Press-fit IC Sockets and Headers
from Powell Electronics, Inc.
2.54mm Crimp press-Manual crimping press [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 3POS 2MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Current Rating: 3
from Powell Electronics, Inc.
2.54mm Crimp press-Manual crimping press [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 4POS 2MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Current Rating: 3
from Powell Electronics, Inc.
5.08mm pitch Crimp press-Manual crimping [See More]
- Mounting: Press-fit / Solderless Technology
- Contacts Pitch: 5.08
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 5POS 2MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Current Rating: 3
from Powell Electronics, Inc.
2.54mm Crimp press-manual crimping press [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 3POS 3MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Operating Temperature: -40 to 105
from Powell Electronics, Inc.
5.08mm pitch Crimp press-Manual crimping [See More]
- Mounting: Press-fit / Solderless Technology
- Contacts Pitch: 5.08
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 4POS 2.54MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 230
- Product Type: IC Headers
- Current Rating: 1.5
from Powell Electronics, Inc.
2.54mm Crimp press- Manual crimping pres [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 4POS 3MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Operating Temperature: -40 to 105
from Powell Electronics, Inc.
5.08mm pitch Crimp press-Manual crimping [See More]
- Mounting: Press-fit / Solderless Technology
- Contacts Pitch: 5.08
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 8POS 3MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Operating Temperature: -40 to 105
from Powell Electronics, Inc.
2.54mm Crimp press-Semi-Automatic crimpi [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 12POS 3MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Operating Temperature: -40 to 105
from Powell Electronics, Inc.
2.54mm Crimp press-semi-Automatic crimpi [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 18POS 3MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Operating Temperature: -40 to 105
from Powell Electronics, Inc.
1.27 mm Crimp press-Manual crimping pres [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 14POS 3MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Operating Temperature: -40 to 105
from Powell Electronics, Inc.
1.27 mm Crimp press-Semi-automatic crimp [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 3POS 2.5MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Current Rating: 3
from Powell Electronics, Inc.
MINI PCI EXPRESS EMBOSS TAPE CONN [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 8POS 2.5MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Current Rating: 3
from Powell Electronics, Inc.
0.8MM MINI PCI EXPRESS CONNECTOR 9H [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 2POS 2MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Current Rating: 3
from Powell Electronics, Inc.
MINI PCI EXPRESS 7H EMBOSS LATCH [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 3POS 2MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Current Rating: 3
from Powell Electronics, Inc.
3M CP2 Press-Fit Header, CP2 Series, CP [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 4POS 2MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Current Rating: 3
from Powell Electronics, Inc.
MATE-N-LOK PIN CONT H-PRESSURE [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 5POS 2MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Current Rating: 3
from Powell Electronics, Inc.
3M CP2 Press-Fit Header, CP2 Series, CP [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 8POS 2MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Current Rating: 3
from Powell Electronics, Inc.
3M CP2 Press-Fit Header, CP2 Series, CP [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 9POS 2MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Voltage Rating: 250
- Product Type: IC Headers
- Current Rating: 3
from Powell Electronics, Inc.
3M CP2 Press-Fit Header, CP2 Series, CP [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER R/A 2POS 2MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole, Right Angle
- Voltage Rating: 250
- Product Type: IC Headers
- Current Rating: 3
from Powell Electronics, Inc.
3M CP2 Press-Fit Header, CP2 Series, CP [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER R/A 4POS 2MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole, Right Angle
- Voltage Rating: 250
- Product Type: IC Headers
- Current Rating: 3
from Powell Electronics, Inc.
3M CP2 Press-Fit Header, CP2 Series, CP [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER R/A 5POS 2MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole, Right Angle
- Voltage Rating: 250
- Product Type: IC Headers
- Current Rating: 3
from Powell Electronics, Inc.
3M CP2 Press-Fit Header, CP2 Series, CP [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER R/A 8POS 2MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole, Right Angle
- Voltage Rating: 250
- Product Type: IC Headers
- Current Rating: 3
from Powell Electronics, Inc.
3M CP2 Press-Fit Header, CP2 Series, CP [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 2POS 2.54MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Current Rating: 3
- Product Type: IC Headers
- Operating Temperature: -65 to 105
from Powell Electronics, Inc.
SAP side assembly for 2.54 Crimp press [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 5POS 2.54MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Current Rating: 3
- Product Type: IC Headers
- Operating Temperature: -65 to 105
from Powell Electronics, Inc.
50 Ohm 2.40 mm Jack, Compression Mount [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Headers
from ODG (Origin Data Global)
CONN HEADER VERT 2POS 2.54MM [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology; Solder (optional feature); Through Hole
- Current Rating: 3
- Product Type: IC Headers
- Operating Temperature: -65 to 105
from Harwin Plc
IC Female/Socket Connector, Press-Fit – 8 x contacts in a dual row format. Gold finish on contact area, Tin finish on termination. 7.62mm (0.3 ″) spacing between rows, and 2.54mm (0.1 ″) contact pitch on each row. Suitable for a Ø0.40-0.56mm mating pin. [See More]
- Mounting: Press-fit / Solderless Technology; Solder
- RoHS Compliant: RoHS Compliant
- Product Type: IC Socket
- Current Rating: 1
from Aries Electronics, Inc.
Available with or without filters for UV, infrared and full spectrum applications, Aries ’ new optical test socket is ideal for testing an optical sensor type chip and for EMMI testing a standard chip using an infrared head sensor. The optical test socket line can accommodate many different... [See More]
- Mounting: Press-fit / Solderless Technology
- Socket Type: CSP; Test
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from JC Cherry, Inc.
Louver Type Socket Pins. Cable Soldering Type. Acceptable plug: Dia.1.00mm/0.039". Wire: AWG#22 0.3mm (Reference). ●High Current Socket Pin can be soldered to PCB or cable. ●Can be used with press-fitting into a hole of insulator. ●Your custom products welcome. ●Au plating... [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
from Mill-Max Mfg. Corp.
Solderless Press-Fit Standard Tail, 4 pins [See More]
- Mounting: Press-fit / Solderless Technology
- Socket Type: DIP
- Product Type: IC Socket
- Contact Plating: Gold; Gold Shell, Gold Inner Contact
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression Spring-Probes which, are accurately... [See More]
- Mounting: Press-fit / Solderless Technology
- Socket Type: BGA; CSP; Test
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from JC Cherry, Inc.
Louver Type Socket Pins. Cable Soldering Type. Acceptable plug: Dia.1.50mm/0.059". Wire: AWG#20 0.5mm (Reference). ●High Current Socket Pin can be soldered to PCB or cable. ●Can be used with press-fitting into a hole of insulator. ●Your custom products welcome. ●Au plating... [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
from Mill-Max Mfg. Corp.
Solderless Press-Fit , 6 pins [See More]
- Mounting: Press-fit / Solderless Technology
- Socket Type: DIP
- Product Type: IC Socket
- Contact Plating: Gold; Tin Shell, Gold Inner Contact
from Aries Electronics, Inc.
CSP/ µBGA Test & Burn-In Socket for Devices up to 13mm Square. Chinese. FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for QFP applications. Any device pitch of 0.20mm and larger. Sockets are easily mounted/removed to and from... [See More]
- Mounting: Press-fit / Solderless Technology
- Socket Type: BGA; CSP; Test
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from JC Cherry, Inc.
Louver Type Socket Pins. PCB Press-Fitting Type. Acceptable plug: Dia.1.50mm/0.059". PCB Hole Size: φ1.1+/-0.05 (Reference). ●High Current Socket Pin can be soldered to PCB or cable. ●Can be used with press-fitting into a hole of insulator. ●Your custom products welcome. [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
from Mill-Max Mfg. Corp.
Through Hole Solderless Press-Fit Shrouded Pin Header .030" (0,76mm) Pin Head [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology
- Contact Plating: Tin Shell
- Product Type: IC Headers
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]
- Mounting: Press-fit / Solderless Technology
- Socket Type: BGA; CSP; Test
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from JC Cherry, Inc.
Louver Type Socket Pins. PCB Press-Fitting. Acceptable plug: Dia.1.00mm/0.039". PCB Hole Size: Dia.0.9+/-0.05 (Reference). ●High Current Socket Pin can be soldered to PCB or cable. ●Can be used with press-fitting into a hole of insulator. ●Your custom products welcome. ●Au... [See More]
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
from Mill-Max Mfg. Corp.
Through Hole Solderless Press-Fit Shrouded Pin Header .030" (0,76mm) Pin Head [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology
- Contact Plating: Gold; Gold Shell
- Product Type: IC Headers
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single Point Probes available for small land area contact pads. Signal path during test only 0.077 [1.96]. Socket is... [See More]
- Mounting: Press-fit / Solderless Technology
- Socket Type: BGA; CSP; Test
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from JC Cherry, Inc.
Plunger Exchangeable Probe Pin. PAT PENDING. Outer Dia 5.0mm/0.197". 4.1N(418gf) at 4.4mm travel. Full travel 6.0mm. Preload 0.20N(20gf). Mounting hole dia.(Press) 4.1 ±0.02/0.161" ±0.001" [See More]
- Mounting: Press-fit / Solderless Technology
- Contact Resistance: 10
- Product Type: IC Socket
- Operating Temperature: -40 to 150
from Mill-Max Mfg. Corp.
Through Hole Solderless Press-Fit Pin Header .030" (0,76mm) Pin Head [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology
- Contact Plating: Gold; Tin or Gold Shell
- Product Type: IC Headers
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single-point Probes available for small land area contact pads. Signal path... [See More]
- Mounting: Press-fit / Solderless Technology
- Socket Type: BGA; CSP; Test
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from JC Cherry, Inc.
Plunger Exchangeable Probe Pin. PAT PENDING. Outer Dia 7.3mm/0.287". 7.7N(785gf) at 3.8mm travel. Full travel 5.8mm. Preload 3.5N(357gf). Mounting hole dia.(Press) 6.8 ±0.02 [See More]
- Mounting: Press-fit / Solderless Technology
- Contact Resistance: 10
- Product Type: IC Socket
- Operating Temperature: -40 to 150
from Mill-Max Mfg. Corp.
Through Hole Solderless Press-Fit Socket Accepts .015"- .025" (0,38 - 0,635 mm) dia leads [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology
- Contact Plating: Gold; Gold Shell, Gold Inner Contact
- Product Type: IC Socket
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during... [See More]
- Mounting: Press-fit / Solderless Technology
- Socket Type: BGA; CSP; Test
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from Mill-Max Mfg. Corp.
Through Hole Compliant Tail Press Fit Socket Accepts .015"- .025" (0,38 - 0,635 mm) dia leads [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology
- Contact Plating: Gold; Tin or Gold Shell, Tin or Gold Inner Contact
- Product Type: IC Socket
from Aries Electronics, Inc.
High-Frequency Center Probe Test Socket for Devices up to 27mm Square. Chinese. FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4-point crown insures “scrub ” on... [See More]
- Mounting: Press-fit / Solderless Technology
- Socket Type: Test
- Product Type: IC Socket
- Contact Resistance: 40
from Mill-Max Mfg. Corp.
Through Hole Compliant Tail Press Fit Socket Accepts .025"- .037" (0,635 - 0,94 mm)dia leads [See More]
- Mounting: Through-Hole; Press-fit / Solderless Technology
- Contact Plating: Gold; Tin Shell, Tin or Gold Inner Contact
- Product Type: IC Socket
from Aries Electronics, Inc.
FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression Spring-Probes which are accurately located by two molded plastic... [See More]
- Mounting: Press-fit / Solderless Technology
- Socket Type: Test
- Product Type: IC Socket
- Contact Resistance: 40
from Aries Electronics, Inc.
FEATURES. For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any pitch device from 0.20mm. Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression Spring-Probes which, are accurately located by two molded plastic... [See More]
- Mounting: Press-fit / Solderless Technology
- Socket Type: Test
- Product Type: IC Socket
- Contact Resistance: 40
from Aries Electronics, Inc.
FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]
- Mounting: Press-fit / Solderless Technology
- Socket Type: Test
- Product Type: IC Socket
- Contact Resistance: 40
from Aries Electronics, Inc.
FEATURES. Low resistance testing using dual independent Aries Kelvin spring-probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices. Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression Spring-Probes which, are... [See More]
- Mounting: Press-fit / Solderless Technology
- Socket Type: Test
- Product Type: IC Socket
- Operating Temperature: -55 to 150