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Supplier: Allied Electronics, Inc.
Description: components is a factor. 3M™ Scotch-Weld™ epoxy potting compound/adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black.
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
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Supplier: Allied Electronics, Inc.
Description: components is a factor. 3M™ Scotch-Weld™ epoxy potting compound/adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black.
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
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Supplier: Allied Electronics, Inc.
Description: components is a factor. 3M™ Scotch-Weld™ epoxy potting compound/adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black.
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
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Description: DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound
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Description: DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 58000 to 62000 cP
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Supplier: Allied Electronics, Inc.
Description: 3M Scotch-Weld™ Epoxy Potting Compound-Adhesives Black opaque highly filled epoxy used for potting and encapsulating electronic circuits. Use to environmentally protect or conceal circuits. This product is excellent when used with GC Chassis Boxes. Working Time
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Use Temperature: -40 to 300 F
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Description: Classic underfill, ultra-low viscosity suitable for most underfill applications.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Koford Engineering, LLC
Description: E-112 is a high performance, light weight, hollow glass microsphere filled single component pottingmaterial. It is especially suited for applications which involve potting assemblies which have small openingsaround terminals or switches. The microspheres are of sufficient size that the
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Form / Function: Encapsulant / Potting Compound
- Use Temperature: 320 to 392 F
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Supplier: Epoxies Etc...
Description: Epoxies, Etc's resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 27.78 µin/in-F
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxies Etc...
Description: 20-3220 is a filled epoxy resin system that does not contain diluents, plasticizers, or other degrading adulterants. This system was formulated for the encapsulation and potting of miniaturized electronic components and high density circuit packages.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 16.11 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Georgia-Pacific Chemicals LLC
Description: These phenolic novolac resins are used as curing agents for epoxy resins in molding compounds, copper clad laminates, electrical applications and potting.
- Chemical / Polymer System Type: Phenolics (Melamine, Furan)
- Compound Type: Liquid
- Industry: Industrial
- Material Type / Grade: Thermoset
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Supplier: Epoxies Etc...
Description: 20-3001 is a low viscosity, unfilled epoxy potting and encapsulating system which forms a bubble free glass like finish when cured.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 27.78 µin/in-F
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description ER2183 Thermally conductive epoxy potting compound is an epoxy resin which meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission. It is a low viscosity alternative to ER2220
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Epoxies Etc...
Description: 20-3060 is a 100% reactive resin which does not contain any solvents, diluents, plasticizers or additives which downgrade physical, thermal, and electrical insulation properties.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description ER2221 thermally conductive epoxy potting compound has been formulated as high temperature resistant and thermally conductive encapsulation resin which retains excellent characteristics throughout thermal cycling. ER2221 exhibits excellent thermal
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description ER2188 General purpose epoxy potting compound is a two part epoxy resin for general use within the electronics industry. It’s a good all round resin offering a cost effective solution for a wide range of applications where protection is
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Techsil Limited
Description: ThreeBond TB2210 is a black epoxy resin which cures to a tough 92 Shore D Hardness. The fast curing nature of this epoxy resin allows for considerable energy savings and facilitates the automation of assembly works thus enabling an integration of On-Line manufacturing
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Form / Function: Encapsulant / Potting Compound
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® RN-1000 is a diluted epoxy potting and casting resin. When CONAPOXY® RN-1000 is cured with the hardeners listed below, these systems possess low shrinkage, low exotherm, good thermal shock and electrical properties, with a hardness range of 80-90 Shore D are obtained.
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1046 is a low cost, epoxy potting and casting system. Major characteristics include: low viscosity, low shrinkage, low exotherm, excellent resistance to thermal shock, and very good electrical insulation properties. When cured with any of the hardeners presented below, a
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Protavic America, Inc.
Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity
- Chemical / Polymer System Type: Specialty / Other
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: ACCRAbond, Inc.
Description: Casting resin. When cured with any of the hardeners presented below, these systems possess low viscosity, low shrinkage, low exotherm, excellent resistance to thermal shock, good electrical properties and hardnesses.
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1210 is a filled epoxy potting casting resin. When cured with any of the hardeners listed below, systems possessing low shrinkage, low coefficient of expansion, good resistance to mechanical and thermal shock and good electrical properties are obtained. Hardness of
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: Accuris
Description: POTTING COMPOUND, EPOXY RESIN, THERMOSETTING
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Supplier: Protavic America, Inc.
Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description ER2220 Highly thermally conductive epoxy potting compound is a flame retardant, two part epoxy resin. Designed to meet increasing demands for efficient thermal dissipation, ER2220 combines ease of processing with an enhanced thermal conductivity
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Flame Retardant / UL 94V-0 Rated: Yes
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Supplier: Techsil Limited
Description: MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Electronics
- Use: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Electronics
- Use: Encapsulant / Potting Compound
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Supplier: Accuris
Description: POTTING CABLE ASSEMBLIES USING EPOXY RESIN COMPOUNDS
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Supplier: Techsil Limited
Description: MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Electronics
- Use: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST ES 1904, Epoxy, Potting and Encapsulating LOCTITE® STYCAST ES 1904 is an opaque, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications, excellent structural, mechanical and electrical properties are
- Coeff. of Thermal Expansion (CTE): 37.78 µin/in-F
- Cure Type / Technology: Two Component System
- Features: Leveling / Filling Compound
- Industry: Optical Grade / Material
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
- Electrical / Electronics Applications: Optoelectronics / Photonics, Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound, Glob Top / Daub
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Supplier: SAE International
Description: This specification covers a single component epoxy resin formulation requiring an oven cure for attainment of maximun properties.
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Supplier: SAE International
Description: This specification covers a single component epoxy resin formulation requiring an oven cure for attainment of maximum properties.
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 10 to 41.67 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
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Description: It is a fast curing, fast flowing liquid epoxy resin designed for capillary flow filling chip size packages, is to improve the process speed in production and design its rheological design, let it penetrate 25µm clearance, minimize induced stress, improve temperature cycling
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Viscosity: 3500 to 7000 cP
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG Epoxylite® E 5302 HI TEMP Epoxy Potting Compound is a two-component system that consists of a liquid resin and a powder hardener. It has excellent adhesion to metals, ceramics, and most plastics. It is used for bonding and sealing of electrical components
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 560 kV/in
- Elongation: 2 %
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Georgia-Pacific Corporation
Description: high-temperature requirements, phenolic resin systems have advantages over polyesters, epoxies, and vinyl esters. Cured phenolic resins from GP Chemicals are formulated to be inherently fire-resistant, demonstrate low smoke generation and high-temperature resistance. Phenolic
- Chemical / Polymer System Type: Phenolics (Melamine, Furan)
- Material Type / Grade: Composite Material, Thermoset
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 33.89 to 100 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.34
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 53.33 to 97.22 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 33.89 to 100 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 3.8
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Supplier: Ellsworth Adhesives
Description: 3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Clear is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 850 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: 3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 850 kV/in
- Form / Function: Encapsulant / Potting Compound
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Featured Products Top
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and supplier in china. DeepMaterial mainly offering one component epoxy adhesive,two component epoxy adhesive,epoxy encapsulant,UV Curing optical adhesives,epoxy conformal coating,smt epoxy adhesives,epoxy potting compound,waterproof epoxy and so on. DeepMaterial waterproof epoxy adhesive is (read more)
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Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate (read more)
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adhesive and pressure sensitive hot melt adhesiveseries, epoxy-based chip underfill and COB encapsulation materials series, circuit board protection potting and conformal coating adhesive series, epoxy based conductive silver adhesive series, structural bonding adhesive series, functional protective film series, semiconductor protective film series. (read more)
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Casting & Potting Materials ELANTAS PDG, Inc. offers a wide range of high performance casting resins and potting resins. Our 2-component casting and (read more)
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Choosing the right potting compound: Here is why it matters Potting compounds seal and protect electrical components from various stresses (read more)
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Master Bond EP30LP-2 is an optically clear epoxy with superb light transmission properties. This low viscosity, electrical insulator also features outstanding dimensional stability. Featuring easy handling, this compound has a convenient two to one mix ratio by weight or (read more)
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potting compounds. Power distribution In the power distribution industry, transformers are typically oil-filled or casted with potting compounds. The oil-filled transformers are heavier and can leak, thus leading to a fire risk, so there is a major advantage to the use of cast resin (read more)
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,best thermally conductive epoxy,low temperature epoxy adhesive,electronic epoxy encapsulant potting compounds and so on. Epoxy adhesive for plastic is a powerful bonding agent that can be used for various applications. From repairing broken plastic objects to creating new ones, an epoxy adhesive can be (read more)
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components (Bectron®, CONAP®). Epoxy and silicone potting materials that provide protection for high temperature applications (Epoxylite®, (read more)
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,best thermally conductive epoxy,low temperature epoxy adhesive,electronic epoxy encapsulant potting compounds and so on. Epoxy adhesives are high-performance adhesives often used in carpentry and woodworking or for specialized creative uses like making costume jewelry. These practices include not only (read more)
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Conduct Research Top
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Potting Electronics PCB with Epoxy Potting Compound and Epoxy Resin Conformal Coating
Electronic assemblies have to be protected from a wide range of factors, such as corrosive agents, moisture thermal dissipation, shock, and vibration. The protection is achieved when we do pot. This process involves filling electronic assemblies with compounds to give permanent protection.
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Polyurethane: "Customized Plastic"
PU Potting Compounds: Vacuum Processing Provides Optimum Results - Polyurethanes have an extremely wide and flexibly modifiable range of properties. This makes them a popular and frequently used group of materials in industrial production. PU potting compounds can be processed easily and feature
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Materials Science and Engineering II
The absorption peak of epoxy at 914cm-1 and the 3600~2500cm-1 broad band disappeared as shown in fig.2, that make clear post-curing epoxy resin potting compound reaction is complete.
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Abstracts of articles in this issue
Internal Stresses Developed In An Epoxy Resin Potting Compound During Long-Term Storage .
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Masthead
Internal Stresses Developed In An Epoxy Resin Potting Compound During Long-Term Storage .
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DEMONSTRATIONS
(F) Epoxy resin potting compound .
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Guidance And Control > The King Inertial Navigation Gyro
Reliability is further served by having the signal generator primary lamination poles completely buried in the epoxy resin potting compound .
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Structures, Structural Dynamics, and Materials and Co-located Conferences > Structural Assessment of Advanced Tow-Steered Shells (AIAA 2013-1769)
An epoxy resin potting compound is cast to a 1-in. depth around both ends of each shell (Figure 7) to prevent localized brooming failures of the shell ends.
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Mechanical engineering aspects of TFTR
An epoxy resin potting compound is injected .