New One-Step Ball-Attach & Flip-Chip Flux

Featured Product from Indium Corporation

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Indium Corporation has expanded its flux portfolio with a robust flux designed to provide a simple solution to complicated applications, especially those with a single cleaning step for both BGA ball-attach and flip-chip processes.

 

WS-446HF is a water-soluble, halogen-free, flip-chip dipping flux with an activator system powerful enough to promote good wetting on the most demanding surfaces—including solder-on-pad (SoP), Cu-OSP, ENIG, embedded trace substrates (ETS), and flip-chip on leadframe applications.

 

WS-446HF:

  • Includes a chemistry that eliminates dendrite issues, especially critical for fine-pitch flip-chip applications
  • Provides tackiness suitable for holding solder spheres and large die in place during assembly, eliminating missing balls and reducing die tilt and non-wet-opens due to warpage
  • Delivers consistent pin transfer, printing, and dipping performance, ensuring consistent joint quality and improving production yields
  • Eliminates the need for multiple fluxing steps, enabling a single-step ball-attach process and eliminating the warpage-inducing effects of prefluxing
  • Has good cleanability with room temperature DI water, avoiding the formation of white residue