TABLE OF CONTENTS John Lau
Agilent, Santa Clara, CA, USA
Nick Hoo
Tin Technology, Middlesex, UK
Rob Horsley
Celestica, Kidsgrove Staffordshire, UK
Joe Smetana
Alcatel, Piano, TX, USA
Dongkai Shangguan
Flextronics, San Jose, CA, USA
Walter Dauksher
Agilent, Fort Collins, CO, USA
Dave Love
Sun Microsystems, Menlo Park, CA, USA
Irv Menis
IBM, Endicott, NY, USA
Bob Sullivan
HDPUG, Scottsdale, AZ, USA
Received: 18 September 2003
Revised: 15 February 2004
Soldering & Surface Mount Technology
16/2 [2004] 46 68
Emerald Group Publishing Limited
[ISSN 0954 0911]
[DOI: 10.1108/09540910410537336]
John Lau, Nick Hoo, Rob Horsley, Joe Smetana, Dongkai Shangguan, Walter Dauksher, Dave Love, Irv Menis and Bob Sullivan
Reliability testing and data analysis of lead-free solder joints for high-density packages
The authors of this paper would like to acknowledge and thank the many unnamed contributors from the various companies that made this test program possible. These include, but are probably not limited to, contributions from unnamed people at, or formerly employed at, Agilent, Alcatel, Amkor, Celestica, ChipPac, Fairchild Semiconductor, Flextronics, HDPUG, Hewlett Packard Company, IBM, International Tin Research Institute, Lucent, National Semiconductor, Nokia, Nortel Networks, RF Monolithics, ST Microelectronics, Sun Microsystems, Texas Instruments, and Thomas and Betts. Special thanks to Steady Frater, Tom Dyson, and Alan Tan of the Celestica Ashton facility, for their help in making the assembly possible, and to Ruben Bergman of HDPUG, Ted Lancaster and Pete Woodhouse of Agilent for their strong support of this project.
Keywords
Solders, Product reliability, Printed-circuit boards
Abstract
Temperature cycling tests, and statistical analysis of...
