1 Introduction

Micro electro mechanical systems (MEMS) are evolving from a challenging research subject into industrial products [1]. A very large diversity of new MEMS is being reported on in literature, going from systems for biomedical use to automotive and information technology systems. However, most of the reports on emerging MST-products do not mention anything on the reliability of the devices presented. There are various reasons for these missing data. Mostly reliability issues only become important at a later stage of the product development since the early phases are often dominated by considerations of design, functionality, feasibility and costs [2]. Also, often the system described in publications is still a lab prototype (and often will remain in this stage of the development) and the researcher, often a PhD student, is happy when already able to demonstrate its intended functionality. Or reliability studies have been performed, but are negative and cannot be published. Another important reason for missing reliability data is that the means and procedures to perform reliability tests and consequent failure analysis are not available, unknown or often even non-existent.

This apparent lack of reliability tools and methods contrasts with the huge amount of know-how available on the reliability and failure analysis testing of IC-devices and standard IC-chip packaging. Most failure modes are well known and documented, and standard test procedures are available and described in standards such as the MIL-standards. Fortunately, some of this know-how can directly be used for the...