Wafer Plating Equipment

Description: suitable equipment for the final coating process. Plating equipment for connectors and lead frames are designed to meet the demands of low volume and high mix productions as well as selective plating. At Mitomo Semicon Engineering Co. our objective is to produce moduled

• Machinery Type: Batch - Barrel / Tumbler, Batch - Vibratory / Ultrasonic, Continuous Web - Reel to Reel, Rack / Hook System
• Application / Industry: Electrical / Electronic Parts (Connectors, Pins, etc.), Semiconductor / Wafer, Tab / Finger Plating
• Process / Technology: Electroless Plating, Electroplating

Description: Ion Plating equipment of new method which achieves kinds of coating (thick film oxidized film, carbonized film, etc.) with PVD technology, previously only achievable with CVD method. Performs ionization effectively by impact between evaporating particle and thermal electron on

• Applications: CVD / PVD Films

Description: Light Induced Solar Plating of Front-Side Contacts (For Research and development applications) The plating station is 14"x28"x10" deep (approx. 12 gal.) constructed from ½" thick polypropylene with flange. Stainless steel anode fixture with hinge assembly (anode fixture is designed to

• Process / Technology: Electroplating
• Machinery Type: Laboratory / Pilot System
• Application / Industry: Solar / Photovoltaic

Description: Designer for laboratory testing and sampling, Technic’s portable tabletop wafer plating test cell features all the tools needed to simulate full scale production. Specifications 16” long, 12” wide, 14” deep constructed from ½” thick natural polypropylene with flange anode rod as

• Applications: Research / Surface Analysis, Semiconductor Manufacturing

Description: Semiconductor deposition processes use a combination of volatile precursor gases, plasma, and high temperature to layer high quality thin films onto wafers. Deposition chambers and wafer handling tools need durable ceramic components to stand up to these challenging environments.

• Features: Alumina / Aluminum Oxide, Carbide Materials, Specialty Ceramic
• Specialty Ceramic Type: Aluminum Nitride, Silicon Carbide
• Applications: Chemical / Materials Processing
• Shape / Form: Fabricated / Custom Shape

Description: Low cost wet bench design for R&D and low volume applications. Same basic cell and wafer holder design as used on our highly successful SEMCON 1500 and 2000 series. Tool features a single plating cell and dragout rinse cell. Plating and electroforming of wafers or

• Process / Technology: Electroplating
• Machinery Type: Laboratory / Pilot System
• Application / Industry: Semiconductor / Wafer

Description: The IKo™ STATION™ is a self-contained, complete plating system for MEMS and NANO fabrication – wafer installation, cleaning, activation, DI rinsing and electroplating – ideal for a wide range, 2 cm2 to 8″ odd shape substrates and wafers. Easily retrofitted to a cleanroom

• Machinery Type: Batch - Vibratory / Ultrasonic, Laboratory / Pilot System
• Process / Technology: Electrochemical Deposition (ECD), Electroplating
• Application / Industry: Medical Devices, Semiconductor / Wafer
• Features: Specialty / Other

Description: System Overview The SEMCON 4000 is an automatic loading and unloading “wet bench” type wafer Under Bump Metalization tool, designed with processes for Nickel and Gold metalization of silicon and Ga/As wafers with aluminum or copper seed layer. The Semcon 4000 tool is designed with

• Machinery Type: Automated System
• Process / Technology: Electroplating
• Application / Industry: Semiconductor / Wafer, Solar / Photovoltaic

Description: custom engineered OEM components for: Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Electrochemical Plating / Electrochemical Deposition (ECP, ECD) Atomic Layer Deposition (ALD) PEDESTAL HEATERS Heaters for deposition equipment demand uniform thermal distribution

• Heater Type: Ceramic Fiber Heater
• Features: Other

Description: processes use a combination of volatile precursor gases, plasma, and high temperature to layer high quality thin films onto wafers. Deposition chambers and wafer handling tools need durable ceramic components to stand up to these challenging environments. CoorsTek provides custom

• Features: Alumina / Aluminum Oxide, Carbide Materials, Specialty Ceramic
• Specialty Ceramic Type: Aluminum Nitride, Silicon Carbide
• Applications: Chemical / Materials Processing
• Shape / Form: Fabricated / Custom Shape

Description: destructive and non-destructive testing methods, welder and weld procedure qualifications, quality control and quality assurance functions and a diverse range of environmental and construction inspection services. TRIS also provides review, approval and certification of pressure equipment and

• Standards (Test / Certify To): ASME, ASTM, AWS, EPA, MIL-SPEC, NIST, OEM Specific, RoHS
• Materials: Adhesives / Sealants, Ceramics / Glass, Coatings, Composites, Concrete / Mortar, Fuel Cell / Battery Materials, Metals, Paper, Petroleum Fluids (Oil, Fuel, Distillates), Plastic / Rubber, Polymers / Organics, Soil, Textiles, Thin Films / Plating, Toxins / Restrictive Substances, Wafers / Surfaces,
• Industry: Aerospace / Aviation, Automotive, Chemical / Material Processing, Cleanroom, Food / Beverage, Health Care / Medical, Legal / Forensics, Marine, Military, Nuclear / Utility, Packaging, Pharmaceutical / Biotech, Piping / Pressure Vessel, Semiconductors / Electronics, Structural / Construction
• Features: Asbestos / Fibers, Midwest US Only, North America, Northeast US Only, Northwest US Only, Other, Southern US Only, Southwest US Only, Specialty / Other, United States Only

Description: with a new, more compact design and thin wafer technology. The result is a new family of products showing improved efficiency over all load conditions, coming from both the improved thermal characteristics and a lower figure of merit (Q c x V f). Summary of Features Improved figure of merit

• V_F: 1.5 volts
• I_F: 6,000 mA
• I_R: 0.0003 mA
• I_FSM: 54 amps