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Supplier: DigiKey
Description: SOLDER BAR SN63/PB37 1LB (454G)
- Melting Range: 361 F
- Features: Other
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Indium Corporation
Description: Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 183ºC Eutectic Solidus Melting Temperature: 183ºC Eutectic Pb-Free: No
- Diameter / Thickness: 0.002 inch
- Features: Strip / Sheet / Foil
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire, strip, paste, powder or
- Melting Range: 361 F
- Conductivity: 71,920,000,000 µS/cm
- Approvals / Conformance: ASTM / UNS
- Product Form: Paste, Powder, Preform
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Supplier: Indium Corporation
Description: Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 183ºC Eutectic Solidus Melting Temperature: 183ºC Eutectic Pb-Free: No
- Diameter / Thickness: 0.3 inch
- Features: Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Accuris
Description: Solder, Tin - Lead, Eutectic 63Sn - 37Pb
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Supplier: Accuris
Description: SOLDER, TIN - LEAD, EUTECTIC 63Sn - 37Pb
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Supplier: Indium Corporation
Description: Indium Corporation bar solder is a high purity material manufactured to provide consistent and reliable performance manufactured per J-STD. Bars are rectangular in shape (1.66 lbs./ each). 15 bars per box. 25 lbs. per box Minimum order quantity is 25 lbs.
- Features: Other
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Newark, An Avnet Company
Description: SOLID WIRE SN63 PB37
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Supplier: Allied Electronics, Inc.
Description: vague claims of outstanding solder purity. Complete analyses of KESTER ULTRAPURE® BAR SOLDERS prove that every batch conforms to the strictest quality control standards in the solder industry.
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Supplier: Allied Electronics, Inc.
Description: Bar Solder, Electropure, Sn63Pb37, 2.5 lbs. per Bar
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Supplier: Newark, An Avnet Company
Description: SOLDER WIRE, 63/37 SN/PB, 1LB; Leaded / Lead Free:Leaded; Flux Type:Rosin Activated RA; Solder Alloy:63, 37 Sn, Pb; External Diameter - Metric:0.635mm; External Diameter - Imperial:0.025"; Melting Temperature:183°C; Product
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Supplier: Newark, An Avnet Company
Description: SOLDER BAR, 63/37 SN/PB, 217°C, 1.67LB; Solder Alloy:63, 37 Sn, Pb; Melting Temperature:183°C; Density:-; Weight - Metric:757.499g; Weight - Imperial:1.67lb; Product Range:-; Weight:757.499g RoHS Compliant: No
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Supplier: Allied Electronics, Inc.
Description: Solder Wire, Sn63Pb37 Alloy, 0.031 in. Outer Diameter Conforms to Type RMA of Fed Spec QQ-SS-571 and is on the qualified products list. “285” has high mobility and fast spreading action.
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Supplier: Allied Electronics, Inc.
Description: Activated Rosin Cored Solder Wire, Sn63Pb37 Alloy, 1 lbs. Weight Solder Wire, Sn63Pb37, .031 inches, Flux-Cored Solder Wire, 1 Lb. Kester 44 rosin flux has virtually dominated the field of activated rosin core solders for well over four decades. An outstanding performance
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Supplier: Newark, An Avnet Company
Description: SOLDER WIRE, 63/37 SN/PB, 183°C, 1LB; Leaded / Lead Free:Leaded; Flux Type:Rosin Activated RA; Solder Alloy:63, 37 Sn, Pb; External Diameter - Metric:0.508mm; External Diameter - Imperial:0.02"; Melting Temperature:183°C RoHS
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Supplier: Accuris
Description: Tin - Lead Alloy Eutectic Solder 63Sn - 37Pb (UNS L13630)
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Supplier: SAE International
Description: Technical Standard
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Supplier: ODG (Origin Data Global)
Description: MADE IN USA SN63/PB37 ALLOY 1/2
- Features: Other
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Supplier: RS Components, Ltd.
Description: Solder Wire 63/37 Tin/Lead (Sn63/Pb37) N
- Diameter / Thickness: 0.03149608 inch
- Melting Range: 361.4 F
- Features: Other, Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester Ultrapure lead solder bar is another quality product from Kester. Total composition for this lead solder bar is sn63/pb37.
- Features: Other
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester Ultrapure lead solder bar is another quality product from Kester. Total composition for this lead solder bar is sn63/pb37.
- Features: Other
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester Ultrapure lead solder bar is another quality product from Kester. Total composition for this lead solder bar is sn63/pb37. Additional, and potentially important, information was collected about this product: Low Dross
- Features: Other
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Supplier: RS Components, Ltd.
Description: Sn63/Pb37 No Clean Solder Paste Syringe
- Process Capability: Soldering Equipment
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester lead solder wire is another quality product from Kester. Melting point is reached at a temperature of +361 F. It's manufactured as a solder without flux core. Total composition for this lead solder wire is sn63/pb37.
- Features: Other, Solid Wire
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Supplier: Henkel Corporation - Electronics
Description: (Known as MULTICORE CR37 solder paste ) LOCTITE CR 37 solder paste is suitable for most assembly processes. It is suited to meet the demands of high volume production which utilizes components and boards having less than desirable levels of solderability. It is proven to have
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Supplier: Win Source Electronics
Description: Manufacturer: Switchcraft Inc. Win Source Part Number: 770886-SN37A11 Series: SN37A Packaging: Bulk Features: Board Guide, Cover Connector Type: Phone Jack Termination: Solder Contact Material: Brass Gender: Female Shielding: Unshielded Housing Material: Thermoplastic Mounting: Through Hole,
- Number of Contacts: 2 #
- Connector Type: Audio / Video Connector
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Supplier: Amphenol Communications Solutions
Description: D-Subminiature, High Performance D-Sub Power Board Mount Connectors, Input Output Connectors, Cable Connector, machined contacts 37 Way Socket, Solder bucket, D-Subminiature - Cable Connector, machined contacts 37 Way Socket, Solder bucket
- Contact Size (AWG): 20 AWG
- Voltage Rating: 300 volts
- Number of Contacts: 37 #
- Connector Type: D-Sub, PC Card Connector
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Supplier: MacDermid Alpha Electronics Solutions
Description: High fluidity SnPb37 bar solder with low drossing characteristics. Product Overview ALPHA HiFlo Sn63Pb37 solder is manufactured using the highest purity metals and a proprietary process that includes viscosity and dross-lowering treatments. This results in the purest, lowest drossing,
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: Conn 1/4" Phone Jack F 2 POS 7.62mm Solder RA Thru-Hole 4 Terminal 1 Port Product overview: SN37A11 from Switchcraft is an Electronic Connector for board-to-board, wire-to-board, backplane, terminal, cable, and industrial interconnect applications. It is useful for engineers and buyers
- Voltage Rating: 500 volts
- Gender: Female / Jack
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Supplier: Indium Corporation
Description: Features: • Eliminates defects due to package-warping • Air-reflow • Rheology optimized for both dipping and package-retention • Designed for use with SAC305 and Sn63/Pb37 alloys • Excellent solderability • Long pot life • Suitable for use down to 0.3mm pitch Application Solder paste is
- Product Form: Paste
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE MP 218, Solder paste, High activity, Soft residue, Colorless, Sn/Pb soldering LOCTITE® MP 218 is a high activity, soft residue, colorless solder paste with pin-testable flux that displays resistance to high temperature and humidity environments. Suitable for a
- Features: Other
- Product Form: Paste
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Supplier: DigiKey
Description: 37 Position Circular Connector Plug, Female Sockets Solder
- Voltage Rating: 400 volts
- Current Rating: 1.5 to 7.5 amps
- Number of Contacts: 37 #
- Features: Board Mount Connector, Circular / Cylindrical Connector, Other
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Supplier: MacDermid Alpha Electronics Solutions
Description: stabilize and reduce copper content in the wave solder bath, depending on specific process conditions. All variants are produced using our proprietary Vaculoy alloying process, which effectively removes impurities, particularly oxides, minimizing soldering defects.
- Solder Alloy: Lead Free
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE HF 2W, Solder paste, Halogen-free, Water washable flux, Low voiding, REACH-compliant, Pb-based soldering LOCTITE® HF 2W is a low voiding, REACH-compliant solder paste with excellent resistance to solder balling, humidity and slump. Residues can be removed with
- Features: Other
- Product Form: Paste
Find Suppliers by Category Top
Conduct Research Top
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How to Choose a Solder
The first step in choosing a solder is to decide what metals are going to be bonded, because the type of metal used will greatly influence the type of solder used. Soft solders are often used with copper, tin and brass. These solders have a low melting point and are made of tin (Sn) and lead (Pb
More Information Top
Indicates content that may require registration and/or purchase.
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Failure analysis of solder bumped flip chip on low-cost substrates
Abstract—Failure analyses of 63/37 Sn/Pb solder bumped flip chip assemblies with underfill encapsulant are presented in this study.
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Preventing Thermal Cycling and Vibration Failures in Electronic Equipment
FIGURE 5.6 Typical log-log S-N fatigue life curve for 63/37 Sn/Pb solder showing the b exponent slope of 2.5 for a rapid thermal cycle and ab exponent slope of 4.0 for vibration.
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The formation and growth of intermetallics in composite solder
Commercial eutectic 63/37 Sn/Pb solder paste con- sisting of88% metal plus 12% water soluble RMA flux by weight from International Electronic Materials 13 was used throughout this work.
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Investigation of Solder Fatigue Acceleration Factors
Experiments were carried out on 5/95 and 63/37 Sn/Pb solder joints.
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Surface Treatments and Bondability of Copper Thick Film Circuits
A single-fired copper processed on a dielectric will solder bond without fluxing or abrasion assist using Sn/Pb 63/37 solders .
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Effect of underfill on BGA reliability
63/37 Sn/Pb solder .
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Modelling reliability of flip chip on board assemblies implementing a correction function approach comparing analytical and finite element techniques
dislocation climb, were published by Ju for 63/37 Sn/Pb solder alloys [Ju et al., 1994].
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Solder joint reliability of high I/O ceramic-ball-grid arrays and ceramic quad-flat-packs in computer environments: the PowerPC 603TM and PowerPC 604TM micropr...
A no-clean, rosin-based, 63/37 Sn/Pb solder paste was screened onto the PWB’s using a 0.20 mm (8 mil) chemically-etched stainless steel stencil.
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Intermetallic formation on the fracture of Sn/Pb solder and Pd/Ag conductor interfaces
The purpose of this research is to study the effect of in- termetallic formation on the fracture of a 63/37 Sn/Pb solder and Pd/Ag thick film conductor.
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ZCP2000ISTFA147
A Multicore Must-II wetting balance was used with 63/37 Sn/Pb solder at 245°C and immersion speed of 10mm/sec to a 5mm depth, with an immersion time of 10sec.