Wire Wrap Pins IC Sockets and Headers
from Excel Cell Electronic USA Corp.
Accepts PCMCIS Type I, Type II, or Type III cards [See More]
- Contact Type: Wire-Wrap
- Socket Type: PCI Card Plug
- Product Type: IC Socket
- Mounting: Through-Hole
from Aries Electronics, Inc.
FEATURES. Eject-A-DIP ™ is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance. The latch locks in the connector or device, making it ideal for high-vibration environments. The latch, when used as an ejector, removes DIP packages without pin damage. [See More]
- Contact Type: Wire-Wrap
- Socket Type: DIP
- Product Type: IC Socket
- Mounting: Through-Hole
from Aries Electronics, Inc.
FEATURES. Low-Profile Collet Sockets with Wire Wrap Pins. For Solder Pin Tails, consult Data Sheet 12011. Choose from several sizes and plating options. GENERAL SPECIFICATIONS. BODY MATERIAL: black UL 94V-0 glass-filled 4/6 Nylon. PIN BODY: Brass 360 1/2-hard per UNS C36000 ASTM B16/B16M-05. PIN... [See More]
- Contact Type: Wire-Wrap
- Socket Type: DIP
- Product Type: IC Socket
- Mounting: Through-Hole
from Aries Electronics, Inc.
FEATURES. Capacitor bypasses unwanted electromagnetic noise. Available with either 0.1 µF or 0.33 µF capacitor, 50V, Z5U temperature coefficient. Open frame allows for more efficient utilization of board space and better cooling. Compatible with automatic insertion equipment. [See More]
- Contact Type: Wire-Wrap
- Socket Type: DIP
- Product Type: IC Socket
- Mounting: Through-Hole
from Aries Electronics, Inc.
FEATURES. Open-frame allows for more efficient utilization of board space and better cooling. 2- and 3-level wire wrap pins available. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable. GENERAL SPECIFICATIONS. BODY MATERIAL: black UL 94V-0 glass-filled 4/6 Nylon. [See More]
- Contact Type: Wire-Wrap
- Socket Type: DIP
- Product Type: IC Socket
- Mounting: Through-Hole