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Supplier: DigiKey
Description: SOLDER BAR SN63/PB37 20LBS (9.08
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Other
- Melting Range: 361 F
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Supplier: DigiKey
Description: SOLDER BAR SN63/PB37 1LB (454G)
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Other
- Melting Range: 361 F
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Supplier: DigiKey
Description: Leaded Bar Solder Sn63Pb37 (63/37) Bar, 1 lb (454g)
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Other
- Melting Range: 361 F
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Supplier: DigiKey
Description: Leaded Bar Solder Sn63Pb37 (63/37) Bar, 1 lb (454g)
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Other
- Melting Range: 361 F
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Supplier: Indium Corporation
Description: Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 183ºC Eutectic Solidus Melting Temperature: 183ºC
- Alloy: Tin-Lead (Sn-Pb)
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire, strip, paste,
- Alloy: Tin-Lead (Sn-Pb)
- Approvals / Conformance: ASTM / UNS
- Conductivity: 7.19E10 µS/cm
- Form / Shape: Paste, Powder, Preform, Wire
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Supplier: Indium Corporation
Description: Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 183ºC Eutectic Solidus Melting Temperature: 183ºC
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
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Supplier: Indium Corporation
Description: Indium Corporation bar solder is a high purity material manufactured to provide consistent and reliable performance manufactured per J-STD. Bars are rectangular in shape (1.66 lbs./ each). 15 bars per box. 25 lbs. per box Minimum order quantity is 25 lbs.
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Other
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Supplier: ODG (Origin Data Global)
Description: MADE IN USA SN63/PB37 ALLOY 1/2
- Equipment Type: Other
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Supplier: Accuris
Description: Solder, Tin - Lead, Eutectic 63Sn - 37Pb
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Supplier: SAE International
Description: Technical Standard
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester Ultrapure lead solder bar is another quality product from Kester. Total composition for this lead solder bar is sn63/pb37.
- Approvals / Conformance: Other
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Supplier: MacDermid Alpha Electronics Solutions
Description: High fluidity SnPb37 bar solder with low drossing characteristics. Product Overview ALPHA HiFlo Sn63Pb37 solder is manufactured using the highest purity metals and a proprietary process that includes viscosity and dross-lowering treatments.
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Supplier: RS Components, Ltd.
Description: Alloy with extremely low content of impurities and reduced oxidation for high quality soldering. Bar dimensions: 380 x 15 x 8 mm. Percent Lead = 37% Product Form = Granules Melting Point = +183°C Percent Tin = 63% Flux Type = Resin Product Weight = 500g
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Powder
- Melting Range: 361 F
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Supplier: Henkel Corporation - Electronics
Description: (Known as MULTICORE CR37 solder paste ) LOCTITE CR 37 solder paste is suitable for most assembly processes. It is suited to meet the demands of high volume production which utilizes components and boards having less than desirable levels of solderability. It is
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE MP 218, Solder paste, High activity, Soft residue, Colorless, Sn/Pb soldering LOCTITE® MP 218 is a high activity, soft residue, colorless solder paste with pin-testable flux that displays resistance to high temperature and humidity environments. Suitable for a
- Form / Shape: Paste, Other
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Supplier: Amphenol Communications Solutions
Description: D-Subminiature, High Performance D-Sub Power Board Mount Connectors, Input Output Connectors, Cable Connector, machined contacts 37 Way Socket, Solder bucket, D-Subminiature - Cable Connector, machined contacts 37 Way Socket, Solder bucket
- Number of Contacts: 37 #
- Voltage Rating: 300 volts
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Supplier: Win Source Electronics
Description: Manufacturer: Switchcraft Inc. Win Source Part Number: 770886-SN37A11 Series: SN37A Packaging: Bulk Features: Board Guide, Cover Connector Type: Phone Jack Termination: Solder Contact Material: Brass Gender: Female Shielding: Unshielded Housing Material
- Number of Contacts: 2 #
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Supplier: Acme Chip Technology Co., Limited
Description: LB 16MM ILLUMINATED PB DPDT G
- Actuator Specifications: Flush Pushbutton
- Maximum AC Voltage: 125 volts
- Maximum Current: 5 amps
- Maximum DC Voltage: 30 volts
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Supplier: Lapp Tannehill
Description: , Sn63 solder alloy, Sleeve size = 4, No preinstalled wire. 100 solder sleeves/pack MANUFACTURER : Sumitomo MANUFACTURER PART NUMBER : H-I-4 AVAILABILITY : Contact 800-633-6339 for Availability SERIES : H-I Series SIZE : 4 OPERATING TEMPERATURE : 150°C HEATING METHOD :
- Operating Temperature: 150 C
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Supplier: TE Connectivity
Description: Preloaded : No Number of Positions : 37 Number of Power Positions : 0 Number of Signal Positions : 37 Contact Features Circular Connector Contact Type : Solder Cup
- Contact Size (AWG): 22 AWG
- Current Rating: 5 amps
- Number of Contacts: 37 #
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Supplier: Win Source Electronics
Description: Manufacturer: JST Sales America Inc. Win Source Part Number: 805187-50PS-JMDSS-G- 1-TF(LF)(SN) Packaging: Reel Number of Positions: 50 Pitch: 0.020" (0.50mm) Mounting Style: Surface Mount, Right Angle Features: Solder Retention Connector Type: Plug, Outer Shroud
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Supplier: TE Connectivity
Description: Type : Pin Mating Pin Diameter : 1.02 MM [.04 INCH ] Dimensions Connector Length : 28.37 MM [1.117 INCH ] Connector Width : 82
- Automotive Connector: Yes
- Contact Pitch: 4.19 mm
- Current Rating: 7.5 amps
- Number of Contacts: 48 #
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Supplier: TE Connectivity
Description: of Positions : 37 Number of Power Positions : 37 Contact Features Circular Connector Contact Type : Solder Cup Socket Contact Current Rating (Max) (AMP) : 5 Contact Layout
- Contact Size (AWG): 20 AWG
- Current Rating: 5 amps
- Number of Contacts: 37 #
- Voltage Rating: 400 volts
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Supplier: Win Source Electronics
Description: Manufacturer: JST Sales America Inc. Storage Condition: Dry storage cabinet & Humidity protection package Win Source Part Number: 1047861-B6B-ZR-SM4-T FT(LF)(SN) Number of Positions: 6 Pitch: 1.5 mm Color: Natural Number of Rows: 1 Termination: Solder
- Contact Pitch: 1.5 mm
- Current Rating: 1 amps
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Supplier: Win Source Electronics
Description: Manufacturer: JST Sales America Inc. Storage Condition: Dry storage cabinet & Humidity protection package Win Source Part Number: 1034993-17FMN-SMT-A- TF(LF)(SN) Pitch: 1 mm Number of Rows: 1 Termination: Solder Contact Material: Bronze Length: 19 mm
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Supplier: MacDermid Alpha Electronics Solutions
Description: ORH1 per J-STD-004, this cored solder wire can be used with an open torch or a soldering iron. It will solder copper as well as more difficult materials such as brass and nickel. This wire is suitable for applications involving pipes or tubing, such as refrigeration coils and
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Radwell International
Description: SOLDER WIRE, P1.02IN 1LB SPOOL, NO-CLEAN TELECORE, SN63PB37. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Ironwood Electronics, Inc.
Description: These BGA surface mount feet present a female interface. We utilize blind pin technology to isolate our low temperature solder balls (63/37 PbSn) from the pins.
- Product Type: Package Adapters / Converters
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Supplier: Indium Corporation
Description: (with different activity levels) are available in no-clean, water-washable, and VOC-Free varieties. The solder is melted in a solder pot and pumped to produce a "wave." The board is conveyed over the flux, preheat, and solder wave stations to complete the joints. Although
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Aries Electronics, Inc.
Description: [5.08µ] min. matte Sn per ASTM B545-97 on solder tail, both over 30µ [0.76µ] min. Ni per QQ-N-290 all over. Consult factory for other plating options not shown SPINODAL PLATING CONTACTS ONLY: 50µ [1.27µ] min. NiB HANDLE: Stainless Steel
- Contact / Pin Type: Solder Tail Pins
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 2.54 mm
- Current Rating: 1 amps
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Supplier: Aries Electronics, Inc.
Description: ), NSMD SOLDER SPHERES: 63/37 Sn/Pb or Lead-free SAC 305 TRACE WIDTH/SPACE: 0.003 [0.0762] OPERATING TEMPERATURE: 221°F [105°C] FR-4, 266°F [130°C] Lead-free MOUNTING CONSIDERATIONS SUGGESTED PCB PAD SIZE: 0.022 [0.559] for 1.27mm pitch; 0.020 [0.51] for 1.00mm pitch
- Output (Bottom) Side Package: BGA
- Product Type: Package Adapters / Converters
- Top (Input) Side Package: BGA
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Supplier: RS Components, Ltd.
Description: High power ratings. Low profile. Compatible with Pb and Pb-free solder reflow profiles. RoHS compliant and halogen free. Surface mount packaging for automated assembly Trip Current = 3.7A Voltage Rating = 33V Time to Trip = 2.5s Hold Current = 1.85A Maximum Current = 40 A
- Current Rating: 40 amps
- Features: Resettable
- Fuse Type: PC Board
- Rated Breaking Capacity: 3.7 amps
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Supplier: RS Components, Ltd.
Description: Metal glaze on high quality ceramic. Protective over glaze. Excellent stability (Î?R/R â?¤ 1 % for 1000h at 70 °C). Lead (Pb)-free solder contacts on Ni barrier layer. Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering
- Power Rating: 1 watts
- Resistance Range: 100 ohms
- Technology / Construction: Thick Film
- Temperature Coefficient (TCR): 100 ±ppm/°C
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Supplier: RS Components, Ltd.
Description: Metal glaze on high quality ceramic. Protective over glaze. Excellent stability (Î?R/R â?¤ 1 % for 1000h at 70 °C). Lead (Pb)-free solder contacts on Ni barrier layer. Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering
- Mounting / Packaging: Surface Mount (SMT / SMD), 2512, Other
- Power Rating: 1 watts
- Resistance Range: 10000 ohms
- Technology / Construction: Thick Film
Find Suppliers by Category Top
Conduct Research Top
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How to Choose a Solder
The first step in choosing a solder is to decide what metals are going to be bonded, because the type of metal used will greatly influence the type of solder used. Soft solders are often used with copper, tin and brass. These solders have a low melting point and are made of tin (Sn) and lead (Pb
More Information Top
Indicates content that may require registration and/or purchase.
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Failure analysis of solder bumped flip chip on low-cost substrates
Abstract—Failure analyses of 63/37 Sn/Pb solder bumped flip chip assemblies with underfill encapsulant are presented in this study.
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Preventing Thermal Cycling and Vibration Failures in Electronic Equipment
FIGURE 5.6 Typical log-log S-N fatigue life curve for 63/37 Sn/Pb solder showing the b exponent slope of 2.5 for a rapid thermal cycle and ab exponent slope of 4.0 for vibration.
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The formation and growth of intermetallics in composite solder
Commercial eutectic 63/37 Sn/Pb solder paste con- sisting of88% metal plus 12% water soluble RMA flux by weight from International Electronic Materials 13 was used throughout this work.
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Investigation of Solder Fatigue Acceleration Factors
Experiments were carried out on 5/95 and 63/37 Sn/Pb solder joints.
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Surface Treatments and Bondability of Copper Thick Film Circuits
A single-fired copper processed on a dielectric will solder bond without fluxing or abrasion assist using Sn/Pb 63/37 solders .
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Effect of underfill on BGA reliability
63/37 Sn/Pb solder .
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Modelling reliability of flip chip on board assemblies implementing a correction function approach comparing analytical and finite element techniques
dislocation climb, were published by Ju for 63/37 Sn/Pb solder alloys [Ju et al., 1994].
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Solder joint reliability of high I/O ceramic-ball-grid arrays and ceramic quad-flat-packs in computer environments: the PowerPC 603TM and PowerPC 604TM micropr...
A no-clean, rosin-based, 63/37 Sn/Pb solder paste was screened onto the PWB’s using a 0.20 mm (8 mil) chemically-etched stainless steel stencil.
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Intermetallic formation on the fracture of Sn/Pb solder and Pd/Ag conductor interfaces
The purpose of this research is to study the effect of in- termetallic formation on the fracture of a 63/37 Sn/Pb solder and Pd/Ag thick film conductor.
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ZCP2000ISTFA147
A Multicore Must-II wetting balance was used with 63/37 Sn/Pb solder at 245°C and immersion speed of 10mm/sec to a 5mm depth, with an immersion time of 10sec.