Part 6: FAB YIELD, OPERATIONS, AND FACILITIES

Chapter 31: YIELD MANAGEMENT
Chapter 32: AUTOMATED MATERIAL HANDLING SYSTEM
Chapter 33: CD METROLOGY AND CD-SEM
Chapter 34: SIX SIGMA
Chapter 35: ADVANCED PROCESS CONTROL
Chapter 36: ENVIRONMENTAL, HEALTH, AND SAFETY CONSIDERATIONS IN SEMICONDUCTOR FABRICATION FACILITIES
Chapter 37: PLAN, DESIGN, AND CONSTRUCTION OF A FAB
Chapter 38: CLEANROOM DESIGN AND CONSTRUCTION
Chapter 39: MICRO-VIBRATION AND NOISE DESIGN
Chapter 40: ESD CONTROLS IN CLEANROOM ENVIRONMENTS
Chapter 41: AIRBORNE MOLECULAR CONTAMINATION
Chapter 42: PARTICLE MONITORING IN SEMICONDUCTOR MANUFACTURING
Chapter 43: WASTEWATER NEUTRALIZATION SYSTEMS

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Semiconductor Manufacturing Handbook