Area Array Packaging Handbook: Manufacturing and Assembly

Section 3: EQUIPMENT AND PROCESSES

Chapter List

Chapter 17: NEXT-GENERATION FLIP CHIP MATERIALS AND PROCESSING
Chapter 18: FLIP CHIP ASSEMBLY AND UNDERFILLING
Chapter 19: BGA AND CSP REWORK: WHAT IS INVOLVED?
Chapter 20: BGA ASSEMBLY RELIABILITY
Chapter 21: DIE ATTACH AND REWORK
Chapter 22: LIQUID ENCAPSULATION EQUIPMENT AND PROCESSES
Chapter 23: MOLDING FOR AREA ARRAY PACKAGES
Chapter 24: SCREEN PRINTING AND STENCILING
Chapter 25: CRITERIA FOR PLACEMENT AND PROCESSING OF ADVANCED PACKAGES
Chapter 26: OVENS IN ELECTRONICS
Chapter 27: PROCESS DEVELOPMENT, CONTROL, AND OPTIMIZATION

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