Thermoset / Crosslinked
- Material Type: Thermally Conductive
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Description: General Polymers TPM #721 REPAIR AND LEVELING MORTAR is a single component polymer-modified, shrinkage-compensated cement-based mortar. It is designed for horizontal concrete surfaces where high early strength gain is required. The blend of special cements, aggregates, fibers and
- Use Temperature: 40 to 90 F
- Substrate Compatibility: Concrete / Masonry, Metal, Wood / Wood Product
- Industry: OEM / Industrial
- Cure / Technology: Single Component System
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Supplier: Norplex-Micarta
Description: P95 consists of woven glass fabric with polyimide resin. The product is engineered to maintain excellent physical properties at 240°C, making it suitable for high temperature applications. It offers a low coefficient of thermal expansion, as well as high mechanical strength and
- Use Temperature: 392 F
- Water Absorption: 0.35 %
- Tensile Strength (Break): 40,000 to 48,000 psi
- Industry: Electronics
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Supplier: Greene, Tweed & Co.
Description: most mechanical properties, including strength and stiffness; non-conductive; provides dimensional stability Carbon fibers best strength and stiffness performance; lower density than glass; low coefficient of expansion; improved creep and wear resistance Aramid fibers low
- Industry: Aerospace, Electric Power, Semiconductor / IC's
- Filler: Aramid Fiber, Carbon / Graphite, Fiber Glass
- Material Type: Composite Material, Thermoplastic
- Chemical System: PEEK
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Description: bond to rough, sound concrete Resists thermal shock, coefficient of expansion similar to concrete Fiber reinforced for high tensile strength High early strength gain Freeze/thaw resistant Can be applied in layers up to 3” thick May be used for tile setting beds Uses TPM #723
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Supplier: Polyplastics USA, Inc.
Description: PBT is a linear thermoplastic saturated polyester containing ester bonds in its main chain. PBT stands for polybutylene terephthalate. The polymer belongs to the same family as PET resin. PBT possesses a high melting point and high crystallinity, while low water absorption and thermal
- Deflection Temperature (@ 264 psi, 1.8 MPa): 158 F
- Coeff. of Thermal Expansion (CTE): 55.55555555555556 µin/in-F
- Tensile Strength (Break): 8,122.06300400303 psi
- Elongation: 10 %
Find Suppliers by Category Top
Featured Products Top
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Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications.
(read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Zerodur® (Schott Glass) Zerodur® is a glass ceramic with an extremely low thermal expansion coefficient. Zerodur is a glass ceramic made by Schott Glass that is designed and formulated to exhibit (read more)
Browse Glass Fabrication Services Datasheets for Insaco, Inc. -
Key Features: Thermal conductivity exceeds 6 W/(m•K) Applicable in very thin bond lines Low thermal resistance Low coefficient of thermal expansion Used for bonding and sealing applications. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
isolate electric currents, safeguarding equipment against electrical failures. Shock absorption and stress relief: During prolonged use, mechanical stress may arise due to thermal expansion and contraction. The (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
dissipation effect is better than that of the super copper and aluminum. Ceramics are insulated, resistant to high temperatures, oxidation, acid and alkali, cold and thermal shock, and low coefficient of thermal expansion, ensuring stability in high and low temperatures or other harsh environments (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Low thermal expansion coefficient compatible with semiconductor devices High thermal conductivity for (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for Fountyl Technologies Pte. Ltd. -
Mismatch): Differing coefficients of thermal expansion (CTE) in bonded or assembled materials can induce high stresses, leading to delamination, cracking, or joint failure. Performance Drift: Electronic (read more)
Browse Environmental Test Chambers and Rooms Datasheets for Guangdong Atmars Industry Co., Limited -
thermal conductivity of 2.3-2.6 W/(m•K). This epoxy exhibits dimensional stability with low shrinkage upon curing and a low coefficient of thermal expansion of 14-16 x 10-6 in/in/°C. Mechanical properties include a tensile strength of 5,000 to 7,000 psi, a tensile modulus greater (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
What are the design considerations for step glass windows? Tolerance control of step height and width. Compatibility with mounting structure. Compatibility of coefficients of thermal expansion. Requirements for flatness and parallelism of optical surfaces. Environmental sealing performance (if required). (read more)
Browse Optical Windows Datasheets for Changchun Yutai Optics Co., Ltd. -
impact resistance. Thermal properties: low coefficient of thermal expansion, good thermal stability. Chemical stability: corrosion resistant, suitable for harsh environments. (read more)
Browse Infrared Windows Datasheets for Changchun Yutai Optics Co., Ltd.
Conduct Research Top
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Unfilled Liquid Crystal Polymers
. cryogenic temperatures without growing brittle, and have a low coefficient of thermal expansion.
More Information Top
Indicates content that may require registration and/or purchase.
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Improving the predictions of injection molding simulation software
in which a and b are the temperature and pressure de- pendence of viscosity, bV and aV are the compressibility and the thermal expansion coefficient polymer .
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The Glass Temperature
… range fictive temperature relaxation spectrum retardation function retardation spectrum crystallization time shear creep compliance equilibrium compliance glassy shear compliance stress relaxation modulus Andrade equation parameter glass temperature depression recoverable shear compliance recoverable shear compliance thermal expansion coefficient ( polymer ) repeat unit structure fractional …
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Broad-band high-efficiency optoacoustic generation using
a novel photonic crystal-metallic structure
As we discussed above, we need effective light absorber and large thermal expansion coefficient polymer material to get an ideal optoacoustic transmitter.
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Auxetic Materials: Functional Materials and Structures from Lateral Thinking!
Similarly, the combination of the auxetic effect with other novel effects, such as in Baughman's semiconducting and negative thermal expansion coefficient polymer auxet- ic molecular networks, should lead to a rich vein of materi- als' functionality.
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Integrated Silicon-Polymer Laterally Stacked Bender for Sensing Microgrippers
The metal heater is deposited on the top of a high thermal expansion coefficient polymer layer.
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Correlation between viscoelastic behavior and cooling stresses in a cured epoxy resin system
This demonstrated the occurrence of additional stresses because of the difference between the ceramic and polymer thermal expansion coefficients .
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Diffusion in polymers below the glass transition temperature: Comparison of two approaches based on free volume concepts
… volume of component 1 specific hole free-volume of component 2 specific hole free-volume of glassy polymer specific volume of glassy polymer specific mteistitial volmne of glassy polymer specific occupied volume of glassy polymer thermal expansion coefficient of the polymer above .
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Hybrid model for the diffusion of simple and complex penetrants in polymers
The polymer free-volume thermal expansion coeffi- cient can be taken equal to the polymer thermal expan- sion coefficient , with the assumption that the polymer thermal expansion is a direct result of the free-volume thermal expansion.
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An Experimental and Theoretical Investigation into the Diffusion of Olefins in Semi‐Crystalline Polymers: The Influence of Swelling in Polymer‐Penetrant Systems
difference of polymer thermal expansion coeffi- cient above and below the glass transition temperature (KÀ1 ) ap0 .
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Biaxial stretching of polymers using a novel and versatile stretching system
thickness, the initial thickness, the temperature gradient and the polymer thermal expansion coefficient .