Waviness Measurement

Description: Flexible display devices Part 6-22: Crease and waviness measurement methods

Description: Flexible display devices \x96 Part 6-22: Crease and waviness measurement methods

Description: IEC 62715-6-22:2023 specifies the standard measurement conditions and methods for determining the surface crease and waviness for the evaluation of foldable displays. The measurement methods are used to specify the extent of geometrical distortions in foldable display surfaces.

Description: Measurement of the depth of waviness by means of electrical contact stylus instruments

Description: IEC 62899-402-2:2020(E) describes the measurement methods of the edge waviness of printed patterns in printed electronics. This document includes the measurement procedure, as well as the definition of edge waviness and related attributes such as average edge, touch edge

Description: Draft BS IEC 62715-6-22 Flexible display devices Part 6-22: Crease and waviness measurement methods for foldable displays

Description: This Standard is concerned with the geometric irregularities of surfaces. It defines surface texture and its constituents: roughness, waviness, and lay. It also defines parameters for specifying surface texture. The terms and ratings in this Standard relate to surfaces produced by such means

Description: This Standard is concerned with the geometric irregularities of surfaces. It defines surface texture and its constituents: roughness, waviness, and lay. It also defines parameters for specifying surface texture. The terms and ratings in this Standard relate to surfaces produced by such means

Description: to inch-pound Test Method E1486.Note 2-This test method was not developed for, and does not apply to clay or concrete paver units. 1.1.1 The purpose of this test method is to provide the user with floor tolerance estimates as follows: 1.1.1.1 Local survey line waviness and overall surface

Description: to inch-pound Test Method E1486.Note 2-This test method was not developed for, and does not apply to clay or concrete paver units. 1.1.1 The purpose of this test method is to provide the user with floor tolerance estimates as follows: 1.1.1.1 Local survey line waviness and overall surface

Description: This article studies the effects of tooth surface waviness and sliding friction on the dynamics and radiated structure-borne noise of a spur gear pair. This study is conducted using an improved gear dynamics model while taking into account the sliding frictional contact between meshing teeth.

Description: The Proforma 300SA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning for thickness, thickness variation, bow,

• Maximum Wafer / Part Size: 300.00000000000006 mm
• Measurements: Area Mapping, Roughness / Waviness, Shape / Flatness, Thickness - Wafer / Disc (TTV)
• Technology: Capacitance / EM Gage
• Mounting / Loading: Manual Loading

Description: Decribes a filtering method for use with surfaces having stratified functional properties. The surfaces have a relatively small amount of waviness. This filtering method suppresses the valley influence on the reference line such that a more satisfactory line is generated.

Description: Decribes a filtering method for use with surfaces having stratified functional properties. The surfaces have a relatively small amount of waviness. This filtering method suppresses the valley influence on the reference line such that a more satisfactory line is generated.

Description: Roughness (Ra) overthe full surface with results comparable to an AFM, but in a fraction of the time. You can achieve repeatablenano and micro waviness measurements when measuring the same target on different machines and the capability to not only find defects, but to classify

• Applications: Data Storage / Memory
• Measurements: Defects / ADC, Roughness / Waviness, Shape / Flatness, Thickness - Wafer / Disc (TTV)
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: A small, lightweight, and extremely easy to use surface roughness measurement instrument that lets you view surface roughness waveforms right on a color LCD screen. The popular Surftest SJ-210 is a user-friendly surface roughness measurement instrument designed as a handheld tool that

• Profile Vertical Range: 0.7 to 1 inch
• Display & Special Features: Computer Interface / Networkable, Digital Readout, Video / Graphic Display
• Technology: Contact / Stylus Based
• Features: Form Measurement, Waviness Parameters (W_a,W_t )

Description: XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution

• Measurements: Defects / ADC, Roughness / Waviness
• Features: Other
• Technology: Profilometer / AFM, X-ray Diffractometer
• Applications: Semiconductor Wafers

Description: Within the "mobile surface metrology" range, MarSurf M 400 provides the necessary range of functions, while at the same time being quick and easy to use. Features Mobile and stationary measuring instrument Roughness and waviness measurements Traversing lengths up to 26 mm Over 50 R , W

• Vertical (Z) Range: 0.009842525 to 0.029527575 inch
• Vertical (Z) Resolution: 0.00000003149608 inch
• Traverse Length: 1.0236226 inch
• Scan Rate: 0.0078740157480315 to 0.0393700787401575 in/sec

Description: high-accuracy measurements, ease of use, and fast measurements, all at an attractive price point that make it the ideal choice for versatility and value in 3D optical profilers. Some of the differentiated features targeted at making users' metrology better, faster, and more reliable:

• Features: 3-D Scanning / Profiling, Digitizing / Imaging, Profile Measurement
• Mounting Options: Benchtop
• Control: Manual, PC

Description: Automated Wafer Thickness Measurement System Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution) Wafer 4” to 12” (100 to 300mm) Thickness range: 50um to 3mm Extended warpage range up to 5mm Throughput up to 120

• Maximum Wafer / Part Size: 100 to 300.00000000000006 mm
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument
• Features: Non-contact

Description: The Rigaku MFM65 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to

• Maximum Wafer / Part Size: 200 to 300.00000000000006 mm
• Measurements: Composition, Particle Contamination, Roughness / Waviness, Thickness - Film / Layer
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: The MSA-500 Micro System Analyzer is the premier measurement technology for the analysis and visualization of structural vibrations and surface topography in micro structures such as MEMS (Micro-Electro-Mechanical Systems) devices. By fully integrating a microscope with Scanning Laser-Doppler

• Mounting / Loading: Manual Loading
• Features: Non-contact, Non-destructive, Other
• Technology: Optical / Imaging System
• Measurements: Roughness / Waviness, Shape / Flatness

Description: non-destructively • Immunity from parameter-dependent results observed in tapping imaging Precision Critical Angle Measurements • Precision calibration of Z-scan orthogonality • Provides the angle measurement accuracy of less than 0.1 degrees • Fully automatic Critical Angle

• Measurements: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument
• Features: Non-contact, Non-destructive

Description: non-destructively • Immunity from parameter-dependent results observed in tapping imaging Complete 3D Metrology of Sidewall • Sidewall roughness measurement • Critical angle measurement of sidewalls • Critical dimension measurements of vertical sidewalls High Throughput Inline

• Measurements: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument
• Features: Non-contact, Non-destructive

Description: The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a

• Maximum Wafer / Part Size: 76 to 300.00000000000006 mm
• Measurements: Area Mapping, Roughness / Waviness, Shape / Flatness, Thickness - Wafer / Disc (TTV)
• Technology: Capacitance / EM Gage
• Mounting / Loading: Manual Loading

Description: The APM650™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral

• Maximum Wafer / Part Size: 650.0000000000001 mm
• Measurements: Area Mapping, Critical Dimension / Trench Geometry, Depth Profiling, Roughness / Waviness, Shape / Flatness
• Technology: Interferometer
• Mounting / Loading: Manual Loading

Description: slope, and line width characterization. The completely automated XE-LCD is designed for characterization of flat panel displays as either an in-line or off-line inspection tool. • Automatic Non-Contact AFM measurement • Automatic navigation and focusing • Automatic glass handling • Automatic

• Measurements: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument
• Features: Non-contact, Non-destructive

Description: faster than systems with a spindle drive Can be used with numerous sensors: surface, contour, hybrid and white light sensors Topography function or lead twist measurement function quickly upgradeable on site Optional rotation tracing driver for standards-compliant effective surface

• Measurement Capability: 3D / Areal Topography, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (W_a,W_t )
• Standards Compliance: ASME, DIN, ISO / EN, JIS
• Mounting / Loading Options: Benchtop
• Display & Special Features: Computer Interface / Networkable, SPC / Software Capability

Description: 1.1 This test method describes a procedure for the measurement of distortions in thin metal strip and the application of these measurements to an equation that will indicate the deviation from flatness. 1.2 The distortions to be measured in this test method are dish, wavy edges,

Description: Topography measurements up to seven times faster than systems with a spindle drive Can be used with numerous sensors: surface, contour, hybrid and white light sensors Topography function or lead twist measurement function quickly upgradeable on site Optional rotation tracing driver for

• Measurement Capability: 2D / Line Profiles, 3D / Areal Topography, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (W_a,W_t )
• Standards Compliance: ASME, DIN, ISO / EN, JIS
• Mounting / Loading Options: Benchtop
• Display & Special Features: Computer Interface / Networkable, SPC / Software Capability

Description: and along the interface. 1.3 These imprints can be used to determine if initial load on the gasket is adequate to attain a seal. These imprints may also indicate correct bolt torque sequence. These imprints may also be used to determine if the mating surface waviness or local flatness meets

Description: interpretation. Some examples are Fibermetric - automated measurements and classification of fiber and filter samples, 3D Roughness Reconstruction, and Automated Image Mapping - an automated way of collecting high-resolution overview images. A large variety of sample holders is available for

• Measurements: Area Mapping, Composition, Critical Dimension / Trench Geometry, Defects / ADC, Particle Contamination, Roughness / Waviness
• Applications: CVD / PVD Films, Packaged ICs / Ceramic Substrates, Semiconductor Wafers
• Technology: FIB / Ion Mill
• Mounting / Loading: Manual Loading

Description: of all surface imperfections. The IQ-S is a specially designed instrument built specifically to match automotive interior gloss measurement standards. In addition IQ-S gloss measurements are fully compatible with existing Micro-TRI-gloss - S results. Dualgloss 20/60° or Trigloss

• Property Measured: Gloss, Haze
• Features: Other

Description: Measuring in different positions HANDYSURF allows not only measurements on flat surfaces, but also on vertical and overhead surfaces. Furthermore, it is possible to separate the tracing driver for the more flexible use of the display unit and to use it with optional holding devices. Freedom

• Measurement Capability: 2D / Line Profiles, 3D / Areal Topography, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (W_a,W_t )
• Standards Compliance: ASME, DIN, ISO / EN, JIS
• Display & Special Features: Computer Interface / Networkable, SPC / Software Capability, Video / Graphic Display
• Mounting / Loading Options: Handheld / Portable

Description: port where the housing distortion valleys are deep and narrow. Simulation with housing transverse waviness shows that increasing spring force can lead to an unexpected increase in internal oil consumption. Roughness and O-ring friction can also increase significantly internal consumption for