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Supplier: M.A.E. Apparecchiature Elettroniche srl
Description: CTS45 is a probe for measuring the conductivity in laboratory on samples , length: 45 cm, that offers the possibility to perform a practical and fast measurement of the thermal conductivity (or thermal resistivity) of the medium in which it is inserted at a high accuracy
- Form Factor: Portable / Hand Held / Mobile
- Instrument Type: Conductivity / Resistivity
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Description: The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K. ? Available in various thicknesses from 0.3 to 10.0 mm. ? Highly
- Dielectric Constant (Relative Permittivity): 9
- Dielectric Strength: 2.03E-4 kV/in
- Elongation: 30 %
- Industry: Electronics
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Description: The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m·K. ? High softness and compressibility, providing low assembly stress, ideal
- Chemical / Polymer System Type: Silicone
- Dielectric Constant (Relative Permittivity): 7
- Dielectric Strength: 1.27E-4 kV/in
- Industry: Electronics
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Supplier: M.A.E. Apparecchiature Elettroniche srl
Description: CTS120 is a probe, for measures in the soil (length = 120 cm), that offers the possibility to perform a practical and fast measurement of the thermal conductivity (or thermal resistivity) of the medium in which it is inserted at a high accuracy level. It works in compliance with
- Form Factor: Portable / Hand Held / Mobile
- Instrument Type: Conductivity / Resistivity
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ? Available in various thicknesses from 0.5 to 5.0 mm
- Chemical / Polymer System Type: Silicone
- Dielectric Constant (Relative Permittivity): 9
- Dielectric Strength: 2.03E-4 kV/in
- Elongation: 50 %
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Description: The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K. ? Available in various thicknesses from 0.3 to 10.0 mm. ? Highly
- Dielectric Constant (Relative Permittivity): 8
- Dielectric Strength: 2.03E-4 kV/in
- Elongation: 30 %
- Industry: Electronics
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Description: ISO 23993:2008 gives methods to calculate design thermal conductivities from declared thermal conductivities for the calculation of the thermal performance of building equipment and industrial installations. These methods are valid for operating temperatures
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Description: ISO 13787:2003 establishes a procedure for the determination and verification of declared thermal conductivity, as a function of temperature, of thermal insulating materials and products used for the insulation of building equipment and industrial installations.
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Supplier: Accuris
Description: Thermal insulation products for building equipment and industrial installations - Determination of declared thermal conductivity
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Supplier: Accuris
Description: Thermal insulation products for building equipment and industrial installations - Determination of design thermal conductivity
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Supplier: CSA Group
Description: ISO 23993:2008 gives methods to calculate design thermal conductivities from declared thermal conductivities for the calculation of the thermal performance of building equipment and industrial installations. These methods are valid for operating temperatures
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Supplier: CSA Group
Description: ISO 13787:2003 establishes a procedure for the determination and verification of declared thermal conductivity, as a function of temperature, of thermal insulating materials and products used for the insulation of building equipment and industrial installations.
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Supplier: Accuris
Description: Thermal insulation products for building equipment and industrial installations - Determination of declared thermal conductivity (ISO 13787:2003)
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Supplier: Accuris
Description: Thermal insulation products for building equipment and industrial installations - Determination of design thermal conductivity (ISO 23993:2008, Corrected version 2009-10-01)
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY DTT13 is a one-part dispensable material with thermal conductivity 13.0 W/m*K. High deformation can fill small air gaps perfectly to remove tolerance. It also can overcome overflow and drying problems to increase the thermal conductivity. DTT13 is a great
- Applications & Features: Process Equipment, Aerospace, Automotive / Transportation, Electrical / Electronic, Machinery, Marine, MIL-SPEC / Military, Specialty
- Chemistry / Constituents: Synthetic / Semi-synthetic, Silicone, Specialty / Other
- Operating / Use Temperature: -76 to 356 F
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Supplier: ASTM International
Description: 1.1 This test method covers a general procedure for determining the thermal conductivity of whiteware ceramics over the temperature range from 100 to 300°F (40 to 150°C). 1.2 The values stated in inch-pound units are to be regarded as the standard. The SI (metric) units given in
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Supplier: ASTM International
Description: 1.1 This test method covers the determination of the comparative thermal conductivity of refractories under standardized conditions of testing. This test method is designed for refractories having a conductivity factor of not more than 200 Btu[dot]in./h[dot]ft [dot]°F (2818 W
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Supplier: ASTM International
Description: 1.1 This test method covers the use of a transient hot wire liquid thermal conductivity method and associated equipment (the System) for the determination of thermal conductivity, thermal diffusivity and volumetric heat capacity of aqueous engine coolants,
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Supplier: ASTM International
Description: 1.1 This test method covers the use of a transient hot wire liquid thermal conductivity method and associated equipment (the System) for the determination of thermal conductivity, thermal diffusivity and volumetric heat capacity of aqueous engine coolants,
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty5-s series is a non-silicon thermally conductive material without volatilization of lowmolecular siloxane, and low total volatile gas. With a thermal conductivity of 9.0 W/m*K, the highdeformation can perfectly fill small air gaps to eliminate tolerances. It can
- Applications & Features: Process Equipment, Aerospace, Automotive / Transportation, Electrical / Electronic, Machinery, Marine, MIL-SPEC / Military, Specialty
- Chemistry / Constituents: Synthetic / Semi-synthetic, Specialty / Other
- Operating / Use Temperature: -76 to 302 F
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Description: The heater plate for deposition equipment is an essential component in numerous electronics and manufacturing applications. It can be manufactured using aluminium nitride ceramics, and featured by high thermal conductivity, excellent electrical insulation, and exceptional
- Applications: Chemical / Materials Processing, Electrical / HV Parts, Electronics / RF-Microwave
- Material Type: Aluminum Nitride, Specialty Ceramic
- Shape / Form: Plate / Board (e.g., Fiberboard)
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY G3380 thermal interface grease has low thermal resistance and great thermal conductivity. G3380 has been used extensively in Consumer electronics and Microprocessors for their thermal control techniques. The grease can cover several coats on the component
- Applications & Features: Process Equipment, Aerospace, Automotive / Transportation, Electrical / Electronic, Machinery, Marine, MIL-SPEC / Military, Specialty
- Chemistry / Constituents: Synthetic / Semi-synthetic, Silicone, Specialty / Other
- Operating / Use Temperature: -76 to 356 F
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty3-s series is a non-silicon thermally conductive material without volatilization of low molecular siloxane, and low total volatile gas. With a thermal conductivity of 7.0 W/m*K, the high deformation can perfectly fill small air gaps to eliminate tolerances. It can
- Applications & Features: Process Equipment, Aerospace, Automotive / Transportation, Electrical / Electronic, Machinery, Marine, MIL-SPEC / Military, Specialty
- Chemistry / Constituents: Synthetic / Semi-synthetic, Specialty / Other
- Operating / Use Temperature: -76 to 302 F
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 1-4173 TC Thermally Conductive Adhesive Gray is a one component, solvent free adhesive that is used for bonding electronic components, housings, lids, base plates, and dispensing equipment. It is heat curing, self-leveling, flowable, good thermal conductivity,
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Viscosity: 61000 cP
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 1-4173 Thermally Conductive Adhesive Gray is a one component, solvent free adhesive that is used for bonding electronic components, housings, lids, base plates, and dispensing equipment. It is heat curing, self-leveling, flowable, good thermal conductivity,
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 1.8 W/m-K
- Viscosity: 61000 cP
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Supplier: 3X Ceramic Parts Company Limited
Description: . (4) At high temperature, the nanocrystals are easy to grow and the thermal conductivity decreases. (5) In the gradient coating, the delamination effect is aggravated. (6) It cannot meet the requirements of etching equipment above 300mm.
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Supplier: Henkel Corporation - Industrial
Description: worn parts fast - limits downtime Forms a non-rusting aluminum-like finish Superior adhesion - bonds well to all metal substrates High thermal conductivity Suitable for use in potting applications
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
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Supplier: Lake Shore Cryotronics, Inc.
Description: This epoxy is used to permanently attach test samples or temperature sensors to sample holders. It is a 100% solid, two component, low temperature curing, silver-filled epoxy which features very high electrical and thermal conductivity combined with excellent strength and adhesive
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Supplier: RS Components, Ltd.
Description: , pickup, semiconductor manufacturing equipment, and optical communications equipment. â?¢ PGS has high thermal conductivity, is energy-saving (does not use electricity) and is environmentally friendly (pure carbon). â?¢ Lightweight, flexes easily and is readily cut into
- Chemical / Polymer System Type: Specialty / Other
- Material Type: Pad
- Thermal Conductivity: 1600 W/m-K
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Supplier: Bluestar Silicones USA Corp.
Description: Metal Oxide Thickened Dimethyl Silicone Compound Description Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required.
- Applications: Automotive / Transportation, Process Equipment, Specialty
- Chemistry / Constituents: Silicone
- Density / Specific Gravity (@15.6°C, 60°F): 2.55 specific gravity
- Dielectric Strength: 210000 V/m
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Supplier: 3X Ceramic Parts Company Limited
Description: chip to a substrate or package to establish electrical connections. The heat shield is made from ceramic materials, typically alumina ceramic , zirconia ceramic , aluminum nitride or boron nitride, known for their high thermal conductivity and excellent insulation properties. The main
- Shape / Form: Fabricated / Custom Shape
- Specialty Ceramic Type: Zirconia
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Description: Materials Ceramic Circuit Board is a high-performance electronic substrate made from ceramic materials, typically alumina (Al2O3), aluminum nitride (AlN).Features High Thermal Conductivity: Ceramic circuit boards offer superior heat dissipation compared to traditional PCB materials,
- Type: Component / Subsystem
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Supplier: RS Components, Ltd.
Description: , pickup, semiconductor manufacturing equipment, and optical communications equipment. â?¢ PGS has high thermal conductivity, is energy-saving (does not use electricity) and is environmentally friendly (pure carbon). â?¢ Lightweight, flexes easily and is readily cut into
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Thermal Conductivity: 1600 W/m-K
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Supplier: Morgan Advanced Materials
Description: with high thermal conductivity for fast, accurate temperature readings and reduced fuel consumption Durable, erosion-resistant clay graphite construction for reduced down-time Easy to install – no special tools required Identification HotRod™ sheaths
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Supplier: AENOR
Description: Thermal insulation products for building equipment and industrial installations - Determination of declared thermal conductivity (ISO 13787:2003)
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Featured Products Top
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Challenge: Wastewater from flue gas desulfurization and denitrification in thermal power generation presents a tough treatment challenge due to its high corrosivity, variable pollutant loads, and fine (read more)
Browse Wastewater Treatment Equipment Datasheets for KINTEP NEW POWER -
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pristine cross sections of difficult specimens: brittle materials, multilayer coatings with differences in hardness or thermal expansion, fragile porous materials, polymers and composites, etc. The result is a high-quality cross section with an artifact-free surface, ideal for imaging and (read more)
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The majority of composite wind turbine blades contain adhesive joints. If a composite joint is properly designed, the adhesive can play a very beneficial role as its compliance allows for dimensional mismatch, such as from thermal expansion, and reduces stress concentrations at locations (read more)
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schemes, and they are also available in a chip form. They are easily mounted in packages designed for excellent heat transfer, yielding a characteristic thermal response time much faster than possible with bulk devices requiring strain-free mounting. Additionally, they have been proven very stable (read more)
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The aluminum nitride ceramic sheets provided by Great Ceramic have high thermal conductivity, low dielectric constant and dielectric loss, and excellent mechanical properties, making them one of the most ideal choices for electronic applications. They are widely used in information communication (read more)
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electrode tip . The welding process itself is automatic and requires no further intervention from the operator. Lampert’s precision welding technology delivers precise welds with the highest accuracy while minimizing thermal stress on the workpiece and minimizing deformation (read more)
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This system is top notch for withstanding thermal cycling and shock. Minimal stress is generated when bonding dissimilar substrates. It is white in color, with a service temperature range spanning between -65°F to +400°F. MasterSil 153AO is a great choice for applications involving sensitive optical and electronic components where heat dissipation along with electrical insulation is critical. (read more)
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Conduct Research Top
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Thermal Conductivity
Thermal conductivity refers to the core property of any and all types of material that relate to their capability to conduct heat. This means that the heat transfer in this case happens when material that are not in any form of motion are put together. This transfer of heat or energy is due
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High Thermal Conductivity Interface Materials on Electric Vehicles
vehicles, the "three powers " and the charging piles, we need to release the heat in a timely and effective manner. This is the thermal management material, and the thermal interface material (Thermal Interface Materials, TIM) Plays a very critical role in thermal management.
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Factors that Affect the Thermal Conductivity of AlN Ceramic Substrates
First of all, let's overview AlN Ceramics. AlN is a covalently bonded compound with a stable structure and hexagonal wurtzite structure without the existence of other allotypes. Its crystal structure is the AlN4 tetrahedron produced by the disproportionation of aluminum atoms and adjacent nitrogen
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Using the KD2 Pro and KD2 to Measure Thermal Conductivity of Fluids (.pdf)
The KD2 and KD2 Pro use the transient heated needle to measure thermal properties of solid and fluid media. With this technique, a 30 second heat pulse is applied to a needle, and the temperature response with time is monitored either at the heated needle or at an adjacent needle. The nature
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High Thermal Conductivity Aluminum Nitride (AlN) Ceramic Substrate
Suntech's standard AlN substrates are in thickness 0.385mm, 0.5mm, 0.635mm, 0.8mm and 1.0mm, customized specifications are also available. We are also good at laser scribing, surface grinding, polishing and other machining work.
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Medical Grade Epoxy Offers Thermal Conductivity and Electrical Insulation
Master Bond EP42HT-4AOMed Black is a new two part epoxy created for medical device manufacturing. It is biocompatible and non-cytotoxic, passing both USP Class VI and ISO 10993-5 certifications. This epoxy withstands aggressive chemical sterilants, radiation and repeated cycles of autoclaving.
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Thermal-Mechanical Decoupling by a Thermal Interface Material
elongation, while maintaining the integrity of other properties such as shear strength and thermal conductivity. The shear modulus and elongation of a thermal interface material depend on the structure of the material, which dictates the mechanical and thermal properties. The effect of crosslink density
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Thermal Solution Components
A heat spreader is a device having high thermal conductivity that is used to move heat from a concentrated or high heat flux source to a heat exchanger with a larger cross sectional area, surface area and volume. Heat spreaders can be solid conductors like copper, aluminum, or diamond or they can
More Information Top
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Radiative Contribution to the Thermal Conductivity of Fibrous Insulations
Therefore, Eq 12 was used to compute values of the radiation transmission component {qrt) for samples of fibrous materials measured in the guarded hot plate thermal conductivity equipment .
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The urgent need for widely-accepted test methods for thermal interface materials
This is the main reason why the majority of thermal conductivity equipment cannot be used.
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THERMAL CONDUCTIVITY DETECTORS FOR PROCESS CONTROL
These gases were selected be- cause they differ widely in their thermal characteristics and present a good cross section of the properties most likely to be encountered in the laboratory and in industrial gases ordinarily analyzed by thermal conductivity equip- ment .
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A MULTISTAGE ANALYZER FOR EXHAUST GAS ANALYSIS
Experimental data obtained on thermal conductivity equipment indicated that thermistor detectors were sufficientlysensitive.
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Effects of a coupling agent on the mechanical and thermal properties of ultrahigh molecular weight polyethylene/nano silicon carbide composites
Steady-state measurement of thermal conductivity was performed with thermal conductivity equip- ment (TC-3A, Jingke, Hangzhou, China).
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Biodrying as a biological process to diminish moisture in gardening and harvest wastes
Nitrogen content was analyzed using thermal conductivity equipment (LECO FP-528Ò ), carbon and sulfur were measured by infrared spectrometry equipment (LECO SC 144 DRÒ ), and .
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INTRODUCTORY REMARKS WITH SPECIAL REFERENCE TO TRANSPORT MECHANISMS
The value of (k/L),appears to be established within about 10per cent, and is probably a more nearly valid value for cloth in use on skin than would be ob- tained in laboratory steady-state thermal conductivity equipment , where the air space …
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Thermal Design of a Miniature Guarded Hot Plate Apparatus
If an insulation company wishes to make a small quantity of an experimental product, it frequently would not be feasible to make specimens large enough for the thermal conductivity equipment that is available.
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