Area Array Packaging Handbook: Manufacturing and Assembly

Section 2: MATERIALS

Chapter List

Chapter 11: POLYMER PACKAGING MATERIALS: ADHESIVES, ENCAPSULANTS, AND UNDERFILLS
Chapter 12: HERMETIC PACKAGING SYSTEMS: ADHESIVE AND GETTER
Chapter 13: AREA ARRAY SOLDER SPHERES, PASTES, AND FLUXES
Chapter 14: MODERN SOLDER AND SOLDER PASTE
Chapter 15: LEAD-FREE SYSTEMS AND PROCESS IMPLICATIONS
Chapter 16: ELECTRICALLY CONDUCTIVE ADHESIVES FOR SURFACE-MOUNT AND FLIP CHIP PROCESSES: AN ALTERNATIVE TO SOLDER?

Bill Bates,* Tim Chen, 1 Bruce Cotterman, 2 Dave Garrett,* K. Gilleo, 3 Rita Mohanty, 4 John Perry, and Mike Preveti

*Cookson Semiconductor Packaging Materials; 1 Intel Corp., 2 Ambrusan Associates; 3 Cookson Electronics; 4 Arc-Less, Inc.

11.0 INTRODUCTION

Organic polymers are a very old class of joining and assembly materials, but they are also new and modern. The paradox has to do with the source of materials. Natural polymers were discovered and came into use thousands of years ago. Many civilizations used the polymers from nature to craft works of art, make tools, and forge weapons of war. The earliest Native Americans used amber (prehistoric tree resin) to help strengthen the connection between stone spearheads and the wooden shaft. Polymer adhesives have been concocted since prehistoric times from fish, animals, tar, and agricultural materials. With a history going back at least 12,000 years, polymers became essential materials for civilization.

Modern polymers are synthesized in factories around the globe and serve just about every industry, and electronics is well served by this material class. The exciting world of electronic polymers, those magic macromolecules that make modern electronics possible, has moved into high gear...

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