Multilayer Ferrite Beads
from DigiKey
MULTILAYER FERRITE CHIP POWER IN [See More]
- Technology: Multilayer
- DCR: 0.5200
- Packing Method: Tape Reel
- Operating Temperature: -40 to 125
from Trigon Components, Inc.
SERIES. ECA. DESCRIPTION. Chip, Array. IMPEDANCE RANGE. 30 to 1000 Ohm. CURRENT RATING. 0.05 to 0.20mA. FREQUENCY. 100MHz. PACKAGE. SMD 1210. FEATURE. •This series composes 4 circuits in a 06X03 inch body with 0.0.031 inch pitch. •The electrical characteristics are similar to those of ECB... [See More]
- Technology: Multilayer
- Packing Method: Tape Reel; Bulk
- Bead Form Factor: Chip
- Devices in Package: 1
from KEMET Electronics Corporation
KEMET is proud to introduce ferrite products (inductors) to our product portfolio. Inductors are used in every type of electronic equipment including computers, telecommunication, automotive electronics, military electronics, medical electronics and consumer electronics. Offerings include both... [See More]
- Technology: Standard; Wirewound; Multilayer
- Packing Method: Tape Reel
- Bead Form Factor: Chip
- Standards and Certifications: RoHS
from Central Technologies
Multi-layer ferrite chip bead, 6 Ohms impedance, tape & reel packaging [See More]
- Technology: Multilayer
- Packing Method: Tape Reel
- Bead Form Factor: Chip
- Devices in Package: 1
from Frontier Electronics Corp.
Frontier Electronics designs and manufactures customer specific solutions when industry standard products do not meet their requirements. Redesigns for tighter tolerances, smaller footprints, higher performance, etc.. Redesigning and/or re-manufacturing obsolete components to conform to the latest... [See More]
- Technology: Multilayer
- Impedance: 5 to 2700
- EIA Case Size: 0402 ~ 1812
- DCR: 0.0100 to 1.5
from KITAGAWA INDUSTRIES America, Inc.
Impedance Range: 7 to 2000 ohms, Standard Rated Current: 100mA to 6000mA , Operating Temperature Range: -55 °C to +125 °C , Packaging Method: Tape & Reel , RoHS compliant [See More]
- Technology: Multilayer
- Packing Method: Tape Reel
- Bead Form Factor: Chip
- Standards and Certifications: RoHS
from Trigon Components, Inc.
SERIES. ECB. DESCRIPTION. Chip, General Purpose and High Band. IMPEDANCE RANGE. 5 to 130 Ohm. CURRENT RATING. 300 to 600mA. FREQUENCY. 100MHz. PACKAGE. SMD 0603 to 1812. FEATURE. •High density packaging with a pitch of 2.54mm (0.1 inch) max. is possible. This series requires less space and has... [See More]
- Technology: Multilayer
- Packing Method: Tape Reel; Bulk
- Bead Form Factor: Chip
- Devices in Package: 1
from Trigon Components, Inc.
SERIES. ECC. DESCRIPTION. Chip, Noise Suppression. IMPEDANCE RANGE. 300 to 1000 Ohm. CURRENT RATING. 0.05 to 0.20mA. FREQUENCY. 100MHz. PACKAGE. SMD 1608. FEATURE. •The characteristics at frequencies below 100 MHz are similar to those of ECB Series At 1 GHz, the impedance of ECC series is... [See More]
- Technology: Multilayer
- Packing Method: Tape Reel; Bulk
- Bead Form Factor: Chip
- Devices in Package: 1
from Trigon Components, Inc.
SERIES. ECI. DESCRIPTION. Chip, Large Current. IMPEDANCE RANGE. 7 to 600 Ohm. CURRENT RATING. 1 to 6A. FREQUENCY. 100MHz. PACKAGE. SMD 1608 to 4532. FEATURE. •High density packaging with a pitch of 2.54mm(0.1 inch) max. is possible. This series requires less space and has greater EMI... [See More]
- Technology: Multilayer
- Packing Method: Tape Reel; Bulk
- Bead Form Factor: Chip
- Devices in Package: 1
from Trigon Components, Inc.
SERIES. ECZ. DESCRIPTION. Chip, for GHz Noise. IMPEDANCE RANGE. 120 to 1000 Ohm. CURRENT RATING. 150 to 1500mA. FREQUENCY. 100MHz~1GHz. PACKAGE. SMD 1005 to 1608. FEATURE. •Internal silver printer layers and magnetic shielded structures to minimize crosstalk. •Perfect effect for EMI... [See More]
- Technology: Multilayer
- Packing Method: Tape Reel; Bulk
- Bead Form Factor: Chip
- Devices in Package: 1