InTACK™ is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution without compromising soldering quality. While InTACK™ has the tack strength to hold materials in place, the material is completely evaporated out during reflow, eliminating the time-consuming post-reflow residue cleaning steps. 

InTACK™ technology is specifically designed to achieve high-quality solder performance with no residue in flux-free reflow techniques commonly used in power module assembly. Benefits of InTACK™ include:

• Maintains precise assembly alignment
• Compatible with solder preforms, dies, and power module components
• Robust tacking and long working time
• Optimal performance in formic acid/vacuum reflow
• No residue, no cleaning
• Dispensing application tested and process proven

For more information about InTACK™, contact Indium Corporation Product Manager – ESM/Power Electronics Joe Hertline.