CSP IC Sockets and Headers
from Aries Electronics, Inc.
Available with or without filters for UV, infrared and full spectrum applications, Aries ’ new optical test socket is ideal for testing an optical sensor type chip and for EMMI testing a standard chip using an infrared head sensor. The optical test socket line can accommodate many different... [See More]
- Socket Type: CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from Ironwood Electronics, Inc.
GHz BGA sockets provide 6.5 to 10 GHz bandwidth in a small, cost effective ZIF socket for prototype and test applications. The GHz BGA socket is a simple mechanical socket based on elastomer connector technology. The GHz socket is a solder-less socket that can be mounted onto a PCB using screws and... [See More]
- Socket Type: BGA; CSP
- Mounting: ZIF, Epoxy Mount, Solderless
- Product Type: IC Socket
- Contact Type: Elastomer
from Advanced Interconnections Corp.
This micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The patented design offers the reliability of screw-machined terminals with multi-finger contacts in a compact SMT socket. At only 2.00mm larger than the device package,... [See More]
- Socket Type: BGA; CSP; LGA; Receptacle (optional feature); Test (optional feature)
- RoHS Compliant: RoHS Compliant (optional feature)
- Product Type: IC Socket; IC Headers
- Mounting: SMT (optional feature); Through-Hole (optional feature); Solder; Solder Ball
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression Spring-Probes which, are accurately... [See More]
- Socket Type: BGA; CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from Aries Electronics, Inc.
CSP/ µBGA Test & Burn-In Socket for Devices up to 13mm Square. Chinese. FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for QFP applications. Any device pitch of 0.20mm and larger. Sockets are easily mounted/removed to and from... [See More]
- Socket Type: BGA; CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]
- Socket Type: BGA; CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150