TABLE OF CONTENTS Keywords Lead-free soldering, Solder paste
Agmet Limited, based in Reading, Berkshire, and part of the ESL Group, have just introduced a new range of lead-free solder pastes under the Enviro-Flo label. This is a Sn/Sa/Cu alloy with a 217 C eutectic. It is compatible with most of the commercially available coatings to be found on both components and PCBs. These include ENIG, OSP, Bare Cu, PD/NI and conventional Sn/PB coatings.
For further information, visit the Web site: www.solderpaste.co.uk
Keywords Encapsulation, Encapsulant materials, Electronics
Curing in seconds upon exposure to UV/visible light, DYMAX 9008 encapsulant from INTERTRONICS exhibits excellent adhesion to polyimide, enduring bending and flexing even at extremes of thermal cycling to ?20 C. The cured coating forms a transparent layer which protects components and leads from moisture, dust and other contaminants. DYMAX 9008 is formulated to dispense consistently through precision dispensing systems. Controlled placement optimises the process and minimises resin consumption. The flow characteristics of DYMAX 9008 are designed to assure coverage of leads of even large surface mount components, without running to areas where protection is not needed (Plate 1).
9008 flexible coating cures in 10 30 s under standard longwave, moderate or high intensity lights (200 1200 mW/cm). The length of exposure depends upon the light used and thickness of the coating. However, thicknesses to 1.5 mm can be cured in UV conveyor belts at speeds of 60 20...
