Supervisory Circuits and Battery Monitor Chips Specifications

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General Specifications

	Number of Supplies
	Your choices are...
	1		Devices can supervise or monitor one system voltage.
	2		Devices can supervise or monitor two system voltages simultaneously.
	3		Devices can supervise or monitor three system voltages simultaneously.
	4		Devices can supervise or monitor four system voltages simultaneously.
	5		Devices can supervise or monitor five system voltages simultaneously.
	Other		Other unlisted number of supplies.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
	Features
	Your choices are...
	Watchdog Timer (WDT)		Watchdog timers (WDTs) are circuits that automatically detect system anomalies and reset the processor when irregularities occur. WDTs are restartable. Timeouts change their output state and either reset the microprocessor or generate an interrupt.
	Manual Reset		Devices can be reset manually.
	Power Up		Devices ensure proper operation during power-up of the monitored system.
	Power Down		Devices ensure proper operation during power-down of the monitored system.
	Brownout Condition		Devices ensure proper operation when a brownout (undervoltage) occurs on the monitored system.
	Power Fail Warning		Devices detect power failures on the monitored system and also provide low battery warnings.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
	Output Options
	Your choices are...
	Open Drain		Open-drain outputs are connected internally to the drain of a field-effect transistor.
	Inverting		The output is inverted with respect to the input voltage
	Non-Inverting		The output is in phase with the input voltage.
	Active Low		The output signal is active low.
	Active High		The output signal is active high.
	Other		Other unlisted output types.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

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Package Information

	Package Type
	Your choices are...
	BGA		Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanism (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs.
	FCBGA		Flip chip ball-grid array (FCBGA) uses a combination of flip chip and ball grid array features. FCBGA enables short electrical paths for high frequency applications. The simultaneous soldering of all joints in one pass through a reflow furnace facilitates the mounting of packages with thousands of solder joints.
	PBGA		Plastic ball-grid array (PBGA) is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm.
	MCM-PBGA		Multi-chip module plastic ball-grid array (MCM-PBGA).
	TBGA		Tape ball-grid array (TBGA) uses a fine, polyimide substrate and provides good thermal performance with high pin counts.
	FLGA		Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras.
	PGA		Pin grid array (PGA) is a second-generation package that uses through-hole technology (THT). Pins are located on a 0.1" grid in various patterns. Package size is reduced by moving pins to the underside of the package in a grid pattern.
	IPGA		Interstitial package grid array (IPGA) carries additional pins on a 0.5" offset pattern in between the pins of a regular PGA pattern. It almost doubles the available pins on the same package size as a standard PGA.
	CSP		Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (ICs), including radio frequency ICs (RFICs), memory ICs, and communication ICs.
	FCCSP		Flip chip CSP (FCCSP).
	WLCSP		Wafer-level chip-scale package (WLCSP) allows an IC to be attached facedown so that its pads connect to the printed circuit board (PCB) pads through individual solder balls without any underfill material. WLCSP minimizes IC-to-PCB inductance, features small package size, and provides enhanced thermal conduction.
	QFP		Quad flat packages (QFP) contain a large number of fine, flexible, and gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.
	LQFP		Low quad flat package (LFQP).
	TQFP		Thin quad flat package (TQFP).
	QFN		Quad flat non-leaded package (QFN). Also known as QFNL.
	SOP		Small outline package (SOP).
	MLP		The MLP (ultra-slim Micro Lead-rame Package) is a miniature package with a typical height of only 0.75 mm, length of 2 mm, and width of 3 mm.
	MSOP		The MSOP (Mini Small Outline Plastic) package is smaller version of the SOP.
	SOIC		Small outline integrated circuit (SOIC).
	SOJ		Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device.
	TSOP Type I, Type II		Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.
	SSOP		Shrink small outline package (SSOP).
	TSSOP		Thin shrink small outline L-leaded package (TSSOP).
	TDFN		Fine Pitch, Dual-in-Line, Flat No-Lead (TDFN) is a high-performance replacement for 6-pin SOT-23 and SC-70, with improved thermal characteristics and reduced package parasitics. TDFN package is designed with a smaller footprint than SOT-23 packages, so it can save board space by up to 40% over comparable solutions. TDFN has an identical footprint as equivalent MLF and Mini-BGA packages.
	VSSOP		Very thin shrink small outline package (VSSOP).
	TVSOP		Thin very small outline package (TVSOP).
	HSOF		Small outline flat-leaded package with heat sink (HSOF).
	PLCC		Plastic leaded chip carrier (PLCC).
	LCCC		Leadless ceramic chip carrier (LCCC).
	DIP		Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board.
	CDIP		Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
	PDIP		Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications.
	SIP		Single in-line package (SIP).
	SDIP		Shrink dual in-line package (SDIP).
	SZIP		Shrink zigzag in-line package (SZIP).
	SC-70		SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops and other portable and hand-held applications where space is extremely limited.
	SOT-23		Plastic surface mounted package.
	SOT-143		SOT143 is a plastic, surface mounted, small outline transistor (SOT) package with four leads.
	TO-92		The package uses a transistor outline (TO).
	Other		Other unlisted, specialized, or proprietary packages.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
	Pin Count		The number of pins in package.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

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Performance

	Quiescent Current (IQ)		Quiescent current (IQ) or operating current is the current needed for proper operation of the device.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
	Voltage Accuracy		Voltage accuracy is a percentage of value reported by the unit.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
	Supply Voltage (Vi)		Supply voltage (Vi) is the input voltage needed to operate the device.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
	Threshold Voltage		Threshold voltage is the voltage range at which resets are triggered.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
	Operating Temperature		This is the full-required range of ambient operating temperature.
	Search Logic:		User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.

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