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Supplier: Master Bond, Inc.
Description: Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a an ultra low viscosity. This makes it makes it ideal for use in underfill, impregnation and porosity sealing applications, while it also performs well in
- Applied Thickness / Gap Fill: 0.0020 to 0.0060 inch
- Coeff. of Thermal Expansion (CTE): 2.22E7 to 2.50E7 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
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Description: It is a low-viscosity, epoxy adhesive industrial product. After mixing, the two-component epoxy resin is cured at room temperature with minimal shrinkage to form an ultra-clear adhesive tape with excellent impact resistance. The fully cured epoxy resin is resistant
- Cure Type / Technology: Two Component System, Room Temperature Curing
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Description: conventional epoxies. Low viscosity penetrating primer Fast return to service Low VOC Low odor Dry to walk-on within four hours Designed for plural-component application equipment RECOMMENDED USAGE For use over prepared steel or
- Chemistry: Epoxy, Resin Base / Polymer Binder
- Cure / Dry Temperature: 40 to 100 F
- Features: Protective
- Form: Liquid
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Supplier: Master Bond, Inc.
Description: Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as 250°F. It is not premixed and frozen and has unlimited working life at room temperatures.
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): Over 4.5
- Dielectric Strength: Over 450 kV/in
- Dissimilar Substrates: Yes
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP30Med is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a 4 to 1
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 440 kV/in
- Dissimilar Substrates: Yes
- Features: Electrical Insulating / Dielectric, EMI / RFI Shielding Material, Encapsulating / Potting, Filled, Flexible / Dampening, Laminating / Composites, Non-corrosive Cure
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Supplier: Henkel Corporation - Industrial
Description: 2-part, low viscosity, industrial grade epoxy adhesive. It cures at room temperature with minor shrinkage to form an ultra clear adhesive bondline. LOCTITE®EA E-30CL is a clear, colorless to slightly yellowish, 2-part, low viscosity, industrial grade
- Cure Type / Technology: Two Component System
- Industry: Optical Grade / Material
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
- Viscosity: 10000 cP
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Description: Classic underfill, ultra-low viscosity suitable for most underfill applications.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Industry: Electronics
- Viscosity: 360 cP
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Supplier: Henkel Corporation - Electronics
Description: HYSOL® ES1901™ is a fast-setting, toughened, medium viscosity, industrial grade epoxy adhesive. Once mixed, the two-component epoxy cures at room temperature with low shrinkage and forms an ultra clear bondline with excellent peel resistance.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Industry: Electronics
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE® M-31CL Hysol Medical Device Epoxy Structural Adhesive is an ultra clear, low viscosity adhesive that bonds glass, ceramic, metal, and many rigid plastics. Ideal for applications where optical clarity and excellent structural and mechanical properties are
- Industry: Medical / Food (Sanitary / FDA), Optical Grade / Material
- Use Temperature: 65 to 300 F
- Viscosity: 6000 cP
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Supplier: Ellsworth Adhesives
Description: DYMAX Multi-Cure 984-LVUF Conformal Coating Clear is a one component, UV light and room temperature curing coating that bonds well to metal, glass filled epoxies, and ceramics. It offers ultra fluorescing, 100% solids, and low viscosity. 15 L Pail.
- Cure Type / Technology: Single Component System
- Dielectric Strength: 1800 kV/in
- Elongation: 5 %
- Tensile Strength (Break): 6000 psi
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Supplier: Ellsworth Adhesives
Description: DYMAX Multi-Cure 984-LVUF Conformal Coating Clear is a one component, UV light and room temperature curing coating that bonds well to metal, glass filled epoxies, and ceramics. It offers ultra fluorescing, 100% solids, and low viscosity. 1 L Bottle.
- Cure Type / Technology: Single Component System
- Dielectric Strength: 1800 kV/in
- Elongation: 5 %
- Tensile Strength (Break): 6000 psi
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Description: General Polymers TRAFFICOTE #105 SD provides a high build (minimum 1/16”) protective surfacing. By utilizing a high solids, low viscosity binder resin this TRAFFICOTE #105 SD system provides a fluid, self-leveling mixture that is easily spread with a v-notched trowel or v-notched
- Industry: Electronics, OEM / Industrial
- Substrate / Material Compatibility: Concrete / Masonry, Metal, Wood / Wood Product
- Tensile Strength (Break): 2500 psi
- Use Temperature: 50 to 90 F
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Supplier: Dymax
Description: light. The product features low viscosity to rapidly conformal coat printed circuit boards and other electronic assemblies. 984-LVUF has ultra-high fluorescence after curing under black light, so inspection of the bond line is easy with automated vision systems. This thin-layer
- Cure Type / Technology: UV / Radiation Cured (also EB, Light)
- Industry Applications: Other
- Viscosity: 160 cP
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Supplier: Esprix Technologies
Description: Good compatibility with porous silica Low molecular weight provides lower viscosity and higher solids coating solution Inkjet off-line coating solution for paper and textile based materials Inkjet sizepress coating solution for uncoated paper, matte paper
- Industry: Identification / Marking
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Master Bond EP30LP-2 is an optically clear epoxy with superb light transmission properties. This low viscosity, electrical insulator also features outstanding dimensional stability. Featuring easy handling, this compound has a convenient two to one mix ratio by weight or (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
-critical mix ratio of 100 to 5 by weight and offers a variety of cure schedules at moderately elevated temperatures from 140-257°F [60-125°C]. With a mixed viscosity of 2,000-5,000 cps, EP62-1BF can be used for potting small components. Additionally, it has low shrinkage upon curing (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Toughened NASA Low Outgassing Epoxy Derived from Sustainable Ingredients Master Bond Supreme 70CN is a two part epoxy adhesive formulated using a natural, renewable and sustainable ingredient. This moderate viscosity unfilled epoxy is black in color and (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
Semiconductor manufacturing demands extreme precision, cleanliness, and reliability at every stage of production. In these ultra-clean environments, even microscopic contamination can lead to costly defects and reduced yield. Douglas Electrical Components provides advanced hermetic electrical (read more)
Browse Feedthroughs Datasheets for Douglas Electrical Components -
, encapsulation and casting applications. It produces very low smoke levels and is well suited for the computer, aerospace and related industries. This two part epoxy features a convenient one to one mix ratio by weight and cures at room temperature or more quickly at elevated temperatures (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K)] and a volume resistivity exceeding 1014 ohm-cm. EP3UF also (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. It has a thermally conductive, electrically insulative filler material with ultra small particle sizes. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
EP62-1LPSPMed has exceptionally low viscosity, very long open time at room temperature, passes USP Class VI and ISO 10993-5 requirements, and is capable of resisting repeated sterilization. Read more about its properties. (read more)
Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Master Bond, Inc. -
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed to a UV light source emitting a wavelength of 320-365 nm. The adhesive can also undergo a secondary heat curing for (read more)
Browse UV Curing Adhesives Datasheets for Master Bond, Inc. -
Two part epoxy, Master Bond EP88FL, is a low viscosity, optically clear system featuring good flexibility for high performance bonding, coating, sealing and potting. It is easy to use, with a mixing ratio of one to one by weight or volume. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc.
Conduct Research Top
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Epoxy Underfill Chip Level Adhesives
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. One-component epoxy resin adhesive
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Optical Transmission Properties of Adhesives
of wavelengths ranging from 400 to 3000 nm for these adhesives: EP30, MasterSil 151, MB600 and UV15. EP30 shows very good optical clarity with superior light transmission when compared to many other epoxies. It is a low viscosity, two part epoxy, widely used for bonding, coating, sealing and casting
More Information Top
Indicates content that may require registration and/or purchase.
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http://www.polysciences.com/SiteData/docs/201415PROD/fdc6998e52f8c3b4/2014-15%20PRODUCT%20CATALOG.pdf
Used as a replacement for hexenylsuccinic anhydride in Polyscience’ Ultra Low Viscosity Epoxy Embedding Kit, (Cat. #17706) .
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Long-Term Clogging Behavior of Non-Woven Geotextiles with Silty and Gap-Graded Sands
After the test, the soil and geotextile samples were extruded and impregnated with ultra low viscosity epoxy .
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Plant Microtechniques and Protocols
A new epoxy resin has been recently introduced by Electron Microscopy Sciences ( Ultra Bed Low Viscosity Epoxy catalogue # 14310) and Polysciences (Embed-it catalogue # 64-86-8).
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Exterior wood coatings. Part-2: Modeling correlation between coating properties and their weathering performance
After 1 week of degassing, three replicate samples of each coated wood sample were embedded in ultra low - viscosity epoxy resin obtained from Buehler Epo-thin 20-8140-128 and allowed to cure overnight at room temperature.
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Thermal Conductivity of Standard Sands. Part I. Dry-State Conditions
The remaining space in the hypoder- mic tube was filled in with an ultra - low viscosity epoxy resin, which was subsequently cured.
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Effect of stress path on pre-peak damage in rock induced by macro-compressive and -tensile stress fields
Priortopreparingthinslices,thesamplesareimpreg- nated under vacuum with an ULVR ( Ultra Low Vis- cosity Resin) epoxy resin with a fluorescent dye.
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http://dspace.mit.edu/bitstream/handle/1721.1/90036/890139105-MIT.pdf?sequence=2
Loctite E-30CL Hysol ultra clear low viscosity epoxy (29329) was used to bond the brass plates, wires and fittings to the end caps.
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Vascularized osteochondral graft from the medial femoral trochlea: anatomical study and clinical perspectives
The arteries could then be injected with vacuum-treated ultra - low viscosity epoxy resin (Biodur® E20, Biodur® Products, Heidelberg, Germany), either red or blue, with gentle man- ual pressure until good corresponding coloration of the toes occurred.
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Composition and Appearance of Magnesium Silicate Hydrate and Its Relation to Deterioration of Cement‐Based Materials
After a I-year period, the specimens were sliced, impreg- nated with an ultra - low - viscosity epoxy mixture, hardened at 100°C in an oven, and polished with successively finer grades of diamond down to 1-pm grit.
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Calcium Hydroxide Deposition in the Near Interfacial Zone in Plain Concrete
Specimens for SEM examinations were prepared by impreg- nating sliced portions with ultra - low - viscosity epoxy mixtures and polishing on successively finer grades of diamond grit according to the procedure described elsewhere.” .