Solderless IC Sockets and Headers
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
Interstitial PGA sockets with solderless [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Powell Electronics, Inc.
PGA sockets with solderless compliant pr [See More]
- Features: Solderless
- Socket Type: PGA
- Product Type: IC Socket
- Mounting: Solder
from Aries Electronics, Inc.
Available with or without filters for UV, infrared and full spectrum applications, Aries ’ new optical test socket is ideal for testing an optical sensor type chip and for EMMI testing a standard chip using an infrared head sensor. The optical test socket line can accommodate many different... [See More]
- Features: Solderless
- Socket Type: CSP; Test
- Product Type: IC Socket
- Mounting: Press-fit / Solderless Technology
from Ironwood Electronics, Inc.
These adapters provide ZIF sockets for the BGA device. Several styles of ZIF sockets are employed, includng "Clam Shell", "Open Top", and "Open Top with Lever". All of the ZIF sockets employ gold contacts and are capable of 10,000 insertion cycles. [See More]
- Features: Solderless; ZIF Lock; Clamshell Socket
- RoHS Compliant: RoHS Compliant (optional feature)
- Product Type: IC Socket
- Socket Type: BGA
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression Spring-Probes which, are accurately... [See More]
- Features: Solderless; Clamshell Socket
- Socket Type: BGA; CSP; Test
- Product Type: IC Socket
- Mounting: Press-fit / Solderless Technology
from Ironwood Electronics, Inc.
GHz BGA sockets provide 6.5 to 10 GHz bandwidth in a small, cost effective ZIF socket for prototype and test applications. The GHz BGA socket is a simple mechanical socket based on elastomer connector technology. The GHz socket is a solder-less socket that can be mounted onto a PCB using screws and... [See More]
- Features: Solderless; ZIF Lock; Screw Lock
- Socket Type: BGA
- Product Type: IC Socket
- Mounting: ZIF, Direct Mount, Solderless
from Aries Electronics, Inc.
CSP/ µBGA Test & Burn-In Socket for Devices up to 13mm Square. Chinese. FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for QFP applications. Any device pitch of 0.20mm and larger. Sockets are easily mounted/removed to and from... [See More]
- Features: Solderless; Clamshell Socket
- Socket Type: BGA; CSP; Test
- Product Type: IC Socket
- Mounting: Press-fit / Solderless Technology
from Ironwood Electronics, Inc.
Ironwood's GHz BGA sockets are ideal sockets for prototyping, test applications, and field-upgradeable designs. These patent pending sockets are the smallest, fastest, and densest BGA sockets available. Direct mount versions of the sockets offer the highest performance and completely eliminate... [See More]
- Features: Solderless; ZIF Lock; Screw Lock
- Socket Type: BGA
- Product Type: IC Socket
- Mounting: ZIF, Direct Mount, Solderless
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]
- Features: Solderless; Clamshell Socket
- Socket Type: BGA; CSP; Test
- Product Type: IC Socket
- Mounting: Press-fit / Solderless Technology
from Ironwood Electronics, Inc.
Swivel sockt lid, ROHS compliant [See More]
- Features: Solderless; ZIF Lock; Screw Lock
- Socket Type: QFP
- Product Type: IC Socket
- Mounting: ZIF, Direct Mount, Solderless
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single Point Probes available for small land area contact pads. Signal path during test only 0.077 [1.96]. Socket is... [See More]
- Features: Solderless; Clamshell Socket
- Socket Type: BGA; CSP; Test
- Product Type: IC Socket
- Mounting: Press-fit / Solderless Technology
from Ironwood Electronics, Inc.
Ironwood Electronics Giga-Spring ™ (POGO) are small footprint socket compatible with the GHz elastomer sockets with increased endurance and temperature range. The 1mm contactor is a spring pin (pogo) with 30 gram actuation force per ball and cycle life of 500,000 insertions. The self... [See More]
- Features: Solderless; ZIF Lock; Clamshell Socket
- Socket Type: BGA
- Product Type: IC Socket
- Mounting: ZIF, Direct Mount, Solderless
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single-point Probes available for small land area contact pads. Signal path... [See More]
- Features: Solderless; Clamshell Socket
- Socket Type: BGA; CSP; Test
- Product Type: IC Socket
- Mounting: Press-fit / Solderless Technology
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during... [See More]
- Features: Solderless; Clamshell Socket
- Socket Type: BGA; CSP; Test
- Product Type: IC Socket
- Mounting: Press-fit / Solderless Technology
from Aries Electronics, Inc.
High-Frequency Center Probe Test Socket for Devices up to 27mm Square. Chinese. FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4-point crown insures “scrub ” on... [See More]
- Features: Solderless; Clamshell Socket
- Socket Type: Test
- Product Type: IC Socket
- Mounting: Press-fit / Solderless Technology
from Aries Electronics, Inc.
FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression Spring-Probes which are accurately located by two molded plastic... [See More]
- Features: Solderless; Clamshell Socket
- Socket Type: Test
- Product Type: IC Socket
- Mounting: Press-fit / Solderless Technology
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4 Point crown insures scrub on solder oxides. Single-point Probes available for small land area contact pads. Signal path during test only 0.077 [1.96]. Socket is easily mounted... [See More]
- Features: Solderless; Clamshell Socket
- Socket Type: DIP; Test
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from Aries Electronics, Inc.
FEATURES. For high-frequency test of CSP, BGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4-point crown insures scrub on solder oxides, while pointed probe works with LGA ’s, MLF ’s, etc. Single-point Probes available for small land area contact pads. Signal... [See More]
- Features: Solderless; Clamshell Socket
- Socket Type: Test
- Product Type: IC Socket
- Contact Resistance: 40
from Aries Electronics, Inc.
FEATURES. For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any pitch device from 0.20mm. Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression Spring-Probes which, are accurately located by two molded plastic... [See More]
- Features: Solderless; Clamshell Socket
- Socket Type: Test
- Product Type: IC Socket
- Mounting: Press-fit / Solderless Technology
from Aries Electronics, Inc.
FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]
- Features: Solderless; Clamshell Socket
- Socket Type: Test
- Product Type: IC Socket
- Mounting: Press-fit / Solderless Technology
from Aries Electronics, Inc.
FEATURES. Low resistance testing using dual independent Aries Kelvin spring-probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices. Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression Spring-Probes which, are... [See More]
- Features: Solderless; Clamshell Socket
- Socket Type: Test
- Product Type: IC Socket
- Mounting: Press-fit / Solderless Technology
from Aries Electronics, Inc.
FEATURES. Solderless Spring-Probes pressure mount to the test board and device solder ball or pad. Only 0.077 [1.96] signal path. Very low inductance and capacitance. Small footprint allows max. use of test board area. Chip guides allow accurate device location. Spring loaded contacts provide high... [See More]
- Features: Solderless; Clamshell Socket (optional feature)
- Socket Type: BGA; DIP; Test
- Product Type: IC Socket
- Contact Resistance: 40