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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Coeff. of Thermal Expansion (CTE): 13.89 to 72.22 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.83
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Thermal / Heat Conductive
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Coeff. of Thermal Expansion (CTE): 8.89 to 37.78 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.9
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
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Supplier: Protavic America, Inc.
Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.
- Coeff. of Thermal Expansion (CTE): 13.89 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging, Other
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Coeff. of Thermal Expansion (CTE): 18.33 to 60 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.9
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
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Supplier: Master Bond, Inc.
Description: Toughened, two part epoxy Supreme 11ANHT withstands thermal cycling and is both thermally conductive and electrically insulative.
- Applied Thickness / Gap Fill: 0.0020 to 0.0040 inch
- Coeff. of Thermal Expansion (CTE): 16.67 to 19.44 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.8
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Coeff. of Thermal Expansion (CTE): 9.44 to 52.78 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.75
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500°F. It
- Coeff. of Thermal Expansion (CTE): 22.22 to 25 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 2.94 to 3.74
- Dielectric Strength: 400 to 450 kV/in
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Supplier: Epoxies Etc...
Description: 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.4
- Dielectric Strength: 480 kV/in
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Thermal / Heat Conductive
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Supplier: Epoxies Etc...
Description: 50-3182 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system ideal
- Coeff. of Thermal Expansion (CTE): 16.67 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 6.4
- Dielectric Strength: 560 kV/in
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass,
- Coeff. of Thermal Expansion (CTE): 20 to 51 µin/in-F
- Cure Type / Technology: Two Component System
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
- Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Paper / Paperboard, Plastic, Rubber / Elastomer, Wood / Wood Product
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Supplier: Protavic America, Inc.
Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.
- Coeff. of Thermal Expansion (CTE): 12.22 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.32 to 4.4
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Filled, Thermal / Heat Conductive
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Supplier: Protavic America, Inc.
Description: Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging.
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4 to 5
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Epoxies Etc...
Description: 50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205°C. 50
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Strength: 370 kV/in
- Features: Electrical Insulating / Dielectric, Filled, Thermal / Heat Conductive
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, OEM / Industrial
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Supplier: Epoxies Etc...
Description: 50-3155 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3155 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system ideal
- Coeff. of Thermal Expansion (CTE): 16.67 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 6.4
- Dielectric Strength: 560 kV/in
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Supplier: Protavic America, Inc.
Description: Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Flexible / Dampening
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Master Bond, Inc.
Description: Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal
- Applied Thickness / Gap Fill: 0.0020 to 0.0040 inch
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.8
- Dissimilar Substrates: Yes
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Supplier: Techsil Limited
Description: MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Thermal / Heat Conductive
- Industry: Electronics
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated
- Coeff. of Thermal Expansion (CTE): 3.06E-5 to 1.22E-4 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
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Supplier: Techsil Limited
Description: MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior shock
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Electronics
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Supplier: Redwood Plastics
Description: Offer virtually no water absorption Good insulating and electrical properties Excellent dimensional stability Good temperature and chemical resistance
- Chemical / Polymer System Type: Phenolics / Formaldehyde Resins (Melamine, etc.), Epoxy
- Filler Material: Unfilled
- Industry: Electronics, Military / Government (MIL-SPEC), General Industrial
- Material Type / Grade: Thermally Insulating
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Supplier: Henkel Corporation - Electronics
Description: HYSOL ECCOBOND 281 BLK one component epoxy adhesive is formualted for use in applications requiring excellent thermal conductivity. It has high thermal conductivity, good chemical resistance and is electrically insulating. It is designed to not flow or sag even on
- Industry: Electronics
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® 6035 is a two component, thermally conductive, epoxy encapsulant used as a thin bondline adhesive and as a low viscosity potting and casting material. Low viscosity, low exotherm, high thermal conductivity, electrically insulative and UL 94 V-0
- Cure Type / Technology: Two Component System
- Dielectric Strength: 475 kV/in
- Elongation: 5 %
- Features: Encapsulating / Potting
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Corrosion and Rust Preventive Coatings - Epoxy Novolacamine, Flake Filled Coating -- Cor-Cote® HT FF
Description: Cor-Cote® HT FF HI-TEMP COATING is an epoxy novolacamine, flake filled coating formulated for use under thermal insulation at elevated temperatures and for immersion service in water and hydrocarbon commodities such as gasoline, fuel oil, and diesel fuel at ambient and elevated
- Chemistry: Resin Base / Polymer Binder, Epoxy
- Cure / Dry Temperature: 35 to 100 F
- Industry: Marine, OEM / Industrial
- Operating / Use Temperature: 35 to 120 F
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Supplier: PPG Protective & Marine Coatings
Description: High-performance, tin-free antifouling system SIGMA ALPHAGEN is the family name of a range of tin-free, self-polishing antifoulings, based upon a pure organic binder system. The SIGMA ALPHAGEN range has built a successful and extensive track record both in new-building, maintenance and maintenance.
- Chemistry: Epoxy, Resin Base / Polymer Binder
- Features: Protective
- Industry: Marine, OEM / Industrial
- Type: Clear Coat / Top Coat
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Supplier: Thermik Corporation
Description: Normally closed Does not reset automatically Voltage applied With connector cables With epoxy Mylar®-nomex® Switchgear consisting of a mobile and circumferential contact bridge (1), a contact bearing pin (2), a spring snap
- Contact Configuration: Switch Type: Normally Closed, NC
- High Temperature Set Point: 140 to 356 F
- Life Cycles: 300 Number of Cycles
- Maximum AC Voltage: 250 volts
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible Thixotropic High viscosity Long work life Easy handling High thermal conductivity Reduced stress
- Cure Type / Technology: Two Component System
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
- Viscosity: 247500 cP
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Supplier: Henkel Corporation - Industrial
Description: temperature range than is normally associated with flexible films. High strength film with high thermal conductivity Thin bondline Uniform bondline control Good heat transfer Electrically insulating Provides high strength over a wider temperature range than is normally associated with
- Chemical / Polymer System Type: Epoxy (EP)
- Thermal Conductivity: 1.1 W/m-K
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Key Features: Thermal conductivity exceeds 6 W/(m•K) Applicable in very thin bond lines Low thermal resistance Low coefficient of thermal expansion Used for bonding and sealing applications. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring the highest thermal conductivity in the Master Bond electrically insulating portfolio—exceeding 6 W/(m·K)—it (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
EP35AOLV is a thermally conductive, electrically insulating compound that withstands aggressive chemicals, such as those found in downhole oil and gas processing. EP35AOLV exhibits superior protection against corrosion in various harsh environments and helps prolong longevity of critical (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. It has a thermally conductive, electrically insulative filler material with ultra small particle sizes. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Supreme 11AOHTLP Product Information Two component, thermally conductive, electrically insulative epoxy for bonding, sealing and coating Key Features Convenient (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
water, fuels and most organic solvents. EP21TCHT-1 has a mix ratio of 100 to 60 by weight. It has a light paste viscosity and is easy to apply. Key Features Thermally conductive, electrically insulative Cryogenically (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Conard produces photo-etched copper and aluminum circuit board heatsinks for commercial and military applications. Component-side heatsinks are photochemically machined, precision drilled, conversion coated, dielectric epoxy coated and silk-screened. Where required, Conard installs detail parts (read more)
Browse Datasheets for Conard Corporation (The) -
Supreme 12AOHT-LO Product Information One part, thermally conductive, electrically insulating, high performance epoxy for bonding and sealing; meets NASA low outgassing specifications Master Bond Supreme 12 (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
Pedigree®, Ripley™, RanVar™, Isonel® and ELAN-Guard® and insulating resins are perfect for keeping your constant voltage transformers in top performance condition day after day. Pedigree® resins offer a long field service history in constant (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC
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The Pro And Cons Of Potting Epoxy For Electronics From Potting Epoxy Manufacturers In China
Potting protects electronic components from harmful elements such as physical shock, moisture, thermal changes, physical tampering, and harsh chemicals. The method is also used to electrically insulate different components, thus ensuring that the electronic lasts long and offers reliable
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Transparent ATO/epoxy nanocomposite coating with excellent thermal insulation property
Preparation of ATO/ epoxy thermal insulation coating: ATO nanoparticles doped with 10 mol% Sb were prepared by the polymer pyrolysis method, as previously reported [16].
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Rapid Rise Hydrocarbon Fires: An Engineering Perspective
To avoid this, a solvent-free epoxy thermal insulating barrier coating can be specified.
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Transient heat transfer from a cable in conduit configuration in subcooled He I and He II
EPOXY THERMAL INSULATION .
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An approach to deal with packaging in power electronics
1; the thermal epoxy insulates the power chips from the heatsink and conducts the heat from the chips to the aluminum block, .
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Deicing investigation of a CNFP-based high-efficiency self-deicing system
In summary, an epoxy thermal insulation substrate, a CNFP thermal source, an AlN ceramic wafer insulated-encapsulation layer, and a MWCNT/cement-based thermal conduction layer were integrated into a self-deicing road system, as shown in figure 1.
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Experimental investigation of road snow-melting based on CNFP self-heating concrete
high-electro-thermal efficient system were fabricated individually and integrated as a whole in this section as the configuration shown in Fig. 1.1, which was consisted of Epoxy thermal insulated layer, CNFP high-efficient thermal source, AlN/Epoxy-based electro-insulated capsulated…
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Construction materials for the building and repair of Power-Generating Structures
V. I. Satdaarov, Foam- Epoxy Thermal Insulation for Structures in Regions Afflicted by Severe Climate [in Russian], Stroiizdat, Leningrad (1980). Yu. t%.
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Temperature conditions and stressed state of a lightened concrete gravity dam operating under conditions prevailing at the Kurpsa hydraulic facility
The preliminary results of computations of the temperature conditions and stressed state of a monolithic concrete gravity dam of reduced section with the lateral faces pro- tected by a metallic shield and foam- epoxy thermal insulation have been obtained in the complex…
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Qualification of UOE Linepipes with Enhanced Collapse Resistance
Usually, subsea pipelines are coated for anticorrosive protection and thermal insulation with epoxies and polyurethane or polypropylene layers and these coating processes typically require the pipe to be light heated for a short period of time, which can be sufficient to promote…
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Qualification of UOE SAWL Linepipes with Enhanced Collapse Resistance for Ultra Deepwater Application
The major pipelines are coated for corrosion protection and thermal insulation with epoxies and polyurethane or polypropylene layers and these coating processes typically require the pipe to be heated between 220 and 250°C for a short period of time, which can be…