Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Intel Corporation
Description: /s ports, and four SATA 3 Gb/s ports, fourteen USB 2.0 ports, Legacy PCI, Intel® Rapid Storage Technology enterprise (Intel® RSTe), and hardware XOR acceleration for RAID. These chipsets also offer optional support for Intel® Intelligent Power Node Manager, Intel® Active
-
Supplier: Intel Corporation
Description: /s ports, and four SATA 3 Gb/s ports, fourteen USB 2.0 ports, Legacy PCI, Intel® Rapid Storage Technology enterprise (Intel® RSTe), and hardware XOR acceleration for RAID. These chipsets also offer optional support for Intel® Intelligent Power Node Manager, Intel® Active
-
Supplier: Intel Corporation
Description: /s ports, and four SATA 3 Gb/s ports, fourteen USB 2.0 ports, Legacy PCI, Intel® Rapid Storage Technology enterprise (Intel® RSTe), and hardware XOR acceleration for RAID. These chipsets also offer optional support for Intel® Intelligent Power Node Manager, Intel® Active
-
-
Supplier: Intel Corporation
Description: /s ports, and four SATA 3 Gb/s ports, fourteen USB 2.0 ports, Legacy PCI, Intel® Rapid Storage Technology enterprise (Intel® RSTe), and hardware XOR acceleration for RAID. These chipsets also offer optional support for Intel® Intelligent Power Node Manager, Intel® Active
-
Supplier: QUALCOMM, Incorporated
Description: USB 2.0 Power Management Maximum Input Voltage 4.8V Interface Supported Interfaces USB 2.0 Package Package Type 2.57 x 3.21 x 0.6 mm 0.5 mm pitch WLCSP 6 x 6 x 0.9 mm 0.5 mm pitch QFN
- IC Package Type: WLCSP, QFN
- Interface: USB
- Technology: Bluetooth
-
Supplier: QUALCOMM, Incorporated
Description: Profiles HFP v1.6 USB USB Version USB 2.0 Power Management Maximum Input Voltage 5.5V Interface Supported Interfaces UART USB 2.0 PCM I²S
- IC Package Type: WLCSP
- Interface: I2C, USB
- Technology: Bluetooth
-
Supplier: QUALCOMM, Incorporated
Description: Up to +8dBm output power (typical) -91bBm receiver sensitivity (basic rate, typical) Bluetooth Profiles AVRCP v1.0 A2DP v1.2 DI v1.3 USB USB Version USB 2.0 (Full Speed) USB Support
- IC Package Type: QFN
- Interface: I2C, USB
- Technology: Bluetooth
-
Supplier: QUALCOMM, Incorporated
Description: Bluetooth Version Bluetooth 4.1 Bluetooth Radio Up to +9dBm output power (typical) -92dBm receiver sensitivity (basic rate, typical) Bluetooth Profiles HFP v1.6 AVRCP v1.0 A2DP v1.2 DI v1.3
- IC Package Type: Other
- Interface: I2C, USB
- Technology: Bluetooth
-
Supplier: SFCable.com
Description: to cellular phones, PDAs, digital cameras, modems, or ISDN terminal adapters through your USB port. Simply plug your device into the adapter and the adapter into your PC or Mac. COM ports and Baud rates can be modified to desired set up. Utilizes the FTDI chipset; plug and play,
- Coupling / Adapter: Yes
- Gender: Male / Plug
-
Supplier: SFCable.com
Description: The Sabrent CB-FTDI USB to Serial converter is the perfect solution for transferring data from a PDA or digital camera. The USB to DB9 provides a connection between an available USB port and the more traditional RS-232 serial port found on many devices. This adapter is designed
- Coupling / Adapter: Yes
-
Supplier: Aaeon Systems Inc.
Description: Fanless Embedded Controller With Intel® NM10 Chipset Applications Multimedia Vehicle Digital Signage Features Intel® Atom? D2700 Processor COM x 4 USB2.0 x 4 Gigabit Ethernet x 2 VGA Output Fanless Operation
- Operating System: Microsoft®
- Operating Temperature: 32 to 131 F
- Processor: Intel®
-
Supplier: Aaeon Systems Inc.
Description: Fanless Embedded Controller With Intel QM67 Chipset Applications Machine Control Data Processing Fleet Management Data Management Features Intel Celeron B810 Processor COM x 4 USB2.0 x 4 Gigabit Ethernet x 2 VGA Output Fanless Operation
- Operating Temperature: 32 to 113 F
- Processor: Intel®
-
Supplier: Global American, Inc.
Description: 3308590 - 3.5 Inch Embedded Controller with Intel QM57 Chipset for Intel Core i3/i5/i7 Processors
- Chipset Type: Intel® Chipset
- Features: Real Clock Timer?
- Operating Humidity: 10 to 90 %
- Operating Temperature: 32 to 140 F
-
Supplier: Global American, Inc.
Description: 3.5" Fanless Embedded Controller with Intel 945GSE chipset and Intel Atom N270 processor
- Chipset Type: Intel® Chipset
- CompactFlashTM: Yes
- Features: Real Clock Timer?
- Operating Humidity: 0.0 to 95 %
-
Supplier: Global American, Inc.
Description: The LS-378-G was designed for the 2nd generation Intel Core i7/i5/i3 processors in the rPGA988B socket. The 3.5" SBC based on the Intel QM67 Express chipset and Intel 2nd generation 32 nm Core i7/i5/i3, the Intel processors support HD Graphic 3000 that contains a refresh
- Chipset Type: Intel® Chipset
- Features: Real Clock Timer?
- Operating Humidity: 0.0 to 90 %
- Operating Temperature: 32 to 140 F
-
Supplier: Global American, Inc.
Description: IBase IB960 - Full-Size PICMG 1.3 SBC with Intel Q67 Chipset for 2nd Generation Intel Core i3 /i5 /i7 Desktop Processors
- Chipset Type: Intel® Chipset
- Features: Real Clock Timer?, PICMG Compliant?
- Operating Humidity: 10 to 90 %
- Operating Temperature: 32 to 140 F
-
Supplier: Aaeon Systems Inc.
Description: The AEC-6625 features the support of the Intel® QM57 chipset and 204-pin DDR3 SODIMM system memory to enable max performance. It supports both DVI-D and VGA inputs to give rich and vibrant displays. For more efficient communication, there are two Ethernet ports, six USB ports, a
- Operating Temperature: -4 to 140 F
- Processor: Intel®
-
Supplier: ZTE Corporation
Description: Band 34/39 UMTS: Band 1/2/5/8 CDMA1X/EVDO :BC0 GSM: Band 2/3/5/8 Processor Snapdragon 820 CPU 2.15GHz CPUQuad-core Connectivity USB3.5mm Headphone Interface,Type C,Dual Sim 4FF
- Phone Type: Cellular / Mobile Phone
-
Supplier: Tripp Lite by Eaton
Description: both 32- and 64-bit. Mac OS X versions 10.8.5 and earlier do not support audio over USB 3.0. Mac OS X versions 10.7.x and earlier do not support USB 3.0. Uses DisplayLink DL3500 chipset
- Application: Audio, Computer Cable, Video
- Connector Type: USB Type A
- Standards: RoHS, CE Marking, FCC
- USB Type: USB 3.0
-
Supplier: Advantech
Description: Intel® Xeon® 10th Gen Core™i9/i7/i5/i3 LGA1200, MicroATX with2 DP++/VGA/eDP /6 COM, 2 Gbe LANs/ 2 10GbE Lans/ 4 USB3.2 Gen2/ 6 USB3.0 Gen1, ATX Supports Intel® 10th Gen Xeon/ Core™ i9/i7/i5/i3 processor with Q470E/ W480E/ H420E chipset Four U
- Chipset Type: Intel® Chipset, Other
- Max Speed: 2.2 to 3.8 GHz
- Memory Capacity: 128 GB
-
Supplier: Advantech
Description: (optional) Supports PCIE Gen3, 10 x USB 3.0, 2 USB 2.0, 8 x SATAIII, 1 miniPCIe(mSATA) and dual GbE LAN Supports Intel AMT 11.0 and Intel vPro competent Supports DVI-D,HDMI2.0 ,DP++,eDP,VGAdisplay Four DIMM sockets support up to 64GB DDR4 2133/2400
- Chipset Type: Intel® Chipset, Other
- Max Speed: 2.3 to 3.6 GHz
- Memory Capacity: 64 GB
- Processor / CPU Type: Other
-
Supplier: Advantech
Description: PCIe x1, and 3 x PCI expansion slots Compact design with front-accessible I/O 1 x VGA, 2 x GbE LAN, 4 x USB 2.0, 2 x COM 1 x 3.5" shock-resistant HDD bay Reusable filter and system fan for easy maintenance 300W 80PLUS PSU offers energy savings
-
Supplier: Advantech
Description: 4th Gen Intel® Core™ i7/i5/i3 LGA 1150 Mini-ITX with H81, CRT/DP /DVI/LVDS, 9 COM, 6 USB 3.0, 2 USB 2.0, Dual GbE LAN, PCIe x16 Supports Intel® 4th Gen Core™ i processor (LGA1150) with Intel H81 chipset Two 204-pin SO-DIMM up to 16 GB DDR3 1600 MHz
- Chipset Type: Intel® Chipset, Other
- Max Speed: 2.3 to 3.5 GHz
- Memory Capacity: 16 GB
- Processor / CPU Type: Other
-
Supplier: Tripp Lite by Eaton
Description: external power source is needed. Just connect the cable to your computer and insert the included CD into your computer’s CD drive in order to launch the driver and assign the cable a COM port. It supports USB 2.0 specifications and data transfer speeds up to 230 Kbps, which is almost
- Application: Computer Cable
- Cable Length: 5 ft
- Connector Type: USB Type A
- Operating Temperature: 1.20E-14 to 60 C
-
Supplier: Tripp Lite by Eaton
Description: external power source is needed. Just connect the cable to your computer and insert the included CD into your computer’s CD drive in order to launch the driver and assign the cable a COM port. It supports USB 2.0 specifications and data transfer speeds up to 230 Kbps, which is almost
- Application: Computer Cable
- Cable Length: 2 ft
- Connector Type: USB Type A
- Operating Temperature: 1.20E-14 to 60 C
-
Supplier: Black Box
Description: Small chipset on VGA side enables video conversion. Active adapter supports analog signals. Power comes from the USB 3.1 Type C port. Ideal for mobile devices. Type C connector is symmetrical enabling the dongle to be plugged in up or down.
- Application: Video
- Connector Type: Other
-
Supplier: ACCES I/O Products, Inc.
Description: Features High-Speed USB 2.0 device, USB 3.0 compatible Fifteen independent 16-bit counter/timers (5 x 82C54-10) Clock, gate and out signals from all 15 channels buffered and accessed via 1 connector PC/104 module size (3.550" by 3.775") and mounting
- Agency Approvals: Yes
- Application Software Included: Yes
- Bus Type: USB
- Connector Type: Other
-
Supplier: ACCES I/O Products, Inc.
Description: Features High-speed USB 2.0 multifunction DAQ, USB 3.0 and 1.1 compatible Sustained sampling speeds up to 500kHz 12 or 16-bit resolution A/D converter Flexible, software configured functionality 64 single-ended or 32 differential analog
- Analog Input Channels: 64 #
- Computer Bus: USB
- Connection to Host: USB
- Differential Channels: Yes
-
Supplier: ACCES I/O Products, Inc.
Description: Features High-speed USB 2.0 device, USB 3.0 and 1.1 compatible 16 optically isolated inputs 16 Form C electromechanical 1A relays Internal, removable screw terminal board for easy wiring Small (4" x 4"x 1.4") rugged industrial enclosure
- Application: General Lab and Industrial
- Application Software Included: Yes
- Computer Bus: USB
- Digital I/O Channels: 16 #
-
Supplier: ACCES I/O Products, Inc.
Description: Features Multifunction I/O board with isolated digital I/O and serial communication High-speed USB 2.0 device, USB 3.0 and 1.1 compatible Four optically isolated digital inputs Four Form C electromechanical 1A relays Two serial ports, field
- Connector: DB9
- Network / Bus: USB
- Number of Ports: 4
- Serial Protocol: RS232/422/485
-
Supplier: Synertron Technology, Inc.
Description: CPU 2 x DDR4 SODIMM (Max. 64GB) Multiple Independent display: VGA, HDMI (or DP), eDP or LVDS 3 x Intel GbE LAN, 6 x USB 2.0 4 x COM, 4DI / 4DO, 1 x Mini PCIe, 1 x SIM 1 x M.2 B Key, 1 x M.2 M Key TPM 2.0 (Firmware), SMBus Battery Charger Function (3I110BW) OEM
- Chipset Type: Intel® Chipset
- Communication Networks: Ethernet
- I/O Bus Specifications: USB, Other
- Operating Temperature: -40 to 158 F
-
Supplier: Tripp Lite by Eaton
Description: The U336-U03-GB USB 3.0 SuperSpeed to Gigabit Ethernet NIC Network Adapter allows you to turn a single SuperSpeed USB 3.0 computer port into an RJ45 Gigabit network port. It also creates three new additional USB 3.0 hub ports with each port supporting data
- Data Rate: 1 Gbps
- Number of Ports: 3 #
-
Supplier: Aaeon Systems Inc.
Description: The GENE-QM67 is a 3.5" subcompact board with an on-board Intel® 2nd generation core? i5 mobile/ celeron® processor, that supports SODIMM DDR3 1066/1333, Max. 8 GB, up to 24-bit dual-channel LVDS, DVI . Intel® QM67 chipset provides two SATA 6.0Gb/s, CFast?, 3
- Chipset Type: Intel® Chipset
- Features: RJ-45 Connectors?
- Operating Humidity: 0.0 to 90 %
- Operating Temperature: 32 to 140 F
-
Supplier: American Portwell Technology Inc.
Description: Intel®22nm Quad Core/Dual Core embedded Ivy Bridge 3rd Core i7/i5/i3 CPU and QM77 Chipset Support faster I/O interfaces the seven PCI Express lanes Support four SATA ports include two 3Gbps ports Power sharing technology between CPU and Graphics engine to maximize
- Capacity: 16000 MB
- Features: Watchdog Timer, Speaker Support
- Form Factor: COM Express Basic
- Memory Type: DDR3, SDRAM
-
Supplier: RS Components, Ltd.
Description: This converter changes a USB port into an RS-232 serial communications port with 4 x DB9 Male connectors. Features and Benefits. ·Allows connection to a modem, PDA, GPS, measurement tools, industrial machinery and more. ·Stable chipset PL2303. ·Compatible with
Find Suppliers by Category Top
Featured Products Top
-
transceiver RFIC. The module utilizes a USB 3.0 interface for data and control. The PRM2144X incorporates a 128-element phased array antenna. This antenna is integrated into the PCB and provides uniform performance over the entire IEEE 802.11ad band from 57 to 71 GHz. The Baseband (read more)
Browse RF Transceivers Datasheets for Richardson RFPD -
modules supporting LTE Cat 1 FDD and LTE Cat 1 TDD radio access technology with 3G UMTS/HSPA and 2G GSM/GPRS/EGPRS fallback. They provide a superb global and multi-regional coverage solution in the small LARA LGA form factor (26.0 mm x 24.0 mm, 100-pin). All voice+data modules in the series (read more)
Browse Memory Modules Datasheets for DigiKey -
2.0 interface Also, in order to empower product developers, e-con Systems offers a Model Pack with a sample model (test tube cap detection), configurations, and post-processing modules. They can be loaded using the Edge-CAMView. Read more about EdgeECAM50_USB (read more)
Browse Smart Cameras Datasheets for e-con Systems™ Inc
Conduct Research Top
-
SuperSpeed USB Protocol Verification Probing at 5Gbps (.pdf)
USB 3.0 early adopters will begin testing the next-generation peripheral. interconnect (known as SuperSpeed USB) later this year. Promising ten times. the speed of USB 2.0 and backward compatibility with legacy USB devices,. product verification teams testing these chipsets will face numerous
More Information Top
-
CR4 - Blog Entry: Intel Light Peak - One Cable Fits All
Intel Delays USB 3.0 Chipset until 2012 .
-
Software per chipset — Utilità per identificare il Chipset Intel®
Driver per eXtensible Host Controller Intel® USB 3.0 Intel® Chipset Identification Utility Intel® Chipset Software Installation Utility Tecnologia Intel® Rapid Storage enterprise (Intel® RSTe) Tecnologia Intel® Rapid Storage Mostra tutto Mostra di meno .
-
Shopping In Network Adapters - Big Bruin
Featuring a native NEC host controller chipset , the USB 3.0 ExpressCard adapter is compliant with USB 3.0 standards for data transfer speeds up to 5 Gbps, while still offering backward compatibility with existing USB 2.0 / 1.1 devices.
-
Shopping In Network Adapters - Big Bruin
Featuring a native NEC host controller chipset , the USB 3.0 ExpressCard adapter is compliant with USB 3.0 standards for data transfer speeds up to 5 Gbps, while still offering backward compatibility with existing USB 2.0 / 1.1 devices.
-
Shopping In Network Adapters - Big Bruin
Featuring a native NEC host controller chipset , the USB 3.0 ExpressCard adapter is compliant with USB 3.0 standards for data transfer speeds up to 5 Gbps, while still offering backward compatibility with existing USB 2.0 / 1.1 devices.
-
Shopping - Best Prices On The GigaByte GA-H55N-USB3 Desktop Motherboard - Intel H55 Express Chipset - Socket H LGA-1156 (Mini ITX - 1 x Processor Support - 8 G...
…Motherboard - Intel H55 Express Chipset - Socket H LGA-1156 (Mini ITX - 1 x Processor Support - 8 GB DDR3 SDRAM Maximum RAM - 1.33 GHz Memory Speed Supported - 2 x Memory Slots - Serial ATA/300 - On-board Video Chipset - 2 x USB 3.0 ) .
-
StarTech.com 2 port PCI Express SuperSpeed USB 3.0 Card - 1 Internal 1 External - USB adapter - 2 ports | Softchoice
Featuring a native NEC PCI Express host controller chipset , the new USB 3.0 standard supports transfer rates of up to 5Gbps, while still providing backward compatibility with older USB 2.0 (480Mbps) and 1.1 (12Mbps) devices.
-
Supporto per Chipset Intel® Q45 Express
○ Schede madri con Chipset serie la differenza tra USB 3.0 nelle unità Intel® 6 e 7 per schede madri e kit .
-
Supporto per Chipset Intel® G31 Express
○ Schede madri con Chipset serie la differenza tra USB 3.0 nelle unità Intel® 6 e 7 per schede madri e kit .
-
Supporto per Famiglia di chipset Intel® Serie 4 Express per PC portatili
○ Schede madri con Chipset serie la differenza tra USB 3.0 nelle unità Intel® 6 e 7 per schede madri e kit .