Area Array Packaging Handbook: Manufacturing and Assembly

Section 1: PACKAGING CONCEPTS AND DESIGNS

Chapter List

Chapter 1: INTRODUCTION TO ELECTRONIC PACKAGING
Chapter 2: ELECTRONICS INDUSTRY OVERVIEW
Chapter 3: TRENDS/DRIVERS IN THE ELECTRONICS MANUFACTURING INDUSTRY
Chapter 4: AREA ARRAY PACKAGING
Chapter 5: STACKED/3D PACKAGES
Chapter 6: COMPLIANT IC PACKAGING
Chapter 7: FLIP CHIP TECHNOLOGY
Chapter 8: OPTIONS IN HIGH-DENSITY PART CLEANING
Chapter 9: MEMS PACKAGING AND ASSEMBLY CHALLENGES
Chapter 10: CERAMIC BALL AND COLUMN GRID ARRAY OVERVIEW

Ken Gilleo

Cookson Electronics

1.0 DEFINITION OF THE PACKAGE

The ideal electronic package is an economical and manufacturable electromechanical platform for one or more electronic devices that affords protection, facilitates handling, and provides the geometric translations and compatible interface required for connection to the next system level by practical assembly processes.

1.1 INTRODUCTION AND REQUIREMENTS

This book covers much of the field of packaging, including the new minimal category, but with a focus on area array designs. This chapter will describe the functions of the electronic package, protective requirements, and issues as well as solutions for general packaging. This chapter emphasizes area array packages because this is the central theme of this handbook.

The electronic package is designed to perform an assortment of tasks. Some functions can be at variance with one another, requiring balance and compromise for optimization. The package must first house and protect the delicate integrated electronics devices from the external environment. This generally is accomplished by enclosing the chip in a protective cocoon of electrically insulative materials. Alternatively, the package can be a metal vacuum-sealed container with appropriate internal insulation or a similar...

UNLIMITED FREE
ACCESS
TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Category: Electronic and IC Packaging Services
Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.