Test / Prototyping Socket IC Sockets and Headers
from Powell Electronics, Inc.
TEST ADAPTER, #22 SOCKET BULK (RED) [See More]
- Socket Type: Test
- Product Type: IC Socket
from Molex Signal Tech Industrial Ltd.
The rapid expansion of connected devices and data-intensive applications are driving the growing demand for highly efficient and adaptive high-performance computing solutions. Whether it ’s a complex SoC for a mobile phone or gaming system, volatile memory or an automotive radar application,... [See More]
- Socket Type: BGA; LGA; QFNL; Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket PKI 10 A Au YELLOW [See More]
- Socket Type: Test
- Product Type: IC Socket
from Molex Signal Tech Industrial Ltd.
IC developers are increasingly integrating functionalities within a single package, escalating the complexity of test. Higher speed digital and analog devices are being manufactured at record volumes and the need for high performance testing has never been greater. The DaVinci Series Test Socket is... [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket KD 10 RED [See More]
- Socket Type: Test
- Product Type: IC Socket
from Molex Signal Tech Industrial Ltd.
Highly precised top and bottom array simultaneous test capable socket for effective package on package test. Customized socket design is capable to test high speed signals in lab, engineering, SLT and ATE applications. Controlled impedance loop-back with PCB for high speed signal integrity. Features... [See More]
- Socket Type: BGA; LGA; Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket BU 10 [See More]
- Socket Type: Test
- Product Type: IC Socket
from Molex Signal Tech Industrial Ltd.
Features & Benefits. Patented, low profile contact. Solderless memory replacement. Short signal path. Conformal to recessed LGAs. High speed signal integrity. Electrically transparent contact. High frequency bandwidth > 40GHz. Low inductance. Durability. No PCB or solder ball damage. Minimal... [See More]
- Socket Type: LGA; Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket BIL 30 BROWN [See More]
- Socket Type: Test
- Product Type: IC Socket
from Molex Signal Tech Industrial Ltd.
Highly reliable multi site strip test socket . Customized design to suite any strip test handler. High parallelism offers higher throughput. Features & Benefits. Gutenberg sockets address requirements of the most advanced strip test applications. They are designed for million cycle reliability... [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket BIL 30 Au GREEN [See More]
- Socket Type: Test
- Product Type: IC Socket
from Molex Signal Tech Industrial Ltd.
5A continues current carrying capacity and capable -50 to 170deg C test environment. Proprietary contact design with wiping action at device pad to ensure consistent contact resistance. Minimal scrub action to the PCB pad. Features & Benefits. Smiths Interconnect's Celsius contact takes... [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket BUG 10 YELLOW [See More]
- Socket Type: Test
- Product Type: IC Socket
from Molex Signal Tech Industrial Ltd.
Customized test sockets for any IC packages. Suitable for lab, Engineering, SLT & ATE test application. Wide selection of Smiths Interconnects spring pins with low and stable contact resistance. World class design, Lab and manufacturing facility to ensure consistence product performance with... [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket BUG 10 Au WHITE [See More]
- Socket Type: Test
- Product Type: IC Socket
from Molex Signal Tech Industrial Ltd.
Smiths Interconnect offers high value Thermal Management Lid capabilities including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts. Our solutions are developed to be compatible with existing test hardware footprints for simple integration, reducing test set-up time... [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket BIL 20 WHITE [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket BIL 20 Au GREY [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket MBI 1 BLACK [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket MBI 1 Au Blue [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket MKU 1 BLACK [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket PKI 100 RED [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket PKI 110 BLUE [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket Adapter KUN 30 GREEN [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket SEB 2600 BLUE [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket SEB 2610 BLACK [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket SEB 2610 PURPLE [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket SEB 2620 GREY [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket SEB 2630 GREEN [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket SEP 2610 BLUE [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket SEP 2620 GREEN [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket MSEB 2600 Au GREEN [See More]
- Socket Type: Test
- Product Type: IC Socket
from Powell Electronics, Inc.
Test Socket MSEB 2610 Au YELLOW [See More]
- Socket Type: Test
- Product Type: IC Socket
from JC Cherry, Inc.
Power Transistor Test Sockets. Combination Bus Bar Tape. High Current. High Voltage. High Temperature. ●Power Transistor Test Socket accommodate various packages. ●Support the package such as TO-3P, TO-66, TO-220, TO-247, TO-254, TO-257, TO-262, TO-264. [See More]
- Socket Type: Test
- Insulation Resistance: 500
- Product Type: IC Socket
- Contact Resistance: 50
from Aries Electronics, Inc.
Available with or without filters for UV, infrared and full spectrum applications, Aries ’ new optical test socket is ideal for testing an optical sensor type chip and for EMMI testing a standard chip using an infrared head sensor. The optical test socket line can accommodate many different... [See More]
- Socket Type: CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from Advanced Interconnections Corp.
Our Flip-Top ™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top ™ BGA Sockets require no external hold-downs and use... [See More]
- Socket Type: BGA; LGA; Test
- RoHS Compliant: RoHS Compliant (optional feature)
- Product Type: IC Socket
- Mounting: SMT (optional feature); Through-Hole (optional feature); Solder; Solder Ball
from JC Cherry, Inc.
Power Transistor Test Sockets. Combination Bus Bar Tape. Low-Inductance. High Current. High Voltage. High Temperature. ●The signal are improved by wide drain and source (Collector and Emitter) and low inductance of the transistor electrode. ●Power Transistor Test Socket accommodate... [See More]
- Socket Type: Test
- Insulation Resistance: 500
- Product Type: IC Socket
- Contact Resistance: 50
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression Spring-Probes which, are accurately... [See More]
- Socket Type: BGA; CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from JC Cherry, Inc.
Power Transistor Test Sockets. Low Insertion Force. ●For Test of Power Transistor, Thyristors and other discrete devices. ●Kelvin Contact type. ●Support the package such as TO-220, TO-3P, TO-66, TO-247, TO-254, TO-262, TO-264. [See More]
- Socket Type: Test
- Current Rating: 30
- Product Type: IC Socket
- Insulation Resistance: 500
from Aries Electronics, Inc.
CSP/ µBGA Test & Burn-In Socket for Devices up to 13mm Square. Chinese. FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for QFP applications. Any device pitch of 0.20mm and larger. Sockets are easily mounted/removed to and from... [See More]
- Socket Type: BGA; CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from JC Cherry, Inc.
Power Transistor Test Sockets. PC Board Mounting Tape. Low-Inductance. High Current. High Voltage. High Temperature. ●The signal are improved by wide drain and source (Collector and Emitter) and low inductance of the transistor electrode. ●Power Transistor Test Socket accommodate various... [See More]
- Socket Type: Test
- Insulation Resistance: 500
- Product Type: IC Socket
- Contact Resistance: 50
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]
- Socket Type: BGA; CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from JC Cherry, Inc.
Power Transistor Test Sockets. PC Board Mounting type. High Current. High Voltage. High Temperature. ●Power Transistor Test Socket accommodate various packages. ●Support the package such as TO-3P, TO-66, TO-220, TO-247, TO-254, TO-257, TO-262, TO-264. [See More]
- Socket Type: Test
- Insulation Resistance: 500
- Product Type: IC Socket
- Contact Resistance: 50
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single Point Probes available for small land area contact pads. Signal path during test only 0.077 [1.96]. Socket is... [See More]
- Socket Type: BGA; CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from JC Cherry, Inc.
Test & Burn-In Socket. GQ Frame Series. Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. For SOP Device, LGA Device [See More]
- Socket Type: Test
- Voltage Rating: 500
- Product Type: IC Socket
- Insulation Resistance: 100
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single-point Probes available for small land area contact pads. Signal path... [See More]
- Socket Type: BGA; CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from JC Cherry, Inc.
Test & Burn-In Socket. GU10 Frame Series. Size 10x16mm / 0.39"x0.63". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. Solder Dip Type/ High Frequency Response Type. For example:MEMS Device, SAW Filter, Semiconductor,... [See More]
- Socket Type: Test
- Mounting: Solder
- Product Type: IC Socket
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during... [See More]
- Socket Type: BGA; CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from JC Cherry, Inc.
Test & Burn-In Socket. GU16 Frame Series. Size 16x33.5mm / 0.63"x1.32". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. How to order for Custom design. GU16-xxxxxxxxxx. *P/N will be informed after fixing... [See More]
- Socket Type: Test
- Product Type: IC Socket
from Aries Electronics, Inc.
KEY PERFORMANCE ELEMENTS – Series AR4HT. High-Temperature 200 °C (high-frequency bandwidth, low inductance, high-current, reliable, durable). Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). Excellent choice for low cost hand test... [See More]
- Socket Type: BGA; LGA; QFNL; Test; MLCC, Bumped Die Devices
- Current Rating: 4
- Product Type: IC Socket
- Operating Temperature: -55 to 200
from JC Cherry, Inc.
Test & Burn-In Socket. GU20S Frame Series. Size 20x20mm / 0.79"x0.79". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. How to order for Custom design. GU20S-xxxxxxxxxx. *P/N will be informed after fixing... [See More]
- Socket Type: Test
- Product Type: IC Socket
from Aries Electronics, Inc.
High-Frequency Center Probe Test Socket for Devices up to 27mm Square. Chinese. FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4-point crown insures “scrub ” on... [See More]
- Socket Type: Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Contact Resistance: 40
from JC Cherry, Inc.
Test & Burn-In Socket. GU22 Frame Series. Size 22x22mm / 0.87"x0.87". Can also be used as Burn in Socket. ●Highly reliable M-pin Probes as contact parts. ●High Frequency. For BGA Device, QFN Device. 0.4mm/0.016" Pitch : 16x16 Contact Max. 0.5mm/0.020" Pitch : 10x10 Contact Max [See More]
- Socket Type: BGA; LGA; QFNL; Test
- Voltage Rating: 100
- Product Type: IC Socket
- Current Rating: 1
from Aries Electronics, Inc.
FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression Spring-Probes which are accurately located by two molded plastic... [See More]
- Socket Type: Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Contact Resistance: 40
from JC Cherry, Inc.
Test & Burn-In Socket. GU29 Frame / BGA pkg. Size 29x30.6mm / 1.14"x1.20". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. For BGA Device. How to order for Custom design. GQ29-BGAxxxxxxx. *P/N will be informed after... [See More]
- Socket Type: Test
- Product Type: IC Socket
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4 Point crown insures scrub on solder oxides. Single-point Probes available for small land area contact pads. Signal path during test only 0.077 [1.96]. Socket is easily mounted... [See More]
- Socket Type: DIP; Test
- Operating Temperature: -55 to 150
- Product Type: IC Socket
- Contact Type: Spring Loaded
from JC Cherry, Inc.
Test & Burn-In Socket. GU31 Frame Series. Size 31x46mm / 1.22"x1.81". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. How to order for Custom design. GU31-xxxxxxxxxx. *P/N will be informed after fixing specifications. [See More]
- Socket Type: Test
- Product Type: IC Socket
from Aries Electronics, Inc.
FEATURES. For high-frequency test of CSP, BGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4-point crown insures scrub on solder oxides, while pointed probe works with LGA ’s, MLF ’s, etc. Single-point Probes available for small land area contact pads. Signal... [See More]
- Socket Type: Test
- Contact Resistance: 40
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from JC Cherry, Inc.
Test & Burn-In Socket. GU37 Frame Series. Size 37x39mm / 1.46"x1.54". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃ [See More]
- Socket Type: Test
- Contacts Pitch: 0.5000 to 0.8000
- Product Type: IC Socket
from Aries Electronics, Inc.
FEATURES. For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any pitch device from 0.20mm. Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression Spring-Probes which, are accurately located by two molded plastic... [See More]
- Socket Type: Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Contact Resistance: 40
from JC Cherry, Inc.
Test & Burn-In Socket. GU40 Frame Series. Size 40x50.25mm / 1.57"x1.98". Can also be used as Burn in Socket. Customizable to heat sink type. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. How to order for Custom design. GU40-xxxxxxxxxx. *P/N will be... [See More]
- Socket Type: Test
- Product Type: IC Socket
from Aries Electronics, Inc.
FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]
- Socket Type: Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Contact Resistance: 40
from JC Cherry, Inc.
Test & Burn-In Socket. GU48 Frame Series. Size 48x59.5mm / 1.89"x2.34". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. How to order for Custom design. GU48-xxxxxxxxxx. *P/N will be informed after fixing... [See More]
- Socket Type: Test
- Product Type: IC Socket
from Aries Electronics, Inc.
KEY PERFORMANCE ELEMENTS – Series AR4HT. High-Temperature 200 °C (high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing). Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). [See More]
- Socket Type: BGA; CSP; LGA; QFNL; Test; MLCC, Bumped Die Devices
- Operating Temperature: -67 to 392
- Product Type: IC Socket
- Contacts Pitch: 2.54
from JC Cherry, Inc.
Test & Burn-In Socket. GU60 Frame Series. Size 60x60mm / 2.36"x2.36". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. How to order for Custom design. GU60-xxxxxxxxxx. *P/N will be informed after fixing specifications. [See More]
- Socket Type: Test
- Product Type: IC Socket
from Aries Electronics, Inc.
FEATURES. A strong, metal cam activates the normally-closed contacts, preventing dependency on plastic for contact force. The handle can be provided on right or left hand side. For special handle requirements, consult factory. Any footprint accepted on standard 8x8 to 21x21 grid. GENERAL... [See More]
- Socket Type: Test
- Mounting: Through-Hole
- Product Type: IC Socket
- Current Rating: 1
from JC Cherry, Inc.
Test & Burn-In Socket. GU66 Frame Series. Size 58x66mm / 2.29"x2.60". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. How to order for Custom design. GU66-xxxxxxxxxx. *P/N will be informed after fixing specifications. [See More]
- Socket Type: Test
- Product Type: IC Socket
from Aries Electronics, Inc.
FEATURES. User replaceable patented Microstrip ™ contacts which lie flat on the DUT board, and becomes part of the transmission line decreasing down-time. Same high-frequency performance of our standard Microstrip ™ contacts. Available in lead pitches from 0.4mm to 5.0mm. Easy-to-use... [See More]
- Socket Type: Test
- Contact Resistance: 70
- Product Type: IC Socket
- Operating Temperature: -40 to 200
from JC Cherry, Inc.
Test & Burn-In Socket. GU78 Frame / BGA pkg. Size 78x116.7mm / 3.07"x4.59". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. For BGA Device. How to order for Custom design. GU78-BGAxxxxxxx. *P/N will be informed after... [See More]
- Socket Type: Test
- Product Type: IC Socket
from Aries Electronics, Inc.
FEATURES. Universal Test socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers. All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 or 15.24] centers. Contacts are normally closed to eliminate dependence on plastic to sustain contact. Socket handle can be configured with... [See More]
- Socket Type: DIP; Test
- Mounting: Solder
- Product Type: IC Socket
- Current Rating: 1
from JC Cherry, Inc.
Test & Burn-In Socket. GU78 Frame / DIP pkg. Size 78x116.7mm / 3.07"x4.59". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. For DIP Device. How to order for Custom design. GU78-DIPxxxxxxx. *P/N will be informed after... [See More]
- Socket Type: Test
- Product Type: IC Socket
from Aries Electronics, Inc.
FEATURES. Low resistance testing using dual independent Aries Kelvin spring-probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices. Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression Spring-Probes which, are... [See More]
- Socket Type: Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from JC Cherry, Inc.
Test Head. ●Suitable for measuring and verifying test sockets, and mount on the board (Burn-In Board). ●Contact method is adopt probe pin which allow easy to measure. ●We are able to design and manufacture according to your specifications, please feel free to contact us. [See More]
- Socket Type: Test
- Insulation Resistance: 100
- Product Type: IC Socket; IC Headers
- Contact Resistance: 200
from Aries Electronics, Inc.
FEATURES. Solderless Spring-Probes pressure mount to the test board and device solder ball or pad. Only 0.077 [1.96] signal path. Very low inductance and capacitance. Small footprint allows max. use of test board area. Chip guides allow accurate device location. Spring loaded contacts provide high... [See More]
- Socket Type: BGA; DIP; Test
- Contact Resistance: 40
- Product Type: IC Socket
- Contact Type: Spring Loaded
from JC Cherry, Inc.
Test Socket. GU29 Frame / QFN pkg. Size 29x30.6mm / 1.14"x1.20". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. For QFN Device. How to order for Custom design. GQ29-QFNxxxxxxx. *P/N will be informed after fixing... [See More]
- Socket Type: Test
- Product Type: IC Socket
from Aries Electronics, Inc.
FEATURES. A strong, metal cam activates the normally-closed contacts, preventing dependency on plastic for contact force. The handle can be provided on right or left hand side. For special handle requirements, consult factory. Any footprint accepted on standard 13x13 to 21x21 grid. GENERAL... [See More]
- Socket Type: PGA; Test
- Mounting: Through-Hole
- Product Type: IC Socket
- Current Rating: 1
from Aries Electronics, Inc.
FEATURES. Universal ZIF DIP Test Socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers. All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to 15.24] centers. Swing quick-release handle down to open contacts and insert device. Release and handle automatically returns as... [See More]
- Socket Type: DIP; Test
- Mounting: Solder
- Product Type: IC Socket
- Operating Temperature: -55 to 200
from Aries Electronics, Inc.
FEATURES. User replaceable patented Microstrip ™ contacts which lie flat on the DUT board, and become part of the transmission line decreasing down-time. Same high-frequency performance of our standard Microstrip ™ contacts. Available in lead pitches from 0.4mm to 5.0mm. Easy to use... [See More]
- Socket Type: Test
- Contact Resistance: 70
- Product Type: IC Socket
- Contact Plating: Gold (optional feature); Nickel (optional feature)
from Aries Electronics, Inc.
FEATURES. The Aries Universal Test Socket Receptacle is sturdy, open-frame and easily mounted to PC boards. Allows for easy replacement of Aries and other manufacturers ’ test sockets. The threaded inserts at both ends of the receptacle provide a firm and positive connection for the test... [See More]
- Socket Type: DIP; Test
- Mounting: Through-Hole
- Product Type: IC Socket
- Current Rating: 3
from Aries Electronics, Inc.
FEATURES. Aries Universal Test socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers. All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to 15.24] centers. Contacts are normally closed to eliminate dependence on plastic to sustain contact. Socket handle can be configured... [See More]
- Socket Type: DIP; Test
- Current Rating: 1
- Product Type: IC Socket
- Insulation Resistance: 1000