Thermoset Adhesive Film

Description: IT700 is a 2.5 mil, polyester film with a thermoset rubber adhesive used for coil banding & wrapping.

• Thickness: 0.0025 inches
• Peel Strength / Adhesion: 2.5 lbs/in
• Backing: PET / Polyester, Plastic / Polymer
• Features: Specialty / Other

Description: 3M™ Scotch-Weld™ Structural Adhesive Film AF 31 is an unsupported, thermosetting structural film adhesive designed for metal-to-metal bonding. It is especially designed for hig10.0 mil unsupported thermosetting adhesive film for structural bonding. High

• Use Temperature: -67 to 500 F
• Industry: Aerospace, OEM / Industrial
• Features: Flexible / Dampening, Single Component System, Specialty / Other, Thermosetting / Crosslinking
• Substrate Compatibility: Metal

Description: 3M™ Scotch-Weld™ Structural Core Splice Adhesive AF 3028 is a 250°F to 350°F (121°C to 176°C) curing, low density, expandable core splice adhesive film. Scotch-Weld AF 3028 adhesive was designed for filling mismatch areas or reinforcing and splicing honeycomb core.

• Applied Thickness / Gap Fill: 0.05 inch
• Use Temperature: -67 to 350 F
• Industry: Aerospace, OEM / Industrial
• Chemical System: Epoxy (EP)

Description: 3M™ Scotch-Weld™ Lightning Strike Structural Adhesive Film AF 163 2LS is thermosetting, laminated metal foil films that adheres to cold and release coated tools.

• Industry: Aerospace, OEM / Industrial
• Substrate Compatibility: Composites
• Chemical System: Epoxy (EP)
• Features: Single Component System, Thermosetting / Crosslinking

Description: LOCTITE® ABLESTIK ECF 561 is designed for bonding materials with mismatched coefficients of thermal expansion. Electrically conductive Flexible Removable

• Thermal Conductivity: 1.6 W/m-K
• Chemical System: Epoxy (EP)
• Industry: OEM / Industrial
• Features: Thermosetting / Crosslinking

Description: Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration is recommended to maximize the shelf life. This

• Use Temperature: -100 to 400 F
• Thermal Conductivity: 1.442279 W/m-K
• Coeff. of Thermal Expansion (CTE): 0.00011111111111111112 to 0.000033333333333333335 µin/in-F
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Optical Grade / Material, Semiconductors / IC Packaging, Tooling / Mold Material

Description: Highly toughened, epoxy-based thermo-foaming film system, co-curable with composite material and designed for edge finish of sandwich panels and complex gap filling. Designed for exterior applications. Highly toughened edge finish core splice for exteriors. Edge finish of sandwich panels.

• Use Temperature: -67 to 350 F
• Industry: Aerospace, OEM / Industrial
• Chemical System: Epoxy (EP)
• Features: Flexible / Dampening, Other, Single Component System, Thermosetting / Crosslinking

Description: LOCTITE ABLESTIK ECF 561, Epoxy Film, Adhesive Film LOCTITE® ABLESTIK ECF 561 is designed for bonding materials with mismatched coefficients of thermal expansion. Electrically conductive Flexible Removable

• Thermal Conductivity: 1.6 W/m-K
• Chemical System: Epoxy (EP)

Description: where thermoset adhesives are typically less effective.

• Industry: Electronics, Semiconductors / IC Packaging
• Features: Film / Sheet, Thermoplastic / Hot Melt, Thermosetting / Crosslinking

Description: Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. It differs from other heat resistant epoxies due to its toughness. FLM36 retains very

• Use Temperature: -100 to 500 F
• Thermal Conductivity: 1.2981 to 1.4423 W/m-K
• Coeff. of Thermal Expansion (CTE): 41.67 to 47.22 µin/in-F
• Tensile Strength (Break): 2,000 to 3,000 psi

Description: Master Bond X-5 is specially formulated, synthetic elastomer-based, one component adhesive for high performance bonding and sealing. This synthetic elastomer based adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics,

• Viscosity: 3,000 cP
• Use Temperature: -75 to 275 F
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
• Substrate Compatibility: Ceramic / Glass, Composites, Metal

Description: have been obtained for thin films of the UV15X-2 polymer system. no solvents or other volatiles are released during the curing process. Cured coatings, adhesives and/or sealants feature a desirable combination of outstanding durability, toughness and thermal shock resistance as well as

• Viscosity: 6,000 cP
• Use Temperature: -60 to 250 F
• Thermal Conductivity: 0.029 W/m-K
• Coeff. of Thermal Expansion (CTE): 39 to 44 µin/in-F

Description: LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental conditions. High adhesion strength at

• Thermal Conductivity: 7 W/m-K
• Chemical System: Epoxy (EP)
• Industry: OEM / Industrial
• Features: Thermosetting / Crosslinking

Description: LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It exhibits low squeeze out during bonding. This product provides high strength over a wider temperature range than is normally

• Thermal Conductivity: 1.1 W/m-K
• Chemical System: Epoxy (EP)
• Industry: OEM / Industrial
• Features: Thermosetting / Crosslinking

Description: CHEMFILM® DF1100 is a multilayer cast PTFE film, fully fused with one surface modified to render it receptive to many conventional adhesives, elastomers, resins and potting compounds. The surface treatment was developed to assure that its application over pure PTFE would not degrade or

• Overall Thickness: 0.001 to 0.005 inch
• Overall Width: 20 to 38 inch
• Tensile Strength (Break): 4,300 psi
• Elongation: 400 %

Description: LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental conditions. LOCTITE ABLESTIK CF 3366 passes

• Viscosity: 7,500 cP
• Coeff. of Thermal Expansion (CTE): 11.38888888888889 µin/in-F
• Chemical System: Epoxy (EP)
• Industry: OEM / Industrial

Description: INFUZENE® is specifically formulated to be a cross-linking adhesive for use during lay-up in vacuum-infused resin marine applications. This product may degrade some thin plastics and films.

• Use Temperature: -30 to 220 F
• Features: Air Setting / Film Drying, Single Component System, Solvent Based (Volatile Organic), Thermosetting / Crosslinking
• Industry: Marine, OEM / Industrial
• Chemical System: Rubber Based / Elastomeric

Description: Product Overview ATROX® CD 560-1 offers excellent substrate compatibility and low Resin Bleed-Out (RBO), ensuring reliable bonding to Pre-Plated Frame (PPF) and copper lead frames. It provides a long pot life of over 24 hours at room temperature and maintains a 12-month shelf life when stored at

• Features: Die Bonding Adhesive / Compound, Electrically Conductive Compound (Adhesive, Grease), Film / Sheet, Grease / Paste, Thermosetting / Crosslinking
• Industry: Electronics, Semiconductors / IC Packaging

Description: 40-3920 is a one component electrically conductive ink. 40-3920 is a silver filled polymer system which exhibits outstanding adhesion to a variety of substrates, such as kapton, mylar, glass, polyester, ceramic, etc. This thick film ink provides excellent conductivity for many electronic

• Viscosity: 9,000 cP
• Use Temperature: -4 to 284 F
• Substrate Compatibility: Ceramic / Glass, Plastic
• Features: Die Bonding Adhesive / Compound, Electrically Conductive, Filled, Flexible / Dampening, Liquid, Room Temperature Curing, Single Component System, Thermosetting / Crosslinking

Description: 40-3914 is a one component electrically conductive ink. This Polymer system was developed to provide a good balance of low cost and high conductivity. This thick film ink provides conductivity for many electronic and industrial applications. 40-3914 exhibits outstanding adhesion to a variety

• Viscosity: 14,000 cP
• Use Temperature: -4 to 275 F
• Substrate Compatibility: Ceramic / Glass, Plastic
• Features: Die Bonding Adhesive / Compound, Electrically Conductive, Filled, Liquid, Room Temperature Curing, Single Component System, Thermosetting / Crosslinking

Description: Aluminum Nitride-filled Thermally Enhanced Film Product Overview STAYSTIK 611 thermoplastic adhesive film is ideal for applications where resistance to high temperature excursions is desired. This adhesive film can be used for die attach in solder sealed, hermetic

• Form / Shape: Film / Sheet
• Industry: Semiconductors / ICs
• Features: Thermoplastic

Description: Aluminum Nitride-filled Thermally Enhanced Film Product Overview STAYSTIK 682 thermoplastic adhesive film is designed for use in a variety of electronic applications, and is characterized by excellent bonding. This film can be used for die attach and/or substrate attach

• Industry: Electronics, Semiconductors / ICs
• Form / Shape: Film / Sheet
• Features: Thermoplastic

Description: SEMICOSIL® 962 TC A/B is a shear-thinning, easydispensing, non-slump, addition-curing, two part silicone rubber that cures at room temperature to a soft, flexible and tacky rubber with excellent thermal conductivity.

• Viscosity: 150,000 cP
• Dielectric Strength: 177.80000000000038 kV/in
• Features: Air Setting / Film Drying, Die Bonding Adhesive / Compound, Gap Filling Sealant / FIP Gasket, Gel, Thermosetting / Crosslinking, Two Component System
• Industry: Electronics

Description: workpiece. Residual adhesive film is water-washed from the part surfaces during rinsing. The parts leave the impregnating process without surface residue and can then be used in production immediately. When used in preparation for plating or painting processes, the impregnation process

• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Chemical System: Ceramic / Inorganic Cement
• Features: Impregnating Resin, Specialty / Other, Thermosetting / Crosslinking

Description: vacuum application. Sealed micro-pores cure without shrinkage to a tough, cross-linked, thermoset polymer, permanently sealing the work piece. Residual adhesive film is washed from the part surfaces by water during the rinsing cycle. The parts leave the impregnating process

• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Chemical System: Ceramic / Inorganic Cement
• Features: Impregnating Resin, Specialty / Other, Thermosetting / Crosslinking

Description: without shrinkage when exposed to elevated temperature to form tough cross-linked thermoset polymer, permanently sealing the workpiece. Residual adhesive film is water-washed from the part surfaces during rinsing. The parts leave the impregnating process without surface residue

• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Chemical System: Ceramic / Inorganic Cement
• Features: Impregnating Resin, Specialty / Other, Thermosetting / Crosslinking

Description: OMEGA's THERMCOAT KIT is used for cementing fine-gage thermocouples in place on metal, plastic and ceramic surfaces and for assembling and installing thermopiles, temperature probes and thermocouple bolometers. THERMCOAT CO and THERMCOAT COL This is a fast-setting two-part cement which should be

• Viscosity: 110 cP
• Use Temperature: -229 to 446 F
• Thermal Conductivity: 0.14644550333623 W/m-K
• Dielectric Strength: 2,000.0000000000002 kV/in

Description: Hydrophobic Oligomers Laminating Adhesive Resins Low Viscosity Oligomers Melamine Acrylate Metallic Acrylate Oligomers Polyester Acrylate Oligomers Pressure Sensitive Adhesive Resins Silicone Acrylate Oligomers Urethane Methacrylates by tradename Sarbox� Specialty Oligomers Sarcryl�

• Material Type: Acid Containing, Acrylics, Epoxides, Esters, Hydroxy Containing, Polyol / Polyureas, Silane / Siloxanes
• Application: Adhesives, Coatings, Composites / Laminates, Inks, Other
• Functional Level: Difunctional, Monofunctional
• Chemical Structure: Oligomer

Description: range of environments Applications include: adhesives for metallic and silicon-based substrates, coupling agent for thermoset and thermoplastic composites, functional micro-particles for adhesives and sealants Enhanced Amine Functional Trialkoxy Silane Silane coupling agents

• Flash Point: 195.8 F
• Features: Metalloids (B, Si, Ge, etc.), Non-Metals (C, N, O, P, S)

Description: Aluminized Polyester Reinforced Aluminized Polyester Urethane Films (matte or impervious) Tedlar® (trademark E.I. Dupont Co.) Perforated Vinyl Convoluted Embossed Customized Facings Available Pressure Sensitive Adhesive: Supported SBR (temps to 140°F) Unsupported Acrylic (temps to

• Bulk Density: 0.7 lbs/ft³
• Tensile Strength: 18 psi
• Elongation: 15 %
• Tear Strength: 0.5 lbs/in

Description: that combine the processing strengths of thermoplastics with the best qualities of thermoset rubbers. As their name suggests, thermoplastics are temperature-sensitive plastics that become soft or fluid when heated, and then harden when cooled. Extruded TPEs and Green Plastics Extruded TPEs

• Size Capabilities: 0.063 to 6 inch
• Materials: ABS, Acrylic, Butyrate, Fiberglass, Nylon / Polyamide, PETG, PPE/PPO, PTFE (Teflon®), PVC, Polycarbonate, Polyethylene (PE, HDPE), Polypropylene (PP), Polystyrene, Polyurethane / Urethane, TPV/TPE/TPO
• Services: Assembly Services, Design Assistance / Review, High Volume Production, Prototype / Short Run, Specialty Packaging, Tool Making
• Secondary Operations: Bending/Forming, Cutting, Drilling/Punching, Printing / Labeling, Tape/Adhesive Application, Water / Abrasive Jet Cutting, Welding