BGA IC Sockets and Headers
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Molex Signal Tech Industrial Ltd.
The next generation of high-performance semiconductors —from advanced Consumer SoCs and GPUs to AI Accelerators and Data Center processors demands unprecedented bandwidth and speed. Yet as data rates climb, ensuring signal integrity during testing becomes exponentially more difficult. Even... [See More]
- Socket Type: BGA; LGA
- Current Rating: 3 to 3.7
- Product Type: IC Socket
- Contact Resistance: 80
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Molex Signal Tech Industrial Ltd.
The rapid expansion of connected devices and data-intensive applications are driving the growing demand for highly efficient and adaptive high-performance computing solutions. Whether it ’s a complex SoC for a mobile phone or gaming system, volatile memory or an automotive radar application,... [See More]
- Socket Type: BGA; LGA; QFNL; Test
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Molex Signal Tech Industrial Ltd.
Highly precised top and bottom array simultaneous test capable socket for effective package on package test. Customized socket design is capable to test high speed signals in lab, engineering, SLT and ATE applications. Controlled impedance loop-back with PCB for high speed signal integrity. Features... [See More]
- Socket Type: BGA; LGA; Test
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from Powell Electronics, Inc.
BGA sockets 1.27 mm grid with self-align [See More]
- Socket Type: BGA
- Product Type: IC Socket
from JC Cherry, Inc.
Test & Burn-In Socket. GU22 Frame Series. Size 22x22mm / 0.87"x0.87". Can also be used as Burn in Socket. ●Highly reliable M-pin Probes as contact parts. ●High Frequency. For BGA Device, QFN Device. 0.4mm/0.016" Pitch : 16x16 Contact Max. 0.5mm/0.020" Pitch : 10x10 Contact Max [See More]
- Socket Type: BGA; LGA; QFNL; Test
- Voltage Rating: 100
- Product Type: IC Socket
- Current Rating: 1
from Mill-Max Mfg. Corp.
Surface Mount .050 Grid; BGA Header [See More]
- Socket Type: BGA
- Mounting: SMT
- Product Type: IC Headers
- Contact Plating: Gold; Gold Shell
from Ironwood Electronics, Inc.
We use the term "Land Sockets" to refer to a part that provides SMT lands for soldering an IC device onto. Land sockets present a pluggable interface to one of our compatible sockets or SMT emulator feet. Land sockets are a very cost effective alternative to large bodied ZIF sockets. We offer land... [See More]
- Socket Type: BGA
- Mounting: SMT; Through-Hole
- Product Type: IC Socket
- Contact Type: Low Profile Pins
from Plastronics Socket Company, Inc.
Flexible socket designs - reduced cost and. lead-time. Integrated socket solutions - reduced risk. In-house tool and mold - rapid response and turnaround. Extensive catalog - easy purchase. Plastronics patented technologies are based on solving the difficult industry problems associated with high... [See More]
- Socket Type: BGA
- Current Rating: 1
- Product Type: IC Socket
- Contact Resistance: 35
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression Spring-Probes which, are accurately... [See More]
- Socket Type: BGA; CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from Advanced Interconnections Corp.
Our Flip-Top ™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top ™ BGA Sockets require no external hold-downs and use... [See More]
- Socket Type: BGA; LGA; Test
- RoHS Compliant: RoHS Compliant (optional feature)
- Product Type: IC Socket
- Mounting: SMT (optional feature); Through-Hole (optional feature); Solder; Solder Ball
from Mill-Max Mfg. Corp.
Surface Mount 1mm Grid; BGA Header [See More]
- Socket Type: BGA
- Mounting: SMT
- Product Type: IC Headers
- Contact Plating: Gold; Gold Shell
from Ironwood Electronics, Inc.
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- Socket Type: BGA
- Mounting: SMT; Through-Hole
- Product Type: IC Socket
- Contact Type: Low Profile Pins
from Plastronics Socket Company, Inc.
Flexible socket designs - reduced cost and. lead-time. Integrated socket solutions - reduced risk. In-house tool and mold - rapid response and turnaround. Extensive catalog - easy purchase. Plastronics patented technologies are based on solving the difficult industry problems associated with high... [See More]
- Socket Type: BGA
- Current Rating: 1
- Product Type: IC Socket
- Contact Resistance: 35
from Aries Electronics, Inc.
CSP/ µBGA Test & Burn-In Socket for Devices up to 13mm Square. Chinese. FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for QFP applications. Any device pitch of 0.20mm and larger. Sockets are easily mounted/removed to and from... [See More]
- Socket Type: BGA; CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from Mill-Max Mfg. Corp.
Surface Mount .050 Grid; BGA Socket [See More]
- Socket Type: BGA
- Mounting: SMT
- Product Type: IC Socket
- Contact Plating: Gold; Gold Shell, Gold Inner Contact
from Ironwood Electronics, Inc.
These adapters provide ZIF sockets for the BGA device. Several styles of ZIF sockets are employed, includng "Clam Shell", "Open Top", and "Open Top with Lever". All of the ZIF sockets employ gold contacts and are capable of 10,000 insertion cycles. [See More]
- Socket Type: BGA
- RoHS Compliant: RoHS Compliant (optional feature)
- Product Type: IC Socket
- Mounting: MGA
from Plastronics Socket Company, Inc.
Flexible socket designs - reduced cost and. lead-time. Integrated socket solutions - reduced risk. In-house tool and mold - rapid response and turnaround. Extensive catalog - easy purchase. Plastronics patented technologies are based on solving the difficult industry problems associated with high... [See More]
- Socket Type: BGA
- Current Rating: 1
- Product Type: IC Socket
- Contact Resistance: 30
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]
- Socket Type: BGA; CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from Mill-Max Mfg. Corp.
Surface Mount 1mm Grid; BGA Socket [See More]
- Socket Type: BGA
- Mounting: SMT
- Product Type: IC Socket
- Contact Plating: Gold; Gold Shell, Gold Inner Contact
from Ironwood Electronics, Inc.
GHz BGA sockets provide 6.5 to 10 GHz bandwidth in a small, cost effective ZIF socket for prototype and test applications. The GHz BGA socket is a simple mechanical socket based on elastomer connector technology. The GHz socket is a solder-less socket that can be mounted onto a PCB using screws and... [See More]
- Socket Type: BGA
- Mounting: ZIF, Direct Mount, Solderless
- Product Type: IC Socket
- Contact Type: Elastomer
from Plastronics Socket Company, Inc.
Less complex and more precise tooling. Larger arrays - increase socket utilization. Socket footprint - increase board utilization. Slider-carrier - less contact stress loads. More robust - increase socket life. Plastronics patented technologies are based on solving the difficult industry problems... [See More]
- Socket Type: BGA
- Mounting: Through-Hole
- Product Type: IC Socket
- Current Rating: 1
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single Point Probes available for small land area contact pads. Signal path during test only 0.077 [1.96]. Socket is... [See More]
- Socket Type: BGA; CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from Mill-Max Mfg. Corp.
Surface Mount 0.8mm Grid; BGA Socket [See More]
- Socket Type: BGA
- Mounting: SMT
- Product Type: IC Socket
- Contact Plating: Gold; Gold Shell, Gold Inner Contact
from Ironwood Electronics, Inc.
Ironwood's GHz BGA sockets are ideal sockets for prototyping, test applications, and field-upgradeable designs. These patent pending sockets are the smallest, fastest, and densest BGA sockets available. Direct mount versions of the sockets offer the highest performance and completely eliminate... [See More]
- Socket Type: BGA
- Mounting: ZIF, Direct Mount, Solderless
- Product Type: IC Socket
- Contact Type: Elastomer
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single-point Probes available for small land area contact pads. Signal path... [See More]
- Socket Type: BGA; CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from Ironwood Electronics, Inc.
Ironwood Electronics Giga-Spring ™ (POGO) are small footprint socket compatible with the GHz elastomer sockets with increased endurance and temperature range. The 1mm contactor is a spring pin (pogo) with 30 gram actuation force per ball and cycle life of 500,000 insertions. The self... [See More]
- Socket Type: BGA
- Mounting: ZIF, Direct Mount, Solderless
- Product Type: IC Socket
- Contact Type: Spring Loaded
from Aries Electronics, Inc.
FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during... [See More]
- Socket Type: BGA; CSP; Test
- Mounting: Press-fit / Solderless Technology
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from Aries Electronics, Inc.
FEATURES. Any grid size pitch available from 0.20mm. Socket lid nests device into socket for a reliable connection. Suitable for prototyping, test, or burn-in of CSP, BGA, µBGA and LGA devices. ZIF style socket using Aries solderless, Au-plated pressure mount Spring Probe. Special lid designs... [See More]
- Socket Type: BGA; CSP; LGA; SZIP
- Mounting: Through-Hole
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from Aries Electronics, Inc.
KEY PERFORMANCE ELEMENTS – Series AR4HT. High-Temperature 200 °C (high-frequency bandwidth, low inductance, high-current, reliable, durable). Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). Excellent choice for low cost hand test... [See More]
- Socket Type: BGA; LGA; QFNL; Test; MLCC, Bumped Die Devices
- Current Rating: 4
- Product Type: IC Socket
- Operating Temperature: -55 to 200
from Aries Electronics, Inc.
FEATURES. Pressure-mount plunge to board interposer. Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more. Very low inductance per contact site. High cycle life with easy maintenance. Manual or Automated Handler applications. GENERAL SPECIFICATIONS. INSERTION LOSS: less than -1dB... [See More]
- Socket Type: BGA; CSP; QFNL; QFP
- Current Rating: 4
- Product Type: IC Socket
- Contact Resistance: 20
from Aries Electronics, Inc.
KEY PERFORMANCE ELEMENTS – Series AR4HT. High-Temperature 200 °C (high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing). Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). [See More]
- Socket Type: BGA; CSP; LGA; QFNL; Test; MLCC, Bumped Die Devices
- Operating Temperature: -67 to 392
- Product Type: IC Socket
- Contacts Pitch: 2.54
from Aries Electronics, Inc.
FEATURES. Solderless Spring-Probes pressure mount to the test board and device solder ball or pad. Only 0.077 [1.96] signal path. Very low inductance and capacitance. Small footprint allows max. use of test board area. Chip guides allow accurate device location. Spring loaded contacts provide high... [See More]
- Socket Type: BGA; DIP; Test
- Contact Resistance: 40
- Product Type: IC Socket
- Contact Type: Spring Loaded