CMP / Wafer Planarization Abrasive Compounds and Abrasive Slurries
from Chemetall
As machining tasks become more critical in the pursuit of maximum efficiency, economy and the perfection of the finished component, so too does the need for best-in-class specialty fluids and abrasive suspensions. Precision Microchemicals Technical Center operates a fully equipped laboratory to... [See More]
- Type: Lapping; CMP / Wafer Planarization; Polishing; Grinding; Cleaning / Surface Preparation
- Form: Slurry (optional feature)
from Advanced Abrasives Corp.
Premasol CS colloidal Silica Suspension. Premasol CS colloidal silica suspension contains spherical silica particles with an average size of 50 nm and held in a suspension with a pH range of 9-11 that is formulated to resist drying. In the event that Premasol CS is left for a long period to dry on a... [See More]
- Type: CMP / Wafer Planarization
- Compound / Abrasive Type: Silca; Ceramic
- Form: Liquid / Dispersion; Other; Suspension
- Grading System: Micron Graded
from Precision Surfacing Solutions
The Lapmaster range of diamond slurries has been formulated for use on many different types of lapping plates and polishing pads. The slurries can be hand sprayed onto the lapping/polishing platen or applied by an electronic dispensing system to control cost and reduce waste. Many Lapmaster diamond... [See More]
- Type: Lapping; CMP / Wafer Planarization
- Compound / Abrasive Type: Diamond
- Form: Slurry
- Grit Size: 0.1000 to 45