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Number of Receivers:

Operating Frequency:

Data Rate:

Supply Voltage:

Technology:

Modulation:

Radio Technique:

IC Package Type:

Pin Count:

Number of Devices in Package:

Help with Radio Receiver ICs specifications:

Performance
   Number of Receivers       The number of receivers in the chip. 
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   Operating Frequency:       The operating frequency is the range of broadcast and received signals. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Data Rate       The rate or transmission of reception, in bits per second (bps). 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Supply Voltage:       
   Your choices are...         
   -5 V       Devices operate with -5 V. 
   -4.5 V       Devices operate with -4.5 V. 
   -3.3 V       Devices operate with -3.3 V. 
   -3 V       Devices operate with -3 V. 
   1.2 V       Devices operate with 1.2 V. 
   1.5 V       Devices operate with 1.5 V. 
   1.8 V       Devices operate with 1.8 V. 
   2.5 V       Devices operate with 2.5 V. 
   2.7 V       Devices operate with 2.7 V. 
   3 V       Devices operate with 3 V. 
   3.3 V       Devices operate with 3.3 V. 
   3.6V       Devices operate with 3.6 V. 
   5 V       Devices operate with 5 V. 
   Other       Other unlisted supply voltages. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Technology / Interface
   Technology       
   Your choices are...         
   ANT       ANT is a digital radio system technology for personal-area networking (PAN). 
   ATM       Asynchronous transfer mode (ATM) is a high-speed, point-to-point, switched network technology that uses fiber optic or Category 5 (Cat-5) copper cabling. ATM transmits data in cells rather than frames and can carry text, audio, and video. Each cell is a packet that contains 5 bytes of routing information and 48 bytes of data. Basic networks run at 155 Mbps, but implementations that use fiber optic cable can achieve speeds as high as 660 Mbps. The basic desktop standard runs at 25 Mbps. 
   Bluetooth       Bluetooth® chips provide wireless connectivity in solution-on-chip (SoC) platforms that power short-range radio communication applications. Bluetooth is a registered trademark of Bluetooth SIG, Inc. 
   CDMA       Code division multiple access (CDMA) is a digital, wireless transmission standard. 
   CATV       Cable television (CATV) is a method of transmitting data, television, radio and other services through coaxial cables. 
   xDSL       Digital subscriber line (DSL) technology is used to send data over copper wires. xDSL refers to a family of DSL standards such as asymmetric DSL (ADSL), high bit-rate DSL (HDSL), symmetric DSL (SDSL), very high-bit DSL (VDSL), very high-speed DSL (VADSL), unidirectional HDSL (UDSL), ISDN digital subscriber line (IDSL), and others. 
   EDGE       Enhanced data rate for global revolution (EDGE) is a digital wireless technology that enables mobile service providers to deliver multimedia, high-speed Internet access, and email. EDGE chips are considered to be an intermediate step between 2G technologies and 3G technology. They are a step up from the GSM standard, but do not provide the same quality as an UMTS chip. 
   Ethernet       Ethernet is a local area network (LAN) protocol that uses a bus or star typology and supports data transfer rates of 10 Mbps. The Ethernet specification is the basis for the IEEE 802.3 standard, which specifies the physical and lower software layers. To handle simultaneous demands, Ethernet uses carrier sense multiple access / collision detection (CSMA/CD) to monitor network traffic. 
   Fast Ethernet       Fast Ethernet is a networking standard that supports data transfer rates up to 100 Mbps. There are two types of Fast Ethernet: 100Base-X and 100Base-T. 100Base-X uses two physical links, one for transmission and one for reception, between nodes. 100Base-T uses medium access control protocol (MAC). The IEEE 802.3 committee developed the standards for Fast Ethernet. 
   Gigabit Ethernet       Gigabit Ethernet is an Ethernet technology that supports frame transmission at rates above gigabits. 
   FlatLink™       FlatLink™ (Texas Instruments) is a data transmission system that reduces by half the number of signal lines used in parallel data systems with no loss of data. FlatLink takes single-ended data rates clocked at up to 68 MHz and increases the rate to up to 476 Mbps. 
   Fibre Channel       Fibre channel is a high-speed, serial data transfer architecture that uses links of twisted-pair, coaxial, or fiber optic cable. Small computer system interface (SCSI) devices can use fibre channel arbitrated loop (FC-AL), the most popular fibre channel typology. Using optical fiber, FC-AL supports full-duplex data transfer rates of 100 Mbps. Eventually, FC-AL is expected to replace SCSI in high-performance storage systems. 
   FDDI       Fiber distributed data interface (FDDI) is a reliable, high-speed backbone for mission critical and high traffic networks. It can transport data at a rate of 100 megabits per second, and can support up to 500 stations on a single network. FDDI was designed to run through fiber cables, transmitting light pulses to convey information between stations, but it can also run on copper using electrical signals. 
   HDTV       High definition television (HDTV) is a digital television standard that provides greater resolution than standard systems. 
   HSDPA       High-speed downlink packet access (HSDPA) is a packet-based mobile protocol. 
   HDLC       High-level data link control (HDLC) is a synchronous protocol developed by the International Organization for Standardization (ISO). 
   ISDN       Integrated services digital network (ISDN) is an international communications standard for sending voice, video, and data over digital telephone lines or traditional telephone lines. ISDN uses a packet-switching technology and supports data transfer rates of 64 Kpbs. There are two basic types of ISDN: basic rate interface (BRI) and primary rate interface (PRI).  
   IrDA       Infrared data access (IrDA) is a protocol for exchanging data between devices by using infrared signals. IrDA is one of the most powerful wireless protocols. 
   3G Standard       Third generation (3G) chips and chipsets include UMTS, EDGE, and GMS products. IMT-2000, a global standard, was developed by the International Telecommunication Union (ITU) in order to codify the technical specifications for global 3G wireless technology. 
   4G Standard       Fourth generation (4G) wireless technology is the successor to the 3G standard. 4G is based only on packet switching. By contrast, 3G uses a combination of circuit and packet switching.  
   GPS       Global positioning system (GPS) chips compare signals from several geo-positioning satellites to determine position on the Earth's surface. 
   GPRS       GPRS chips use general packet radio service (GPRS), a standard for wireless communication with a throughput rate of 115 kilobits per second. 
   GSM       Global system for mobile communications (GSM) is a 3G standard popular in Europe and Japan.   
   Multiprotocol       Multiprotocol interfaces support more than one protocol, such as V.36, V.28, RS232, and V.35, etc. 
   SONET       Synchronous optical network (SONET) is a laser-based communication standard. 
   SSL       Secure socket layer (SSL) is an encryption technology used for secure transmission of data. 
   STS-1       Synchronous transport signal level-1 (STS-1) is a SONET basic transmission unit that operates at 51.84 Mbps. 
   T1 / E1       T1 is a multiplexed carrier system that operates at 1.544 Mbps. E1 is its European equivalent. 
   T3/E3       T3 is a multiplexed carrier system that operates at 144.736 Mbps. E3 is its European equivalent. 
   UMTS       Universal mobile telecommunications system (UMTS) is a 3G wireless protocol. 
   USB       Universal serial bus (USB) is a 4-wire, 12-Mbps serial bus for low-to-medium speed peripheral device connections to personal computers (PC), including keyboards, mice, modems, printers, joysticks, audio functions, monitor controls, etc. The USB design is standardized by the USB Implementers Forum (USBIF), an organization that includes leading companies from the computer and electronics industries. The current USB specification is USB 2.0, which supports data transfer rates of up to 480 Mbps. 
   VoIP       Devices use voice over IP (VoIP) technology. 
   WCDMA       Wide band code division multiple access (WCDMA) is a wireless protocol for wideband communication. 
   Wi-Fi / WiMAX / Wi-Mesh       WiFi (802.11) and WiMAX (802.16) wireless Ethernet chips are used in fixed broadband wireless access networks that use point-to-multipoint architecture. WiFi chips are based on the IEEE 802.11 standard. WiMAX chips are based on the IEE 802.16 standard. WiFi is an abbreviation for wireless fidelity. WiMAX is an abbreviation for worldwide interoperability for microwave access. The IEEE 802.16 or WiMAX standard is also known as WirelessMAN®, a registered trademark of the Institute of Electrical and Electronics Engineers (IEEE). Wi-Mesh is designed to extend the reach of WiFi networks over long distances by allowing multiple access points to carry each others' traffic. Unlike Wi-Fi hotspots, which need a direct connection to the Internet, mesh networks pass the data request until a network connection is found. 
   ZigBee®       ZigBee® chips (802.15.4) are a cost-effective, standards-based, wireless networking solution that provides low data-rates, low-power consumption, security, and reliability. ZigBee is a registered trademark of the ZigBee Alliance, a trade association that promotes this open standard. 
   Other       Other unlisted or proprietary technology types. 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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RF Modulation
   Modulation       
   Your choices are...         
   Amplitude Modulation (AM)       Amplitude modulation (AM) causes the baseband signal to vary the amplitude or height of the carrier wave to create the desired information content. 
   Frequency Modulation (FM)       Frequency modulation (FM) causes the instantaneous frequency of a sine wave carrier to depart from the center frequency by an amount proportional to the instantaneous value of the modulating signal. 
   On-Off Key (OOK)       On-off key (OOK) modulation consists of turning the signal on or off. This is the simplest form of modulation. 
   Amplitude Shift Key (ASK)       Amplitude shift key (ASK) transmits data by varying the amplitude of the transmitted signal. 
   Frequency Shift Key (FSK)       Frequency shift key (FSK) is a digital modulation scheme using two or more output frequencies. 
   Phase Shift Key (PSK)       Phase shift key (PSK) is a digital modulation scheme in which the phase of the transmitted signal is varied in accordance with the baseband data signal. 
   Other       Other unlisted modulation techniques. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Radio Technique      Radio techniques limit localized interference and noise.
   Your choices are...         
   Direct-Sequence Spread Spectrum       Signals are spread over a large band by multiplexing the signal with a code or signature that modulates each bit. 
   Frequency-Hopping Spread Spectrum       Signals move through a narrow set of channels in a sequential, cyclical, and predetermined pattern. Devices avoid interference by not remaining in the same channel for a long period of time. 
   Other       Other unlisted radio techniques such as infrared, narrowband, etc. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Packaging
   IC Package Type:       
   Your choices are...         
   Bare Die        Devices are sold in semiconductor die form. They do not have a case or packaging. 
   BGA       Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs. 
   FCBGA       Flip chip ball-grid array (FCBGA) uses a combination of flip chip and ball grid array features. FCBGA enables short electrical paths for high frequency applications. The simultaneous soldering of all joints in one pass through a reflow furnace facilitates the mounting of packages with thousands of solder joints. 
   PBGA       Plastic ball-grid array (PBGA) is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm. 
   MCM-PBGA       Multi-chip module plastic ball-grid array (MCM-PBGA). 
   SBGA       Super ball-grid array (SBGA) provides a high-power BGA package with a very low profile. With SBGA, the IC is directly attached to an integrated copper heatsink. Since the IC and I/O are on the same side, signal vias are eliminated, providing a significant improvement in electrical performance (inductance). 
   TBGA       Tape ball-grid array (TBGA). 
   CPGA       Ceramic pin-grid array (CPGA). 
   PPGA       Plastic pin-grid array (PPGA). 
   FCPGA       Flip-chip pin-grid array (FCPGA) attaches the chip to the board facedown, without any wire bonding. 
   IPGA       Interstitial package grid array (IPGA) carries additional pins on a 0.5" offset pattern in between the pins of a regular PGA pattern. It almost doubles the available pins on the same package size as a standard PGA. 
   PGA       Pin grid array (PGA) is a second generation package that uses through-hole technology (THT). Pins are located on a 0.1" grid in various patterns. Package size is reduced by moving pins to the underside of the package in a grid pattern. 
   CSP       Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.   
   FCCSP       Flip-chip chip-scale package (FCCSP). 
   SuperFC®       Super flip-chip or SuperFC® packages feature a controlled bond line die attached directly to a copper heat spreader.  SuperFC® is a registered trademark of Amkor. 
   UCSP       Ultra chip scale package (UCSP). 
   WLCSP       Wafer-level chip-scale package (WLCSP) allows an IC to be attached facedown so that its pads connect to the printed circuit board (PCB) through individual solder balls without any underfill material. WLCSP minimizes IC-to-PCB inductance, features small package size, and provides enhanced thermal conduction. 
   LGA       Tape ball-grid array (TBGA) uses a fine, polyimide substrate and provides good thermal performance with high pin counts. 
   FLGA       Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras. 
   QFP       Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.   
   LQFP       Low quad flat package (LQFP). 
   TQFP       Thin quad flat package (TQFP). 
   PQFP       Plastic quad flat package (PQFP). 
   QFN       Quad flat non-leaded package (QFN) is also known as QFNL. 
   VQFP       Very thin quad flat package (VQFP). 
   MSOP       Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar coded. Reels are placed inside barcode-labeled boxes for shipping. 
   PSOP       Power small outline package (PSOP). 
   SOP       Small outline package (SOP). 
   QSOP       Quarter size outline package (QSOP). 
   MLP       Micro lead-frame package (MLP) is an ultra-slim, miniature package with a typical height of only 0.75 mm, length of 2 mm, and width of 3 mm. 
   SOIC       Small outline integrated circuit (SOIC). 
   TSOJ       Thin small outline J-leaded package (TSOJ). 
   TSOP Type I, Type II       Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II. 
   TSOP Type I       Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. 
   TSOP Type II       Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. 
   SSOP       Shrink small outline package (SSOP). 
   VSSOP       Very thin shrink small outline package (VSSOP). 
   TVSOP       Thin very small outline package (TVSOP). 
   TSSOP       Thin shrink small outline L-leaded package (TSSOP). 
   SOJ       Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device. 
   HSOF       Small outline flat-leaded package with heat sink (HSOF). 
   HSOP       Small outline with heat sink package (HSOP). 
   PLCC       Plastic leaded chip carrier (PLCC). 
   LCCC       Leadless ceramic chip carrier (LCCC). 
   DIP       Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP). 
   CDIP       Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. 
   PDIP       Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications. 
   SIP       Single in-line package (SIP) is a semiconductor package which has only one row of pins. 
   SDIP       Shrink dual in-line package (SDIP). 
   SC-70       SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops and other portable and hand-held applications where space is extremely limited. 
   SZIP       Shrink zigzag in-line package (SZIP). 
   TDFN       Thin dual flat no-lead (TDFN) packages are fine-pitch, high-performance replacements for 6-pin SOT23 and SC-70 packages. TDFM offers improved thermal characteristics and reduced parasitic compared to these other packages. With the same footprint as equivalent MLF and Mini-BGA packages, TDFM has a much smaller footprint than SOT23 packages. 
   SOT23       SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment. 
   Other       Other unlisted, specialized, or proprietary IC packages. 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Pin Count       The number of pins in the package. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Number of Devices in Package       The total number of devices in the IC package. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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