Thermal Insulating Epoxy

Description: We have served the optical market since 301 was introduced in 1969.  Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,

• Viscosity: 4,000 to 6,000 cP
• Use Temperature: 527 F
• Coeff. of Thermal Expansion (CTE): 29.444444444444443 to 81.11111111111111 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.84

Description: Toughened, two part epoxy Supreme 11ANHT withstands thermal cycling and is both thermally conductive and electrically insulative.

• Applied Thickness / Gap Fill: 0.002 to 0.004 inch
• Use Temperature: -112 to 400 F
• Thermal Conductivity: 2.88 to 3.1 W/m-K
• Coeff. of Thermal Expansion (CTE): 16.666666666666668 to 19.444444444444443 µin/in-F

Description: Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500°F. It

• Viscosity: 1,000 to 3,000 cP
• Use Temperature: -80 to 500 F
• Coeff. of Thermal Expansion (CTE): 22.220000000000002 to 25 µin/in-F
• Tensile Strength (Break): 11,600 to 12,100 psi

Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile

• Viscosity: 6,000 to 13,000 cP
• Use Temperature: 527 F
• Thermal Conductivity: 0.6 W/m-K
• Coeff. of Thermal Expansion (CTE): 13.88888888888889 to 72.22222222222221 µin/in-F

Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile

• Viscosity: 300,000 to 400,000 cP
• Use Temperature: 572 F
• Thermal Conductivity: 0.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 8.88888888888889 to 37.77777777777778 µin/in-F

Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile

• Viscosity: 45,000 to 75,000 cP
• Use Temperature: 662 F
• Thermal Conductivity: 0.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 18.333333333333332 to 60 µin/in-F

Description: 50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205°C. 50-3122

• Viscosity: 165,000 cP
• Use Temperature: -76 to 401 F
• Thermal Conductivity: 1.442279 W/m-K
• Tensile Strength (Break): 9,500 psi

Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.

• Viscosity: 20,000 to 30,000 cP
• Coeff. of Thermal Expansion (CTE): 13.88888888888889 µin/in-F
• Substrate Compatibility: Ceramic / Glass
• Features: Die Bonding Adhesive / Compound, Electrical Insulation / Dielectric, Gel, Other, Thermal / Heat Conductive, Unfilled

Description: Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling, vibration

• Applied Thickness / Gap Fill: 0.002 to 0.004 inch
• Viscosity: 3,000 to 6,000 cP
• Use Temperature: -100 to 400 F
• Tensile Strength (Break): 4,000 to 6,000 psi

Description: thermal. 8329TCS epoxy has many uses, its excellent conductivity improves thermal management for modern high powered devices which in turn increases their long term reliability. Ideal for thermal management applications where superior bonding strength is required

• Industry: Electronics
• Chemical System: Epoxy (EP)
• Features: Thermal / Heat Conductive
• Cure / Technology: Thermosetting / Crosslinking

Description: Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases.

• Applied Thickness / Gap Fill: 0.003 to 0.005 inch
• Use Temperature: -60 to 250 F
• Tensile Strength (Break): 8,000 to 9,000 psi
• Dielectric Strength: 440 kV/in

Description: MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior shock

• Industry: Electronics (PCB / SMT Assembly)
• Chemical System: Epoxy (EP)

Description: reliability Epoxy encapsulated Small size Fast thermal response time

• Temperature Range: -55 to 135 C
• Resistance (@25°C): 10,000 ohms
• Package / Electrode Type: Bead
• Lead Style: Leadless

Description: reliability Epoxy encapsulated Small size Fast thermal response time

• Temperature Range: -55 to 150 C
• Resistance (@25°C): 100,000 ohms
• Package / Electrode Type: Bead
• Lead Style: Leadless

Description: 50-3115 is a one part thermally conductive electrically insulating epoxy. This epoxy system is designed and engineered for demanding electronic bonding applications. It is formulated with low ionic high performance polymers and new proprietary thermally conductive fillers.

• Use Temperature: 572 F
• Thermal Conductivity: 1.5865069 W/m-K
• Tensile Strength (Break): 1,500 psi
• Dielectric Strength: 369.99999999999903 kV/in

Description: HYSOL ECCOBOND 281 BLK one component epoxy adhesive is formualted for use in applications requiring excellent thermal conductivity. It has high thermal conductivity, good chemical resistance and is electrically insulating. It is designed to not flow or sag even on

• Industry: Electronics
• Features: Thermally Conductive

Description: 10-3092 is a two-component, high strength epoxy adhesive system. This adhesive is formulated with fiberglass for added impact, compression and thermal shock resistance. 10-3092 is a reliable bonding agent with excellent electrical insulation properties. BENEFITS: • Fiberglass

• Viscosity: 1,500 to 9,450 cP
• Use Temperature: -85 to 311 F
• Thermal Conductivity: 0.50479765 W/m-K
• Tensile Strength (Break): 3,000 to 4,000 psi

Description: Offer virtually no water absorption Good insulating and electrical properties Excellent dimensional stability Good temperature and chemical resistance

• Tensile Strength (Break): 50,000 psi
• Use Temperature: 356 F
• Dielectric Strength: 0.01397000000000003 kV/in
• Dielectric Constant: 5

Description: High-performance, tin-free antifouling system SIGMA ALPHAGEN is the family name of a range of tin-free, self-polishing antifoulings, based upon a pure organic binder system. The SIGMA ALPHAGEN range has built a successful and extensive track record both in new-building, maintenance and maintenance.

• Type: Clear Coat / Top Coat
• Features: Coating, Protective
• Chemistry: Epoxy, Resin Base / Polymer Binder
• Industry: Marine, OEM / Industrial

Description: 20-3061 is a 100% reactive epoxy resin system which does not contain any solvents or additives which downgrade physical, thermal, and electrical insulation properties. This is a filled low viscosity system which provides good flow and wet out characteristics. 20-3061 is designed for

• Use Temperature: -76 to 320 F
• Thermal Conductivity: 0.33172417 W/m-K
• Coeff. of Thermal Expansion (CTE): 21.11111111111111 µin/in-F
• Tensile Strength (Break): 8,250 psi

Description: The PROTAVIC® PNE 40824-A and PROTAVIC® PNE 40824-B is a two-component system, solvent free, electrically insulating epoxy adhesive, which is specially designed for protecting the devices from heat, humidity and mechanical damages. The PROTAVIC® PNE 40824-A and PROTAVIC® PNE 40824-B is

• Viscosity: 25,000 cP
• Use Temperature: -55 to 200 F
• Coeff. of Thermal Expansion (CTE): 83.33333333333333 to 88.88888888888889 µin/in-F
• Features: Ceramic / Glass, Electrical Power / HV, Electronics, Encapsulating / Potting, Gel, Metal, Thermal / Heat Conductive

Description: (Known as HYSOL ECCOBOND 281 epoxy paste ) LOCTITE ABLESTIK 281 is a thermally conductive and electrically insulating, one component filled thixotropic paste. It is suitable for use on a wide variety of substrates. It does not contain any solvents and eliminates the need for additional

• Industry: Electronics
• Features: Thermally Conductive

Description: AI Technology ME7155 has thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials having highly mismatched CTE's. It is electrically insulated, reworkable, and alumina filled. ME7155 is also ideal for high power die attach. 10 cc Syringe.

• Viscosity: 276,000 cP
• Thermal Conductivity: 1.7 W/m-K
• Dielectric Strength: 750 kV/in
• Chemical System: Epoxy (EP)

Description: MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound
• Chemical System: Epoxy (EP)

Description: AI Technology EG7655 is an alumina filled, reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). EG7655's high

• Viscosity: 280,000 cP
• Thermal Conductivity: 1.7 W/m-K
• Dielectric Strength: 750 kV/in
• Chemical System: Epoxy (EP)

Description: Henkel Loctite Ablestik A329-1 Epoxy Encapsulant one component is used for insulating applications. It is non-conductive, sag resistant, has good thermal stability, and high temperature performance. 1 gal Can.

• Thermal Conductivity: 0.4 W/m-K
• Features: Encapsulant / Potting Compound
• Chemical System: Epoxy (EP)
• Cure / Technology: Single Component System

Description: Cor-Cote® HT FF HI-TEMP COATING is an epoxy novolacamine, flake filled coating formulated for use under thermal insulation at elevated temperatures and for immersion service in water and hydrocarbon commodities such as gasoline, fuel oil, and diesel fuel at ambient and elevated

• Wet / Applied Thickness: 0.009 to 0.011 inch
• Cure / Dry Temperature: 35 to 100 F
• Operating / Use Temperature: 35 to 120 F
• Dispensing Method: Brush / Roll-on, Sprayable

Description: Normally closed Does not reset automatically Voltage applied With connector cables With epoxy Mylar®-nomex® Switchgear consisting of a mobile and circumferential contact bridge (1), a contact bearing pin (2), a spring snap-in disc (3) and a bimetallic disc (4) which is riveted into one

• High Temperature Set Point: 140 to 356 F
• Maximum Current: 42 amps
• Maximum AC Voltage: 250 volts
• Life Cycles: 300 Number of Cycles

Description: Henkel Loctite STYCAST 2850FT-FR Black, formerly Emerson and Cuming, is a two component, room temperature curing, fire resistant, epoxy encapsulant that is used for components that are exposed to thermal shock and need heat dissipation. It offers a low coefficient of thermal

• Thermal Conductivity: 1.23 W/m-K
• Tensile Strength (Break): 3,300 to 8,400 psi
• Dielectric Strength: 355.60000000000076 to 490.22000000000105 kV/in
• Viscosity: 65,000 to 80,000 cP

Description: LOCTITE ABLESTIK 816H01, Epoxy, Component assembly, Non-conductive adhesive LOCTITE® ABLESTIK 816H01 adhesive is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This adhesive develops strong, durable,

• Features: Electrically Insulating / Dielectric
• Cure / Technology: Single Component System

Description: temperature range than is normally associated with flexible films. High strength film with high thermal conductivity Thin bondline Uniform bondline control Good heat transfer Electrically insulating Provides high strength over a wider temperature range than is normally associated with

• Thermal Conductivity: 1.1 W/m-K
• Chemical System: Epoxy (EP)
• Features: Thermal / Heat Conductive

Description: individual circuit calibration. Options: Special lead materials and lengths Special encapsulants or probe housings Non-standard resistance values and tolerances High accuracy Kynar insulated lead wire Fast thermal response time Low cost Small size Epoxy encapsulated Excellent long-term

Description: LOCTITE ABLESTIK 566, Epoxy Film, Assembly LOCTITE ABLESTIK 566 is designed for bonding materials with mismatched coefficients of thermal expansion. This material is the low temperature curing version of LOCTITE ABLESTIK 561 adhesive. Electrically Insulating Low temperature cure

• Thickness: 0.001 inches
• Adhesive: Epoxy
• Features: Specialty / Other

Description: conductor materials  Multiple adhesive choices (modified epoxy or acrylic) Enabling you the design flexibility to build stacked (multiple layers, different film combinations) to meet your specific requirements.  High-temperature Busbond adhesives can be applied to multiple substrates:

• Features: Abrasion / Scratch Resistant, Adhesive Tape, Dielectric / Insulating, Electronics (PCB, Semiconductor) Tape, Industrial Tape, Other, Single-Sided Adhesive, Specialty / Other, Thermally Insulating / Insulative, UV / Weather Resistant
• Backing: Plastic / Polymer

Description: No Description Provided

• Substrate Compatibility: Ceramic / Glass, Composites, Concrete / Masonry, Dissimilar Substrates, Metal, Paper / Paperboard, Porous Surfaces
• Chemical System: Epoxy (EP)
• Industry: OEM / Industrial
• Features: Other, Room Temperature Curing, Thermal / Heat Insulating