Wire Wrap Pins IC Sockets and Headers
from Excel Cell Electronic USA Corp.
Accepts PCMCIS Type I, Type II, or Type III cards [See More]
- Contact Type: Wire-Wrap
- Socket Type: PCI Card Plug
- Product Type: IC Socket
- Mounting: Through-Hole
from Aries Electronics, Inc.
FEATURES. Eject-A-DIP ™ is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance. The latch locks in the connector or device, making it ideal for high-vibration environments. The latch, when used as an ejector, removes DIP packages without pin damage. [See More]
- Contact Type: Wire-Wrap
- Socket Type: DIP
- Product Type: IC Socket
- Mounting: Through-Hole
from Harwin Plc
IC 3-Level Wire Wrap Female/Socket Connector – 20 x contacts in a dual row format. Gold finish on contact area, Tin finish on termination. 7.62mm (0.3 ″) spacing between rows, and 2.54mm (0.1 ″) contact pitch on each row. Suitable for a Ø0.40-0.56mm mating pin. [See More]
- Contact Type: Wire-Wrap
- RoHS Compliant: RoHS Compliant
- Product Type: IC Socket
- Mounting: Solder
from Aries Electronics, Inc.
FEATURES. Low-Profile Collet Sockets with Wire Wrap Pins. For Solder Pin Tails, consult Data Sheet 12011. Choose from several sizes and plating options. GENERAL SPECIFICATIONS. BODY MATERIAL: black UL 94V-0 glass-filled 4/6 Nylon. PIN BODY: Brass 360 1/2-hard per UNS C36000 ASTM B16/B16M-05. PIN... [See More]
- Contact Type: Wire-Wrap
- Socket Type: DIP
- Product Type: IC Socket
- Mounting: Through-Hole
from Harwin Plc
IC 3-Level Wire Wrap Female/Socket Connector – 8 x contacts in a dual row format. Gold finish on contact area, Tin finish on termination. 7.62mm (0.3 ″) spacing between rows, and 2.54mm (0.1 ″) contact pitch on each row. Suitable for a Ø0.40-0.56mm mating pin. [See More]
- Contact Type: Wire-Wrap
- RoHS Compliant: RoHS Compliant
- Product Type: IC Socket
- Mounting: Solder
from Aries Electronics, Inc.
FEATURES. Capacitor bypasses unwanted electromagnetic noise. Available with either 0.1 µF or 0.33 µF capacitor, 50V, Z5U temperature coefficient. Open frame allows for more efficient utilization of board space and better cooling. Compatible with automatic insertion equipment. [See More]
- Contact Type: Wire-Wrap
- Socket Type: DIP
- Product Type: IC Socket
- Mounting: Through-Hole
from Aries Electronics, Inc.
FEATURES. Open-frame allows for more efficient utilization of board space and better cooling. 2- and 3-level wire wrap pins available. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable. GENERAL SPECIFICATIONS. BODY MATERIAL: black UL 94V-0 glass-filled 4/6 Nylon. [See More]
- Contact Type: Wire-Wrap
- Socket Type: DIP
- Product Type: IC Socket
- Mounting: Through-Hole
from Aries Electronics, Inc.
FEATURES. Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for 0.100 [2.54] grid or matrix patterns. Available with wire wrap or solder tail pins. For Solder Pin Tails, consult Data Sheet 12013. Break feature allows strips to be cut to the number of... [See More]
- Contact Type: Wire-Wrap
- Socket Type: Pin-Line™ Collet Socket
- Product Type: IC Socket
- Mounting: Through-Hole