Soldering & Surface Mount Technology
16/2 [2004] 10 12
Emerald Group Publishing Limited
[ISSN 0954 0911]

John G.Bai received his BS Degree in applied physics from Tianjin University, Tianjin, China, in 1995, the MS Degree in semiconductor physics from Beijing University, Beijing, China, in 1998 and another MS Degree in materials science from Dartmouth College, Hanover, NH, in 2000. He is currently pursuing the PhD degree in the Center for Power Electronics Systems and in the Departments of Materials Science and Engineering and Electrical and Computer Engineering at Virginia Polytechnic Institute and State University (Virginia Tech), Blacksburg, VA. His research interests include packaging in microelectronics, power electronics and optoelectronics, processing and applications of electronic, optoelectonic and nanometer materials and their characterization, design and processing of integrated components/devices and their numerical analyses using multiphysics finite element modelling.

Jesus Noel Calata obtained his BS and MS degrees in Metallurgical Engineering from the University of the Philippines. He is currently a PhD student in Materials Science and Engineering at Virginia Tech under the supervision of Professor Guo-Quan Lu. His current research interests include packaging of power semiconductor devices; constrained sintering of glass, glass-ceramic, ceramic and metal coatings and thick films on various substrates, nanomaterials processing and fabrication of nanoscale composite structures. He has done work on glass and glass-ceramic-coated electrostatic chucks for semiconductor wafer processing. Other past and present interests are on extractive metallurgy, electroplating, electroless plating, and corrosion.

Todd Castello (Todd.Castello@Flextronics.com) is a graduate of Herkimer County Community College. He...