Products & Services
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Supplier: Metalor Technologies USA Corporation
Description: Our plating processes are developped in strong partnership with our affiliate Mitomo Semicon Engineering Co., plating equipment manufacturer. This enables us to provide a comprehensive service, including the production of precious metal plating solutions and ancillary
- Application / Industry: Electrical / Electronic Parts (Connectors, Pins, etc.), Semiconductor / Wafer, Tab / Finger Plating
- Equipment / System Type: Batch - Barrel / Tumbler, Batch - Vibratory / Ultrasonic, Continuous Web - Reel to Reel, Rack / Hook System
- Process / Technology: Electroless Plating, Electroplating
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Supplier: Technic, Inc.
Description: Light Induced Solar Plating of Front-Side Contacts (For Research and development applications) The plating station is 14"x28"x10" deep (approx. 12 gal.) constructed from ½" thick polypropylene with flange. Stainless steel anode fixture with hinge assembly
- Application / Industry: Solar / Photovoltaic
- Equipment / System Type: Laboratory / Pilot System
- Process / Technology: Electroplating
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Supplier: Technic, Inc.
Description: Designer for laboratory testing and sampling, Technic’s portable tabletop wafer plating test cell features all the tools needed to simulate full scale production. Specifications 16” long, 12” wide, 14” deep constructed from
- Applications & Materials Processed: Semiconductor Manufacturing, Research / Surface Analysis
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Supplier: ECSI Fibrotools
Description: The IKo™ STATION™ is a self-contained, complete plating system for MEMS and NANO fabrication – wafer installation, cleaning, activation, DI rinsing and electroplating – ideal for a wide range, 2 cm2 to 8? odd shape substrates and wafers. Easily retrofitted to
- Application / Industry: Medical Devices, Semiconductor / Wafer
- Equipment / System Type: Batch - Vibratory / Ultrasonic, Laboratory / Pilot System
- Process / Technology: Electrochemical Deposition (ECD), Electroplating, Specialty / Other
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Supplier: ECSI Fibrotools
Description: be easily disassembled for maintenance. The unit is made up of two sections: 1. Electroplating Section Conveniently accessible while preparing wafers for plating. 2. Power Section Rolls over the Electroplating Section for processing. IKo’s
- Application / Industry: Medical Devices, Semiconductor / Wafer
- Equipment / System Type: Batch - Vibratory / Ultrasonic, Laboratory / Pilot System
- Process / Technology: Electrochemical Deposition (ECD), Electroplating, Specialty / Other
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Supplier: ECSI Fibrotools
Description: easily disassembled for maintenance. The unit is made up of two sections: 1. Electroplating Section Conveniently accessible while preparing wafers for plating. 2. Power Section Rolls over the Electroplating Section for processing. IKo’s arrangement of
- Application / Industry: Medical Devices, Semiconductor / Wafer
- Equipment / System Type: Batch - Vibratory / Ultrasonic, Laboratory / Pilot System
- Process / Technology: Electrochemical Deposition (ECD), Electroplating, Specialty / Other
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Supplier: ECSI Fibrotools
Description: The IKo™ TWIN-STATION™ is a self-contained, complete plating system with two entirely separate IKo™ CLASSIC modules for MEMS and NANO fabrication,includin g wafer installation, cleaning and activation with DI rinsing and Nitrogen gun section. Easily retrofitted in
- Application / Industry: Medical Devices, Semiconductor / Wafer
- Equipment / System Type: Batch - Vibratory / Ultrasonic, Laboratory / Pilot System
- Process / Technology: Electrochemical Deposition (ECD), Electroplating, Specialty / Other
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Supplier: Technic, Inc.
Description: Low cost wet bench design for R&D and low volume applications. Same basic cell and wafer holder design as used on our highly successful SEMCON 1500 and 2000 series. Tool features a single plating cell and dragout rinse cell. Plating and electroforming of
- Application / Industry: Semiconductor / Wafer
- Equipment / System Type: Laboratory / Pilot System
- Process / Technology: Electroplating
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Supplier: Technic, Inc.
Description: System Overview The SEMCON 4000 is an automatic loading and unloading “wet bench” type wafer Under Bump Metalization tool, designed with processes for Nickel and Gold metalization of silicon and Ga/As wafers with aluminum or copper seed layer. The Semcon 4000 tool is
- Application / Industry: Semiconductor / Wafer, Solar / Photovoltaic
- Equipment / System Type: Automated System
- Process / Technology: Electroplating
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Supplier: CoorsTek
Description: Everywhere process equipment is exposed to the harsh deposition conditions or contacts wafers needs the inert, durable properties of engineered ceramics. Chamber lids (domes) Chamber liners Deposition rings Gas distribution plates (showerheads) Pedestal
- Applications: Chemical / Materials Processing
- Material Type: Aluminum Nitride, Alumina / Aluminum Oxide, Carbide Materials, Silicon Carbide, Specialty Ceramic
- Shape / Form: Fabricated / Custom Shape
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Supplier: TUV Rheinland of North America
Description: pressure equipment and materials according to European Directives, as well as international codes and requirements. Services are conducted both in our laboratories and at field locations in accordance with multiple national and international accreditations. Depending on your requested service
- Capabilities: Cleanliness Monitoring / Testing, Deformulation / Reverse Engineering, Environmental Exposure Testing, Environmental Testing and Analysis Services, Failure Analysis, Field Sampling, Geotechnical Services, Monitoring Programs (Audits / Surveillance), Quality / Purity (Contamination - Alloys,
- Industry Applications: Aerospace / Aviation, Automotive, Chemical / Material Processing, Cleanroom, Food / Beverage, Health Care / Medical, Legal / Forensics, Marine, Military, Nuclear / Utility, Pharmaceutical / Biotech, Packaging, Piping / Pressure Vessel, Semiconductors / Electronics, Structural / Construction,
- Materials: Adhesives / Sealants, Asbestos / Fibers, Ceramics / Glass, Coatings, Composites, Concrete / Mortar, Fuel Cell / Battery Materials, Metals, Paper, Petroleum Fluids (Oil, Fuel, Distillates), Plastic / Rubber, Polymers / Organics, Soil, Textiles, Thin Films / Plating, Toxins / Restrictive
- Regional Preference: North America, United States Only, Northeast US Only, Southern US Only, Southwest US Only, Northwest US Only, Midwest US Only
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Supplier: CoorsTek
Description: Chamber domes (sometimes referred to as lids) are used to create a clean, inert, and protected environment in deposition chambers. Chemical reactions inside the chamber deposit thin layers of metallic, dielectric, or semiconductive material onto the wafers. Chamber lids and liners are
- Applications: Chemical / Materials Processing
- Material Type: Aluminum Nitride, Alumina / Aluminum Oxide, Carbide Materials, Silicon Carbide, Specialty Ceramic
- Shape / Form: Fabricated / Custom Shape
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Supplier: CoorsTek
Description: deposition equipment demand uniform thermal distribution across the wafer, along with high purity and plasma resistance. CoorsTek heaters are engineered to specific OEM requirements for up to 300 mm wafer diameters. Aluminum nitride (AlN) is commonly used in these heaters based
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Supplier: RS Components, Ltd.
Description: connectors enables them to be used in various combinations offering flexibility in design. Flexible wafer layout options also enable customization. These MULTIGIG RT VITA 46 backplane connectors feature a robust pinless interface for increased reliability and durability, superior crosstalk
- Gender: Male / Plug
- Geometry: Right Angle
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Supplier: RS Components, Ltd.
Description: connectors enables them to be used in various combinations offering flexibility in design. Flexible wafer layout options also enable customization. These MULTIGIG RT VITA 46 backplane connectors feature a robust pinless interface for increased reliability and durability, superior crosstalk
- Gender: Female / Jack
- Geometry: Straight
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Supplier: Infineon Technologies AG
Description: G3, is now combined with a new, more compact design and thin wafer technology. The result is a new family of products showing improved efficiency over all load conditions, coming from both the improved thermal characteristics and a lower figure of merit (Q c x V f).
- Diode Applications: Power Diode
- Diode Type: Schottky Barrier Diodes
- IF: 6000 mA
- IR: 3.00E-4 mA
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, providing fabricators with a transformative solution that combines precision, efficiency, and ease of use. With high-speed plating capabilities of up to 2.5 µm/min, MICROFAB SC-40 PLUS delivers a high purity deposit with exceptional within-wafer, within-die and within (read more)
Browse Plating Chemicals and Anodizing Chemicals Datasheets for MacDermid Alpha Electronics Solutions -
innovation and technological advancement. This latest product represents the next generation within MacDermid Alpha's MICROFAB TS-650 process, enhancing its wafer level packaging (WLP) solder plating portfolio. It provides significant improvements over the existing process including photoresist (read more)
Browse Plating Chemicals and Anodizing Chemicals Datasheets for MacDermid Alpha Electronics Solutions -
required in medical applications. Smoothness combined with low noise and high speed capabilities are necessary to meet the demands of the semiconductor industry. The circular ball path creates smooth, fast and quiet movement often required by high value wafer processing equipment. Special lubricants and (read more)
Browse Datasheets for Modern Linear Incorporated -
processing equipment. Special lubricants and plating options are available to meet the demands of specific semiconductor applications. COMMERCIAL Guide roller technology is an excellent choice for a wide variety of industrial machinery and commercial applications. Components are low (read more)
Browse Linear Bearing Rails Datasheets for Modern Linear Incorporated -
noise and high speed capabilities are necessary to meet the demands of the semiconductor industry. The circular ball path creates smooth, fast and quiet movement often required by high value wafer processing equipment. Special lubricants and plating options are available to meet the demands of (read more)
Browse Linear Bearing Rails Datasheets for Modern Linear Incorporated -
combined with low noise and high speed capabilities are necessary to meet the demands of the semiconductor industry. The circular ball path creates smooth, fast and quiet movement often required by high value wafer processing equipment. Special lubricants and plating options are available to meet (read more)
Browse Linear Bearing Rails Datasheets for Modern Linear Incorporated -
wafer processing equipment. Special lubricants and plating options are available to meet the demands of specific semiconductor applications. COMMERCIAL Guide roller technology is an excellent choice for a wide variety of industrial machinery and commercial applications. Components (read more)
Browse Linear Bearings Datasheets for Modern Linear Incorporated -
semiconductor industry. The circular ball path creates smooth, fast and quiet movement often required by high value wafer processing equipment. Special lubricants and plating options are available to meet the demands of specific semiconductor applications. COMMERCIAL Guide roller (read more)
Browse Datasheets for Modern Linear Incorporated
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Copper Pillar Plating Systems High Speed - Low Heat
This present paper deals with the ever-more stringent requirements of to-date Interconnect Technologies (ICT) from die through final assembly in particular as far as digital and analog high frequencies, undistorted signal propagation and efficient heat propagation are concerned. From wafer level
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Modern Electroplating 5th Edition
Lastly, this section would not be complete if wafer plating equipment were not mentioned.
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Optimization of chemistry and process parameters for void-free copper electroplating of high aspect ratio through-silicon vias for 3D integration
The major manufacturers of wafer plating equipment recently have been developing advanced production systems for TSV filling.[10,11] Most of these tools have features which are designed to maximize the convective flow and minimize the fluid boundary layer at the wafer …
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Characteristics of high frequency fundamental rectangular quartz crystal resonators
At this stage, the wafers are ready for tuning to frequency which occurs by evapo- ration of gold on an automatic wafer plating equipment (11).
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Batch fabrication of AT-cut crystal resonators up to 200 MHz
Final tuning is performed in an automatic wafer plating equipment .
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Rear metalization Wafer‐basierter Si‐Solarzellen by means of EB‐PVD
AbbilDung 1: carrier-in- line installation for wafer backside coating .
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Post exposure bake unit equipped with wafer-shape compensation technology
To overcome this problem concerned with wafer shape during PEB processing, we have developed the new hot plate equipped with the wafer shape compensation technology.
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EXTRUDED SHEETING MATERIALS: Plastic Distributor & Fabricator
Applications include semiconductor wafer processing equipment , plating and etching tanks, and ventilation equipment.
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Introduction into the semiconductor-circuit technology
Principal representation of a Sputter installation for coating of wafer surfaces .
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Introduction into the semiconductor-circuit technology
Principal representation of a Sputter installation for coating of wafer surfaces .
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Introduction into the semiconductor-circuit technology
Principal representation of a Sputter installation for coating of wafer surfaces .