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Supplier: Master Bond, Inc.
Description: readily at ambient or more quickly at elevated temperatures, represents the long desired technical breakthrough of a significant reduction in the high thermal expansion coefficients characteristic of epoxies and all other organic polymers while retaining their
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 4.1
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Supplier: Master Bond, Inc.
Description: more quickly at elevated temperatures. EP30LTE represents the long desired technical breakthrough of a significant reduction in the high thermal expansion coefficients characteristic of epoxies and all other organic polymers while retaining their advantageous properties
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 19 to 22 µin/in-F
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
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Description: IEC 62047-11:2013 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric, etc.) micro-electro-mechan ical system (MEMS) materials with length between 0,1 mm and 1 mm and width between
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Supplier: Accuris
Description: Testing of resin and polymer/cement compositions for use in construction - Part 12: Methods for measurement of unrestrained linear shrinkage and coefficient of thermal expansion
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Supplier: Accuris
Description: STANDARD TEST METHOD FOR LINEAR SHRINKAGE AND COEFFICIENT OF THERMAL EXPANSION OF CHEMICAL-RESISTANT MORTARS, GROUTS, MONOLITHIC SURFACINGS, AND POLYMER CONCRETES
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Supplier: Accuris
Description: STANDARD TEST METHOD FOR LINEAR SHRINKAGE AND COEFFICIENT OF THERMAL EXPANSION OF CHEMICAL-RESISTANT MORTARS, GROUTS, MONOLITHIC SURFACINGS, AND POLYMER CONCRETES - INCLUDES STANDARD + REDLINE (PDF)
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Supplier: ASTM International
Description: 1.1 This test method covers the measurement of the linear shrinkage during setting and curing and the coefficient of thermal expansion materials. 1.2 A bar of square cross-section is cast to a prescribed length. The change in length is calculated and shown in percent. The change
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Supplier: ASTM International
Description: 1.1 This test method covers the measurement of the linear shrinkage during setting and curing and the coefficient of thermal expansion of chemical-resistant mortars, grouts, monolithic surfacings, and polymer concretes. 1.2 A bar of square cross-section is cast to a
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Supplier: ASTM International
Description: 1.1 This test method covers the measurement of the linear shrinkage during setting and curing and the coefficient of thermal expansion of chemical-resistant mortars, grouts, monolithic surfacings, and polymer concretes. 1.2 A bar of square cross-section is cast to a
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Supplier: CSA Group
Description: IEC 62047-11:2013 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric, etc.) micro-electro-mechan ical system (MEMS) materials with length between 0,1 mm and 1 mm and width between
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Supplier: Victrex PLC
Description: strength and stiffness in a static or dynamic system. Excellent wear resistance, low coefficient of friction, low coefficient of thermal expansion. Chemically resistant to aggressive environments.
- Chemical / Polymer System Type: PEEK
- Coeff. of Thermal Expansion (CTE): 8 to 110 µin/in-F
- Compound Type: Extrusion Grade Resin, Molding Resin
- Deflection Temperature (@ 264 psi, 1.8 MPa): 325 F
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Supplier: Victrex PLC
Description: thin cross sections or long flow lengths for high strength. Excellent wear resistance, very low coefficient of friction, low coefficient of thermal expansion. Chemically resistant to aggressive environments.
- Chemical / Polymer System Type: PEEK
- Coeff. of Thermal Expansion (CTE): 9 to 110 µin/in-F
- Compound Type: Molding Resin
- Elongation: 1.8 %
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Supplier: Victrex PLC
Description: stiffness in a static or dynamic system. Excellent wear resistance, low coefficient of friction, low coefficient of thermal expansion. Chemically resistant to aggressive environments.
- Chemical / Polymer System Type: PEEK
- Compound Type: Molding Resin
- Deflection Temperature (@ 264 psi, 1.8 MPa): 333 F
- Elongation: 1.9 %
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Supplier: Victrex PLC
Description: and stiffness in a static or dynamic system. Excellent wear resistance, low coefficient of friction, low coefficient of thermal expansion. Chemically resistant to aggressive environments.
- Chemical / Polymer System Type: PEEK
- Coeff. of Thermal Expansion (CTE): 5 to 100 µin/in-F
- Compound Type: Molding Resin
- Deflection Temperature (@ 264 psi, 1.8 MPa): 336 F
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Supplier: Master Bond, Inc.
Description: metals, glass, ceramics, and many plastics. As a thermally conductive adhesive it forms high strength bonds of over 2000 psi tensile shear. EP21AOHT resists a wide range of chemicals including water, oils, fuels, and some solvents over the temperature range of -60°F to +400°F. It also
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 11 to 17 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Master Bond, Inc.
Description: , rigid bonds that resist to thermal cycling and chemicals including water, oils, etc. over the wide temperature range of -60°F to 250°F. The coefficient of thermal expansion is desirably low. The color of part A is gray and part B is clear. Master Bond EP30AN-1 is widely
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 14 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Port Plastics, Inc.
Description: TECAPEEK® SD black uses PEEK as a base resin. PEEK offers excellent properties in terms of wear resistance, low coefficient of friction and low coefficient of thermal expansion. As well PEEK provides excellent strength, stiffness, and excellent dimensional stability for
- Chemical / Polymer System Type: PEEK
- Industry: Electronics, Other
- Material Type / Grade: Thermoplastic
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Supplier: Port Plastics, Inc.
Description: Semitron® ESd 490 HR PEEK uses PEEK as a base resin. PEEK offers excellent properties in terms of wear resistance, low coefficient of friction and low coefficient of thermal expansion. As well PEEK provides excellent strength, stiffness, and excellent dimensional
- Chemical / Polymer System Type: PEEK
- Features: Anti-static
- Filler Material: Carbon / Graphite
- Industry: Electronics, Other
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Supplier: Port Plastics, Inc.
Description: Semitron® ESd 480 PEEK uses PEEK as a base resin. PEEK offers excellent properties in terms of wear resistance, low coefficient of friction and low coefficient of thermal expansion. As well PEEK provides excellent strength, stiffness, and excellent dimensional stability
- Chemical / Polymer System Type: PEEK
- Features: Anti-static
- Filler Material: Carbon / Graphite
- Industry: Electronics, Other
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Supplier: Port Plastics, Inc.
Description: Semitron® ESd 520 HR PAI uses Solvay Torlon® PAI polyamide-imide resin as a base resin. PAI offers PAI greater compressive strength and higher impact resistance than most advanced engineering plastics. High creep resistance and an extremely low coefficient of linear thermal
- Chemical / Polymer System Type: Polyamide-imide (PAI)
- Features: Anti-static
- Material Type / Grade: Thermoplastic
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Supplier: DeWAL
Description: DW 203 is an unsintered PTFE (Polytetrafluoroethy lene) film used primarily for electrical insulation, particularly for wire and cable applications. The polymer is fibrilated giving good strength in the machine direction. It has the inherent benefits of PTFE: exceptional chemical
- Adhesive: None / Non-adhesive
- Backing: Fluoropolymer, Plastic / Polymer, Specialty / Other
- Features: Dielectric / Insulating
- Temperature Resistance: 260 C
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Supplier: Norplex-Micarta
Description: P95 consists of woven glass fabric with polyimide resin. The product is engineered to maintain excellent physical properties at 240°C, making it suitable for high temperature applications. It offers a low coefficient of thermal expansion, as well as high mechanical strength and
- Form / Shape: Film / Sheet
- Industry: Electronics
- Material Type / Grade: Flame Retardant (e.g. UL 94 Rated), UL Approved
- Reinforcement / Filler Material: Fabric, Fiber Glass
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Description: the concrete substrate to which it is applied exhibit very similar coefficients of expansion Advantages Water-based, Low VOC Resistance to impact, wear and thermal shock Breatheable mortar for on or below grade installations High aggregate loading
- Applications: Flooring
- Compressive / Crushing Strength: 500 to 825 psi
- MOR / Flexural Strength: 1300 to 2000 psi
- Max Use Temperature: 70 C
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Supplier: Anton Paar
Description: TORC 5000 features unique technology in a robust and compact instrument and combines this with powerful measurement software. The Thermo-optical Oscillating Refraction Characterization (TORC) technique enables determination of the coefficient of thermal expansion and monitoring
- Accuracy: 2.00E-5 (%)
- Computer Interface: Yes
- Temperature Range: 4 to 125 C
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Supplier: Greene, Tweed & Co.
Description: resistance Aramid fibers low coefficient of friction and thermal expansion; very good toughness; excellent wear and abrasion resistance These reinforcements can also provide various benefits based on their physical configuration. For example, carbon fibers can be produced in
- Chemical / Polymer System Type: PEEK, Specialty / Other
- Filler Material: Aramid Fiber, Carbon / Graphite, Fiber Glass
- Industry: Aerospace, Electric Power, Semiconductor / IC's
- Material Type / Grade: Composite Material, Thermoplastic
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Supplier: Boyd
Description: heat spreader that allows engineers to tailor the coefficients of thermal expansion (CTE) as needed. Due to its flexibility in materials and construction, k-Core® technology can easily replace traditional solid metal conductors or heat spreaders to substantially improve heat
- Device: Passive Heat Sink
- Material: Other Materials
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Supplier: Polyplastics USA, Inc.
Description: thermal expansion coefficient give the resin superior dimensional stability. Electrical properties are also superior, and only small changes in electrical properties are exhibited as a result of moisture absorption. Dielectric breakdown voltage is also high. Both crystalline and
- Chemical / Polymer System Type: Polyester (PET, PBT)
- Coeff. of Thermal Expansion (CTE): 22.22 to 55.56 µin/in-F
- Compound Type: Molding Resin
- Deflection Temperature (@ 264 psi, 1.8 MPa): 403 F
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Supplier: Norplex-Micarta
Description: -bearing capacities equivalent to those of brass and bronze, but will not seize to metal shafts, speeding up bearing replacement and reducing equipment downtime. Compared to thermoplastics, BR70 provides superior load-bearing properties and has a Coefficient of Thermal Expansion
- Coeff. of Thermal Expansion (CTE): 10.83 to 15.33 µin/in-F
- Form / Shape: Film / Sheet
- Industry: General Industrial
- Material Type / Grade: Flame Retardant (e.g. UL 94 Rated), UL Approved
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Supplier: Norplex-Micarta
Description: offer load-bearing capacities equivalent to those of brass and bronze, but will not seize to metal shafts, speeding up bearing replacement and reducing equipment downtime. Compared to thermoplastics, BR60 provides superior load-bearing properties and has a Coefficient of Thermal
- Form / Shape: Film / Sheet
- Industry: General Industrial
- Material Type / Grade: Flame Retardant (e.g. UL 94 Rated), UL Approved
- Polymer Matrix Type: Phenolics
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Supplier: Linseis Inc.
Description: can have a length of 80 up to 100mm. The cross-section of the samples can be 4 x 10mm up to 15 x 15mm. As the used measuring systems are made out of quartz with an expansion coefficient of approx. 5 x 10E-7/K and is thus very small compared to the normal expansion
- Application Software Included: Yes
- Atmosphere Control: Yes
- Computer Interface: Yes
- Cooling Available: Yes
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Supplier: Mitsui Chemicals America, Inc.
Description: PEEK resin and exhibits a stable coefficient of thermal expansion at temperatures up to its Tg. AURUM™ has the highest glass transition temperature of any thermoplastic resin. AURUM™ is a special type of thermoplastic polyimide, developed with Mitsui Chemical's technology. Car
- Chemical / Polymer System Type: Polyimide
- Material Type / Grade: Thermoplastic
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Description: polyacrylate cement base mortars, and as a polymer modifier of Portland Cement. The polymer additive allows these mortars to maintain a thermal coefficient of expansion similar to concrete
- Chemistry: Resin Base / Polymer Binder, Other
- Features: Waterproof / Water Repellant, Other
- Form: Liquid
- Substrate / Surface: Concrete / Masonry
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Supplier: DuPont Electronics & Imaging
Description: clad laminate with superior handling and processing High copper polyimide resistor foil adhesion strength Low coefficient of thermal expansion for flex and rigid multi-layer PCBs Excellent thermal resistance Constructions: Resistivity
- Features: Tested to IPC, UL Listed
- Length: 3 ft
- Materials of Construction: Plastic / Polymer, Polyimide (e.g., Kapton®)
- Temperature Resistance: 180 C
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Description: produce a highly durable mortar or concrete in a short time. Advantages Sets quickly, resists shrinking Rapid installation capability Provides tenacious bond to sound concrete Resists thermal shock, coefficient of expansion similar to concrete
- Cure Type / Technology: Single Component System
- Industry: OEM / Industrial
- Substrate / Material Compatibility: Concrete / Masonry, Metal, Wood / Wood Product
- Use Temperature: 40 to 90 F
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Supplier: DeWAL
Description: DW 203 is an unsintered PTFE (Polytetrafluoroethy lene) film used primarily for electrical insulation, particularly for wire and cable applications. The polymer is fibrillated giving good strength in the machine direction. It has the inherent benefits of PTFE: exceptional chemical
- Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF)
- Filler Material: Unfilled
- Industry: General Industrial
- Material Type / Grade: Dielectric / Electrically Insulating
Find Suppliers by Category Top
Featured Products Top
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Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications.
(read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Zerodur® (Schott Glass) Zerodur® is a glass ceramic with an extremely low thermal expansion coefficient. Zerodur is a glass ceramic made by Schott Glass that is designed and formulated to exhibit (read more)
Browse Glass Fabrication Services Datasheets for Insaco, Inc. -
Key Features: Thermal conductivity exceeds 6 W/(m•K) Applicable in very thin bond lines Low thermal resistance Low coefficient of thermal expansion Used for bonding and sealing applications. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
isolate electric currents, safeguarding equipment against electrical failures. Shock absorption and stress relief: During prolonged use, mechanical stress may arise due to thermal expansion and contraction. The (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Low thermal expansion coefficient compatible with semiconductor devices High thermal conductivity for (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for Fountyl Technologies Pte. Ltd. -
dissipation effect is better than that of the super copper and aluminum. Ceramics are insulated, resistant to high temperatures, oxidation, acid and alkali, cold and thermal shock, and low coefficient of thermal expansion, ensuring stability in high and low temperatures or other harsh environments (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Mismatch): Differing coefficients of thermal expansion (CTE) in bonded or assembled materials can induce high stresses, leading to delamination, cracking, or joint failure. Performance Drift: Electronic (read more)
Browse Environmental Test Chambers and Rooms Datasheets for Guangdong Atmars Industry Co., Limited -
thermal conductivity of 2.3-2.6 W/(m•K). This epoxy exhibits dimensional stability with low shrinkage upon curing and a low coefficient of thermal expansion of 14-16 x 10-6 in/in/°C. Mechanical properties include a tensile strength of 5,000 to 7,000 psi, a tensile modulus greater (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
What are the design considerations for step glass windows? Tolerance control of step height and width. Compatibility with mounting structure. Compatibility of coefficients of thermal expansion. Requirements for flatness and parallelism of optical surfaces. Environmental sealing performance (if required). (read more)
Browse Optical Windows Datasheets for Changchun Yutai Optics Co., Ltd. -
Coefficient of Thermal Expansion. Learn more about product data and key features. (read more)
Browse Encapsulants and Potting Compounds Datasheets for MacDermid Alpha Electronics Solutions
Conduct Research Top
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Unfilled Liquid Crystal Polymers
. cryogenic temperatures without growing brittle, and have a low coefficient of thermal expansion.
More Information Top
Indicates content that may require registration and/or purchase.
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Improving the predictions of injection molding simulation software
in which a and b are the temperature and pressure de- pendence of viscosity, bV and aV are the compressibility and the thermal expansion coefficient polymer .
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The Glass Temperature
… range fictive temperature relaxation spectrum retardation function retardation spectrum crystallization time shear creep compliance equilibrium compliance glassy shear compliance stress relaxation modulus Andrade equation parameter glass temperature depression recoverable shear compliance recoverable shear compliance thermal expansion coefficient ( polymer ) repeat unit structure fractional …
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Broad-band high-efficiency optoacoustic generation using
a novel photonic crystal-metallic structure
As we discussed above, we need effective light absorber and large thermal expansion coefficient polymer material to get an ideal optoacoustic transmitter.
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Auxetic Materials: Functional Materials and Structures from Lateral Thinking!
Similarly, the combination of the auxetic effect with other novel effects, such as in Baughman's semiconducting and negative thermal expansion coefficient polymer auxet- ic molecular networks, should lead to a rich vein of materi- als' functionality.
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Integrated Silicon-Polymer Laterally Stacked Bender for Sensing Microgrippers
The metal heater is deposited on the top of a high thermal expansion coefficient polymer layer.
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Correlation between viscoelastic behavior and cooling stresses in a cured epoxy resin system
This demonstrated the occurrence of additional stresses because of the difference between the ceramic and polymer thermal expansion coefficients .
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Diffusion in polymers below the glass transition temperature: Comparison of two approaches based on free volume concepts
… volume of component 1 specific hole free-volume of component 2 specific hole free-volume of glassy polymer specific volume of glassy polymer specific mteistitial volmne of glassy polymer specific occupied volume of glassy polymer thermal expansion coefficient of the polymer above .
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Hybrid model for the diffusion of simple and complex penetrants in polymers
The polymer free-volume thermal expansion coeffi- cient can be taken equal to the polymer thermal expan- sion coefficient , with the assumption that the polymer thermal expansion is a direct result of the free-volume thermal expansion.
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An Experimental and Theoretical Investigation into the Diffusion of Olefins in Semi‐Crystalline Polymers: The Influence of Swelling in Polymer‐Penetrant Systems
difference of polymer thermal expansion coeffi- cient above and below the glass transition temperature (KÀ1 ) ap0 .
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Biaxial stretching of polymers using a novel and versatile stretching system
thickness, the initial thickness, the temperature gradient and the polymer thermal expansion coefficient .