Thermoset Polyurethane Adhesives

Description: PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit

• Viscosity: 5,000 cP
• Use Temperature: -55 to 120 F
• Tensile Strength (Break): 2,000 psi
• Dielectric Constant (Relative Permittivity): 4.41 to 4.63

Description: Polyurethane reactive hot melt adhesive that is moisture-cured to form a tough, strong and virtually thermoset polymer. TECHNOMELT® PUR 508 is a polyurethane reactive hot melt adhesive that is moisture-cured to form a tough, strong and virtually thermoset

• Viscosity: 12,000 cP
• Substrate Compatibility: Ceramic / Glass, Plastic, Wood / Wood Product
• Features: Polyurethane (PU, PUR)
• Cure / Technology: Single Component System, Thermoplastic / Hot Melt

Description: 70-2800 Polyurethane Elastomer Series are a line of high performance urethane prepolymers based on menthane diisocyanate, MDI. They do not contain MOCA or TDI. 70-2800 Urethanes are very low in viscosity, have extremely low shrinkage, and excellent air release properties.

• Viscosity: 1,000 to 3,200 cP
• Substrate Compatibility: Ceramic / Glass, Metal, Plastic
• Features: Die Bonding Adhesive / Compound, Encapsulanting / Potting, Flexible / Dampening, Polyurethane (PU, PUR), Room Temp. Cure / Vulcanizing
• Cure / Technology: Single Component System, Thermosetting / Crosslinking

Description: Solvent-free, moisture curable, liquid polyurethane adhesive used for lamination of sandwich panel elements. LOCTITE® UR 8346RD is a light tan to brown, solvent-free, moisture curable, liquid polyurethane adhesive. It cures to form a tough, strong thermoset

• Viscosity: 5,000 cP
• Substrate Compatibility: Ceramic / Glass, Plastic, Wood / Wood Product
• Features: Polyurethane (PU, PUR)
• Cure / Technology: Single Component System

Description: 3M™ Scotch-Weld™ 3532 B/A Urethane Adhesive is a two-component, polyurethane adhesive which cures at room temperature or with heat to form tough, impact-resistant structural bonds. Provides excellent adhesion to many primed or painted metal and plastic substrates and is designed

• Viscosity: 10,000 to 55,000 cP
• Tensile Strength (Break): 3,000 psi
• Elongation: 96 %
• Industry: Aerospace, OEM / Industrial

Description: AlphaPanel™ Adhesive is a non-toxic water based adhesive that makes installation quick and easy by providing a strong permanent bond when apply foam panels to walls or ceilings. It offers easy clean up and is compatible with all polyurethane and melamine foam products. The tubes

• Industry: Building / Construction
• Substrate Compatibility: Dissimilar Substrates, Paper / Paperboard, Plastic, Porous Surfaces
• Features: Flexible / Dampening, Other, Specialty / Other, Water Based / Latex Dispersion
• Chemical System: Rubber Based / Elastomeric

Description: No Description Provided

• Use Temperature: 230 F
• Substrate Compatibility: Ceramic / Glass, Composites, Concrete / Masonry, Dissimilar Substrates, Metal, Paper / Paperboard, Porous Surfaces
• Features: Epoxy (EP), Other, Polyurethane (PU, PUR), Rubber Based / Elastomeric
• Industry: Medical / Food (Sanitary / FDA), OEM / Industrial

Description: Ashland Pliogrip 7770 Urethane Adhesive is a two component structural adhesive that has excellent adhesion to thermoset composites, carbon fiber composites, and many other materials. Ashland Pliogrip 7770 has superior ambient cure response and well balanced mechanical

• Viscosity: 7,400 to 20,500 cP
• Elongation: 63 %
• Substrate Compatibility: Composites, Metal, Plastic, Wood / Wood Product
• Features: Polyurethane (PU, PUR)

Description: PNU-46202™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit

• Viscosity: 8,000 cP
• Use Temperature: -55 to 120 F
• Tensile Strength (Break): 2,000 psi
• Dielectric Constant (Relative Permittivity): 4.41 to 4.63

Description: PNU-46203™ is an electronics grade, two-component polyurethane adhesive or encapsulant for high temperature resistance. PNU-46203™ is designed for the encapsulation by casting of completed circuit boards. Cured PNU-46203™ is expected to meet the flammability requirements of UL 94, V-0

• Viscosity: 15,000 cP
• Use Temperature: -55 to 125 F
• Dielectric Constant (Relative Permittivity): 6.89 to 7.01
• Substrate Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic

Description: PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit

• Viscosity: 1,500 cP
• Use Temperature: -55 to 125 F
• Dielectric Constant (Relative Permittivity): 4.41 to 4.63
• Substrate Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic

Description: Ashland PLIOGRIP Urethane Adhesive System 7773 is a two component structural adhesive that is used for sealing, repairing, and bonding of thermoplastics, thermoset composites, CFRP, wood, concrete, metal, and other materials. It offers long cure times, odorless, no VOCs, and

• Viscosity: 15,000 to 20,500 cP
• Tensile Strength (Break): 3,770.957823287122 psi
• Elongation: 65 %
• Substrate Compatibility: Composites, Metal, Plastic, Wood / Wood Product

Description: Ashland PLIOGRIP Urethane Adhesive System 7770 is a two component structural adhesive that is used for sealing, repairing, and bonding of thermoplastics, thermoset composites, CFRP, wood, concrete, metal, and other materials. It offers long cure times, odorless, no VOCs, and

• Viscosity: 7,400 to 20,500 cP
• Tensile Strength (Break): 3,770.957823287122 psi
• Elongation: 65 %
• Substrate Compatibility: Composites, Metal, Plastic, Wood / Wood Product

Description: Ashland PLIOGRIP Urethane Adhesive System 7779 is a two component structural adhesive that is used for sealing, repairing, and bonding of thermoplastics, thermoset composites, CFRP, wood, concrete, metal, and other materials. It offers long cure times, odorless, no VOCs, and

• Viscosity: 15,000 to 20,500 cP
• Tensile Strength (Break): 4,206.068341358713 psi
• Elongation: 63 %
• Substrate Compatibility: Composites, Metal, Plastic, Wood / Wood Product

Description: Loctite 30678 clear M-11FL urethane adhesive is compatible with ceramic, glass, metal, thermoplastic and thermoset plastic materials with a 5 day cure time. Provides a 10 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 160 psi and

• Use Temperature: -65 to 250 F
• Features: Polyurethane (PU, PUR)

Description: Loctite M-06FL off-white urethane adhesive is compatible with ceramic, glass, metal, thermoplastic and thermoset plastic materials with a 5 day cure time. Provides a 5 min working time. Works in a mix ratio of 1:2. Delivers great performance with a shear strength of 930 psi and tensile

• Use Temperature: -65 to 250 F
• Features: Polyurethane (PU, PUR)

Description: Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive epoxy systems, the EP21TDCN

• Use Temperature: -100 to 275 F
• Thermal Conductivity: 1.585 W/m-K
• Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
• Tensile Strength (Break): 6,000 to 6,500 psi

Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000

• Use Temperature: -60 to 250 F
• Thermal Conductivity: 0.288 to 0.432 W/m-K
• Coeff. of Thermal Expansion (CTE): 39 to 50 µin/in-F
• Tensile Strength (Break): 3,200 psi

Description: Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy systems,

• Use Temperature: -452 to 250 F
• Thermal Conductivity: 1.585 W/m-K
• Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
• Tensile Strength (Break): 6,000 to 6,500 psi

Description: Also, the highly flexible EP21TDCNFL is easier to remove than most nickel epoxies, making it well suited for repair type applications. Parts A and B are both colored nickel. Master Bond EP21TDCNFL adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave,

• Use Temperature: -452 to 250 F
• Thermal Conductivity: 1.441 W/m-K
• Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
• Tensile Strength (Break): 6,000 psi

Description: 3M™ Scotch-Weld™ Structural Adhesive EC-3587 B/A Gray is a two-part polyurethane that cures at room temperature or with heat to a tough, impact-resistant material. It has excellent adhesion to many metal and plastic substrates. It can be used as structural adhesive, void filler,

• Industry: Aerospace, OEM / Industrial
• Features: Gap Filling Sealant / FIP Gasket, Grease / Paste, Polyurethane (PU, PUR), Room Temp. Cure / Vulcanizing
• Compound Type: Leveling / Filling Compound
• Substrate Compatibility: Metal, Plastic

Description: 20-3235 is a low viscosity urethane modified epoxy adhesive and potting compound.

• Viscosity: 11,000 to 43,000 cP
• Tensile Strength (Break): 6,000 psi
• Dielectric Strength: 449.9999999999993 kV/in
• Features: Die Bonding Adhesive / Compound, Epoxy (EP), Liquid, Polyurethane (PU, PUR), Rubber Based / Elastomeric, Unfilled

Description: Wherever precise mixing and dosing is required, the standard series of MarMax meter mix dispensing machine is used. Are processed among others single- and multi-component adhesives and resins, thermosets, thermoplastics, polyurethane. Exemplary applications of the MarMax

• Dispense Rate: 0.050031565656565656 to 4.002525252525253 L/min
• Media Viscosity: 85 cps
• Application: Adhesive / Silicone, Chemical (Corrosive / Solvent)
• Mounting: Machine Mounted

Description: Vibra-Tite anaerobic retaining compounds are designed to increase shear strength on non-threaded cylindrical metal assemblies. The liquid anaerobic material fills the voids between close-fitting metal parts and cures to a toughened thermoset-plastic which creates a solid one piece assembly.

• Use Temperature: -65 to 400 F
• Cure / Technology: Anaerobic, Single Component System
• Industry: Building / Construction
• Features: Gap Filling Sealant / FIP Gasket, Thread Locker / Retainer

Description: that combine the processing strengths of thermoplastics with the best qualities of thermoset rubbers. As their name suggests, thermoplastics are temperature-sensitive plastics that become soft or fluid when heated, and then harden when cooled. Extruded TPEs and Green Plastics Extruded TPEs

• Size Capabilities: 0.063 to 6 inch
• Materials: ABS, Acrylic, Butyrate, Fiberglass, Nylon / Polyamide, PETG, PPE/PPO, PTFE (Teflon®), PVC, Polycarbonate, Polyethylene (PE, HDPE), Polypropylene (PP), Polystyrene, Polyurethane / Urethane, TPV/TPE/TPO
• Services: Assembly Services, Design Assistance / Review, High Volume Production, Prototype / Short Run, Specialty Packaging, Tool Making
• Secondary Operations: Bending/Forming, Cutting, Drilling/Punching, Printing / Labeling, Tape/Adhesive Application, Water / Abrasive Jet Cutting, Welding

Description: The smart meter market, encompassing electric, water, and gas sectors, is pivotal in shaping a sustainable and connected future. As these meters become integral to our utilities, they face multifaceted challenges. From fluctuating environmental conditions to potential electronic interference, the

• Viscosity: 6,000 cP
• Industry: Aerospace, Military / Government (MIL-SPEC / GG)
• Features: Electronics (PCB / SMT Assembly), Encapsulant / Potting Compound, Liquid, Polyurethane (PU, PUR), Room Temp. Cure / Vulcanizing
• Cure / Technology: Thermosetting / Crosslinking

Description: enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Viscosity: 3,200 to 4,200 cP
• Use Temperature: 266 F
• Thermal Conductivity: 0.2 W/m-K
• Coeff. of Thermal Expansion (CTE): 111.11111111111111 µin/in-F

Description: This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel cartridge dispensing system. These elastomeric systems are suitable for a variety

• Viscosity: 1,500 to 2,200 cP
• Use Temperature: -22 to 257 F
• Thermal Conductivity: 0.297109474 W/m-K
• Coeff. of Thermal Expansion (CTE): 116.66666666666666 µin/in-F

Description: 20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and

• Viscosity: 150 to 17,000 cP
• Use Temperature: -85 to 275 F
• Thermal Conductivity: 1.1538232 W/m-K
• Coeff. of Thermal Expansion (CTE): 90 µin/in-F

Description: good adhesive strength and flexibilityy over a wide temperature range. RECOMMENDED USAGE A filler and sealer for narrow masonry control joints and grooves Helps prevent damage to the joint and its edges

• Applied Thickness / Gap Fill: 0.25 to 1 inch
• Viscosity: 200 to 550 cP
• Use Temperature: -40 to 200 F
• Elongation: 80 %

Description: ENVIROLASTIC AR530 BRUSH GRADE is a 100% solids, fluid applied polyurea elastomer repair material that is based on proprietary polyurea formulation and a modified amine curing mechanism. It can be applied at thicknesses of 30 - 250 mils in consecutive multiple applications. Fast cure short downtime

• Viscosity: 300 cP
• Use Temperature: -20 to 250 F
• Tensile Strength (Break): 2,440 psi
• Elongation: 530 %