Waviness Measurement

Description: IEC 62899-402-2:2020(E) describes the measurement methods of the edge waviness of printed patterns in printed electronics. This document includes the measurement procedure, as well as the definition of edge waviness and related attributes such as average edge, touch edge

Description: IEC 62715-6-22:2023 specifies the standard measurement conditions and methods for determining the surface crease and waviness for the evaluation of foldable displays. The measurement methods are used to specify the extent of geometrical distortions in foldable display surfaces.

Description: Flexible display devices Part 6-22: Crease and waviness measurement methods

Description: Measurement of the depth of waviness by means of electrical contact stylus instruments

Description: Flexible display devices \x96 Part 6-22: Crease and waviness measurement methods

Description: Printed electronics Part 402-2: Printability \x97 Measurement of qualities \x97 Edge waviness

Description: This Standard is concerned with the geometric irregularities of surfaces. It defines surface texture and its constituents: roughness, waviness, and lay. It also defines parameters for specifying surface texture. The terms and ratings in this Standard relate to surfaces produced by such means

Description: This Standard is concerned with the geometric irregularities of surfaces. It defines surface texture and its constituents: roughness, waviness, and lay. It also defines parameters for specifying surface texture. The terms and ratings in this Standard relate to surfaces produced by such means

Description: 1.1 This test method covers data collection and analysis procedures to determine surface flatness and levelness by calculating waviness indices for survey lines and surfaces, elevation differences of defined wheel paths, and levelness indices using SI units. Note 1-This test method is the

Description: 1.1 This test method covers data collection and analysis procedures to determine surface flatness and levelness by calculating waviness indices for survey lines and surfaces, elevation differences of defined wheel paths, and levelness indices using SI units. Note 1-This test method is the

Description: provides a computer program for waviness index calculations based on this test method. 1.2 The values stated in inch-pound units are to be regarded as standard. No other units of measurement are included in this standard. 1.3 This standard does not purport to address all of the

Description: This article studies the effects of tooth surface waviness and sliding friction on the dynamics and radiated structure-borne noise of a spur gear pair. This study is conducted using an improved gear dynamics model while taking into account the sliding frictional contact between meshing teeth.

Description: The Proforma 300SA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning for thickness, thickness variation, bow

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Wafer Probing System, Sensor / Sensing Element
• Maximum Wafer / Part Size: 300 mm

Description: 1.1 This test method covers data collection and analysis procedures to determine surface flatness and levelness by calculating waviness indices for survey lines and surfaces, elevation differences of defined wheel paths, and levelness indices using SI units. Note 1: This test method is

Description: Decribes a filtering method for use with surfaces having stratified functional properties. The surfaces have a relatively small amount of waviness. This filtering method suppresses the valley influence on the reference line such that a more satisfactory line is generated.

Description: Roughness (Ra) overthe full surface with results comparable to an AFM, but in a fraction of the time. You can achieve repeatablenano and micro waviness measurements when measuring the same target on different machines and the capability to not only find defects, but to classify

• Applications: Data Storage / Memory
• Form Factor: Monitor / Instrument
• Measurement Capability: Defects / ADC, Roughness / Waviness, Shape / Flatness, Thickness - Wafer / Disc (TTV)
• Mounting / Loading: Floor Mounted / Stand-alone

Description: A small, lightweight, and extremely easy to use surface roughness measurement instrument that lets you view surface roughness waveforms right on a color LCD screen. The popular Surftest SJ-210 is a user-friendly surface roughness measurement instrument designed as a handheld tool that

• Display & Special Features: Computer Interface / Networkable, Digital Readout, Video / Graphic Display
• Industrial Applications: Mechanical Parts (Bearings, Shafting)
• Measurement Capability: Waviness Parameters (Wa,Wt )
• Mounting / Loading: Handheld / Portable

Description: , WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically

• Applications: Semiconductor Wafers, Other
• Measurement Capability: Defects / ADC, Roughness / Waviness
• Technology: Profilometer / AFM, X-ray Diffractometer

Description: Decribes a filtering method for use with surfaces having stratified functional properties. The surfaces have a relatively small amount of waviness. This filtering method suppresses the valley influence on the reference line such that a more satisfactory line is generated.

Description: Automated Wafer Thickness Measurement System Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution) Wafer 4” to 12” (100 to 300mm) Thickness range: 50um to 3mm

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 100 to 300 mm
• Measurement Capability: Roughness / Waviness, Thickness - Wafer / Disc (TTV)

Description: The XE-WAFER is a fully automated industrial AFM designed specifically to address surface roughness, trench width, depth, and angle measurements on 200mm & 300mm wafers in a production environment. The system provides superior accuracy and precision nanometrology over any other system in the

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Measurement Capability: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
• Mounting / Loading: Floor Mounted / Stand-alone

Description: The APM650™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Depth Profiling: Yes
• Form Factor: Monitor / Instrument

Description: Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series’ decoupled

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Measurement Capability: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
• Mounting / Loading: Floor Mounted / Stand-alone

Description: The MSA-500 Micro System Analyzer is the premier measurement technology for the analysis and visualization of structural vibrations and surface topography in micro structures such as MEMS (Micro-Electro-Mecha nical Systems) devices. By fully integrating a microscope with Scanning Laser

• Applications: Other
• Form Factor: Sensor / Sensing Element
• Measurement Capability: Roughness / Waviness, Shape / Flatness, Other
• Mounting / Loading: Manual Loading

Description: , sidewall slope, and line width characterization. The completely automated XE-LCD is designed for characterization of flat panel displays as either an in-line or off-line inspection tool. • Automatic Non-Contact AFM measurement • Automatic navigation and focusing

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Measurement Capability: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
• Mounting / Loading: Floor Mounted / Stand-alone

Description: The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Wafer Probing System, Sensor / Sensing Element
• Maximum Wafer / Part Size: 76 to 300 mm

Description: time and more adjustment work. Within the "mobile surface metrology" range, MarSurf M 400 provides the necessary range of functions, while at the same time being quick and easy to use. Features Mobile and stationary measuring instrument Roughness and waviness

• Display & Special Features: Digital Readout
• Measurement Capability: Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (Wa,Wt )
• Mounting / Loading: Handheld / Portable
• Scan Rate: 0.0079 to 0.0394 in/sec

Description: The Rigaku MFM65 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 200 to 300 mm
• Measurement Capability: Composition, Particle Contamination, Roughness / Waviness, Thickness - Film / Layer

Description: image interpretation. Some examples are Fibermetric - automated measurements and classification of fiber and filter samples, 3D Roughness Reconstruction, and Automated Image Mapping - an automated way of collecting high-resolution overview images. A large variety of sample holders is

• Applications: Semiconductor Wafers, CVD / PVD Films, Packaged ICs / Ceramic Substrates
• Area Mapping: Yes
• FIB / Ion Mill: Yes
• Form Factor: Monitor / Instrument

Description: Convenient measuring station for surface measurements All SURFCOM machines in the 1500 to 2900 series use the same base column. The only difference is the sensors. With the purchase of additional sensors, you can turn your surface measuring instruments into a contour measuring

• Display & Special Features: Computer Interface / Networkable, SPC / Software Capability
• Measurement Capability: 3D / Areal Topography, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (Wa,Wt )
• Mounting / Loading: Benchtop
• Standards Compliance: ASME, ISO / EN, DIN, JIS, Other

Description: Topography measurements up to seven times faster than systems with a spindle drive Can be used with numerous sensors: surface, contour, hybrid and white light sensors Topography function or lead twist measurement function quickly upgradeable on site Optional

• Display & Special Features: Computer Interface / Networkable, SPC / Software Capability
• Measurement Capability: 3D / Areal Topography, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (Wa,Wt )
• Mounting / Loading: Benchtop
• Standards Compliance: ASME, ISO / EN, DIN, JIS, Other

Description: The NewView™ 9000 3D optical surface profiler provides powerful versatility in non-contact optical surface profiling. With the system, it is easy and fast to measure a wide range of surface types, including smooth, rough, flat, sloped, and stepped. All measurements are nondestructive, fast

• Application: Profile Measurement, Digitizing / Imaging
• Control: Manual, PC
• Machine Type and Specifications: 3-D Scanning / Profiling
• Mounting Options: Benchtop

Description: , roughness and waviness, thin films, step heights and more on virtually any surface and material, Nexview NX2 truly is the no-compromise profiler. As the latest generation flagship, Nexview™ NX2 provides a wide range of differentiated features targeted at making users' metrology better

• Application: Profile Measurement, Digitizing / Imaging
• Control: PC
• Machine Type and Specifications: 2-D Scanning / Profiling, 3-D Scanning / Profiling
• Mounting Options: Free Standing

Description: Topography measurements up to seven times faster than systems with a spindle drive Can be used with numerous sensors: surface, contour, hybrid and white light sensors Topography function or lead twist measurement function quickly upgradeable on site Optional rotation tracing driver

• Display & Special Features: Computer Interface / Networkable, SPC / Software Capability
• Measurement Capability: 2D / Line Profiles, 3D / Areal Topography, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (Wa,Wt )
• Mounting / Loading: Benchtop
• Standards Compliance: ASME, ISO / EN, DIN, JIS, Other

Description: CNC measuring station for combined contour and surface measurements Exact, universal and dynamic – SURFCOM 5000 is the flagship for contour and surface measuring technology from Carl Zeiss and is the benchmark for accuracy and speed. SURFCOM 5000 measures surface parameters

• Display & Special Features: Computer Interface / Networkable, SPC / Software Capability
• Measurement Capability: 3D / Areal Topography, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (Wa,Wt )
• Mounting / Loading: Floor / Free Standing
• Standards Compliance: ASME, ISO / EN, DIN, JIS, Other

Description: measurement of all surface imperfections. The IQ-S is a specially designed instrument built specifically to match automotive interior gloss measurement standards. In addition IQ-S gloss measurements are fully compatible with existing Micro-TRI-gloss - S results. Dualgloss 20/60°

• Property Measured: Gloss, Haze, Other

Description: where the housing distortion valleys are deep and narrow. Simulation with housing transverse waviness shows that increasing spring force can lead to an unexpected increase in internal oil consumption. Roughness and O-ring friction can also increase significantly internal consumption for small

Description: of measuring times for accurate pressure fluctuation analyses in the model; g) redefine definition for the transposition of pressure fluctuations to prototype; h) update to surface waviness requirements in prototype; i) redefining methods/references in clause on cavitation nuclei content