Products & Services
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Supplier: Advanced Interconnections Corp.
Description: BGA Socketing Systems from Advanced offer an economical and dependable alternative to direct device attach. Our patented SMT designs are field-proven in production, development, programming and test applications. Compact designs and patented features offer you cost effective
- Contact / Pin Type: Low Profile Pins, Solder Tail Pins, Other
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 0.8000 to 1.27 mm
- Features: Machined Pins, Open Top Socket
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Supplier: Advanced Interconnections Corp.
Description: Our Flip-Top™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top™ BGA
- Contact / Pin Type: Low Profile Pins, Solder Tail Pins, Spring Loaded, Other
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 1 to 1.27 mm
- Features: Machined Pins, Open Top Socket, Clamshell Socket
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Supplier: Aries Electronics, Inc.
Description: FEATURES Solderless Spring-Probes pressure mount to the test board and device solder ball or pad Only 0.077 [1.96] signal path Very low inductance and capacitance Small footprint allows max. use of test board area Chip guides allow accurate device
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating, Nickel Plating
- Contact Resistance: 40 milliohms
- Contacts Pitch: 0.2000 to 0.8000 mm
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Supplier: JC Cherry, Inc.
Description: Test & Burn-In Socket GU29 Frame / BGA pkg Size 29x30.6mm / 1.14"x1.20" Can also be used as Burn in Socket ?High reliability ?Cost competitive ?Temperature: -40 to +150? For BGA Device How to order for Custom design GQ29-BGAxxxxxxx *P/N will be informed after
- Package Type: Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: JC Cherry, Inc.
Description: Test & Burn-In Socket GU78 Frame / BGA pkg Size 78x116.7mm / 3.07"x4.59" Can also be used as Burn in Socket ?High reliability ?Cost competitive ?Temperature: -40 to +150? For BGA Device How to order for Custom design GU78-BGAxxxxxxx *P/N will be informed after
- Package Type: Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Advanced Interconnections Corp.
Description: The new Mod5 Series Flip-Top™ BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs.
- Contact / Pin Type: Straight Pins
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 0.5000 mm
- Current Rating: 2.8 amps
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Supplier: Aries Electronics, Inc.
Description: KEY PERFORMANCE ELEMENTS – Series AR4HT High-Temperature 200°C (high-frequency bandwidth, low inductance, high-current, reliable, durable) Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). Excellent choice
- Contacts Pitch: 10.16 mm
- Current Rating: 4 amps
- Features: Clamshell Socket
- Operating Temperature: -55 to 200 C
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Supplier: JC Cherry, Inc.
Description: High Current High Speed Interface Manual/Handler/Burn in ●Test socket for CCD and CMOS sensor. ?Customizable for various package such as BGA, LGA, PGA. ?Using our high reliable spring probes, stamping pins and socket pins. ?We manufacture test sockets
- Contact Resistance: 200 milliohms
- Contacts Pitch: 0.2500 mm
- Current Rating: 0.5000 amps
- Operating Temperature: -40 to 150 C
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Supplier: Advanced Interconnections Corp.
Description: Using our exclusive, field-proven eutectic solder ball terminal design, the SMT Adapter from Advanced provides a reliable solution for mounting or socketing LGA or re-worked BGA devices. Use in connection with our BGA Sockets for LGA to BGA conversion or board to
- Contact / Pin Type: Low Profile Pins, Solder Tail Pins, Other
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 0.8000 to 1.27 mm
- Features: Machined Pins
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Supplier: Ironwood Electronics, Inc.
Description: Ironwood's GHz BGA sockets are ideal sockets for prototyping, test applications, and field-upgradeable designs. These patent pending sockets are the smallest, fastest, and densest BGA sockets available. Direct mount versions of the sockets
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 1 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: Ironwood Electronics, Inc.
Description: Ironwood's GHz BGA sockets are ideal sockets for prototyping, test applications, and field-upgradeable designs. These patent pending sockets are the smallest, fastest, and densest BGA sockets available. Direct mount versions of the sockets
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 1 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: Ironwood Electronics, Inc.
Description: The Ironwood Electronics line of sockets for BGA, QFN, LGA, and other SMT packages provide a selection for both laboratory test and high volume test. We presently offer 4 major contactor types to handle laboratory testing, high volume test, and temperature
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 0.8000 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: Ironwood Electronics, Inc.
Description: GHz BGA sockets provide 6.5 to 10 GHz bandwidth in a small, cost effective ZIF socket for prototype and test applications. The GHz BGA socket is a simple mechanical socket based on elastomer connector technology. The GHz socket is a solder-less
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 1 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: Aries Electronics, Inc.
Description: testing and burn-in). Excellent choice for low-cost hand test applications MECHANICAL CONTACT LENGTH (compressed): 0.45mm PITCH: Released to <0.4mm – Mixed Pitch Available PACKAGES: BGA, LGA, QFN, DFN, CSP, POP – Full and Partial Arrays
- Contacts Pitch: 2.54 mm
- Features: Clamshell Socket
- Operating Temperature: -67 to 392 C
- Package Type: BGA, CSP, LGA, QFN, Test / Prototyping Socket, Other
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Supplier: Aries Electronics, Inc.
Description: CSP/µBGA Test & Burn-In Socket for Devices up to 13mm Square Chinese FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for QFP applications Any
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating, Nickel Plating
- Contacts Pitch: 5.08 to 20.32 mm
- Features: Solderless, Clamshell Socket
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Supplier: Accuris
Description: Production Ball Grid Array (BGA) Socket Test Specification
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Supplier: JC Cherry, Inc.
Description: Test & Burn-In Socket GU22 Frame Series Size 22x22mm / 0.87"x0.87" Can also be used as Burn in Socket ?Highly reliable M-pin Probes as contact parts ?High Frequency For BGA Device, QFN Device 0.4mm/0.016" Pitch : 16x16 Contact Max 0.5mm/0.020" Pitch : 10x10 Contact Max
- Contact Resistance: 100 milliohms
- Contacts Pitch: 0.4000 to 0.5000 mm
- Current Rating: 1 amps
- Operating Temperature: -40 to 150 C
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Description: IEC 60191-6-16:2007 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.
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Supplier: Molex Signal Tech Industrial Ltd.
Description: to +125 °C Consistent stable contact resistance 120 m? (Ave) Designed for manual test, bench test, and HVM Production Test using the same socket Solution for BGA, LGA, QFN, DFN, and other variants, ideal for minimum pitch 0.35 mm Floating base or Hi Low
- Package Type: BGA, LGA, QFN, Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Molex Signal Tech Industrial Ltd.
Description: Highly precised top and bottom array simultaneous test capable socket for effective package on package test. Customized socket design is capable to test high speed signals in lab, engineering, SLT and ATE applications. Controlled impedance loop-back with PCB for
- Package Type: BGA, LGA, Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: CSA Group
Description: IEC 60191-6-16:2007 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.
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Supplier: Accuris
Description: Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
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Supplier: Accuris
Description: Mechanical standardization of semiconductor devices \x96 Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
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Supplier: Molex Signal Tech Industrial Ltd.
Description: slight impedance mismatches or signal degradation can trigger false failures, compromise yields, and delay critical product launches. Features & Benefits Engineered to overcome these challenges, the DaVinci Gen V coaxial test socket provides an out-of-box solution for full
- Contact Plating: Gold Plating
- Contact Resistance: 80 milliohms
- Contacts Pitch: 0.6500 to 0.8000 mm
- Current Rating: 3 to 3.7 amps
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Supplier: Twilight Technology Inc.
Description: and memory module solutions. Our customers benefit from our broad experience and expertise in design, IC packaging, component reliability, and quality testing. With 25 years of design experience, our engineering staff solves problems with footprint conversions, RoHS, BGA and flip chip
- Product Type: IC Socket, IC Headers
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Description: IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and
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Supplier: CSA Group
Description: IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and
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Supplier: AENOR
Description: Mechanical standardization of semiconductor devices -- Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
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Supplier: AENOR
Description: Mechanical standardization of semiconductor devices -- Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007). (Endorsed by AENOR in October of 2007.)
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Supplier: RS Components, Ltd.
Description: VeryPro-996 is a universal programmer which support over 105000 different components. The ZIF socket accepts all SDIP device packages up to 48-pins without an adaptor. Universals adapters are available to program component packages over 48-pins, including QFP100 or BGA208. It supports
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Supplier: RS Components, Ltd.
Description: , NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller. Packages supported: DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP, and more. Tests and Detects incorrect insertion of the device and defective pin.
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Supplier: RS Components, Ltd.
Description: , Microcontroller. Packages supported: DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP, and more. Tests and Detects incorrect insertion of the device and defective pin. protected against short circuits and
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The Levan Elastomeric socket family is engineered specifically with precision. The elastomeric grid of Levan features conductive columns that guarantee accurate and consistent test results across a spectrum of devices. The conductive columns in the elastomeric grid ensure accurate and (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
, Kepler is the only solution that provides two-axis of motion during a single actuation of the socket, an innovation set to pioneer the semiconductor test industry. As a result, Kepler provides a boosted first pass yield (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
At Smiths Interconnect, we are constantly striving to exceed the evolving demands of the semiconductor industry. The Davinci 112 test socket, and expansion of the DaVinci Series, is designed to tackle some of the most complex challenges in testing Application Specific Integrated Circuits (ASICs (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
Smiths Interconnect, a division of Smiths Group plc, announces that it has completed the acquisition of Plastronics Sockets & Connectors (“Plastronics”), a leading supplier of burn-in test sockets and patented spring probe contacts for the semiconductor test market segment (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
OEM to handle these tasks, companies focus their resources on other business areas requiring more attention. Using advanced equipment and OEM tools like socket sets speeds up the production process, ensuring that components get delivered on time. This (read more)
Browse Drive Sockets and Adapters Datasheets for Lowell Corporation
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BGA Socket Considerations - Prototype to Reality
For many products designed with todays high-performance integrated circuits, BGA socketing systems are an essential option during the design, testing, and/or production phases of a new product development process. In response to these demanding needs, sockets featuring a wide variety of contacting
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BGA Sockets To Solve All Your Electronics Testing Needs
Plastronics, a Smiths Interconnect technology brand, is a global provider of innovation for semiconductor reliability testing, meeting the industry 's burn-in socket needs for more than 40 years. It all started when our company invented the first open-top, application-specific socket for production
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Socket-Adapter Systems: A Practical Test Alternative (.pdf)
Traditional one-piece, clam¬shell-design test sockets are useful diagnostic tools for establishing or evaluating device functionality. However, they tend to be less satisfactory for validating fine-pitch packages such as ball grid ar¬ray (BGA) and land grid array (LGA), which are gaining popularity
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Spring Pin Socket User Manual
SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be mounted on to a PCB using supplied hardware
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BGA Socket Adapter System Provides Reliable Test Equipment Connection for Engine Performance Analysis (.pdf)
A major electronics test equipment manufacturer developed a new engine control unit test board to calibrate embedded semiconductor automotive engine control devices. These automotive engine control devices are critical to the power train performance of the vehicle and must be accurately calibrated
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
on marketing. IC-packaging and test subcontractors appear to be in the best financial shape in recent memory and are chanting the famous line in the movie classic Network: "I'm mad as hell, and I'm not going to take it anymore! " Hot products: 10-GHz BGA socket, automotive MCU Among the hottest
More Information Top
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Design and fabrication of a mems test socket with an attached tip for a ball-grid-array integrated circuit package
Electri- cal characterization of BGA test socket for high-speed appli- cations, Proc. IEEE Int.
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BGA Test Socket
BGA Test Sockets .
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Design and fabrication of MEMS test socket for BGA IC packages
Abstract—We developed a novel ball grid array ( BGA ) test socket for an integrated circuit (IC) package test.
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Reliability and wear-out characterization of BGA production sockets
A ball grid array ( BGA ) test socket plays a key role as a contact interface in final testing of BGA-type package.
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uBGA
BGA Test Sockets .
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System Level Test / BGA Test Sockets
Cascade Microtech has developed BGA test sockets to specifically address the demanding high-performance signal integrity requirements for high-frequency component and system-level testing.
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Cascade Microtech, Inc.
Cascade Microtech has developed BGA test sockets to specifically address the demanding high-performance signal integrity requirements for high-frequency component and system-level testing.
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New ball grid array module test sockets
… fine-pitch leaded packages, such as the Quad Flat Pack (QFP) To be able to test these modules, which encompass a wide range of lead counts, pitches, sizes and footprints, we have designed and fabricated BGA test sockets , which have the capability …
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Development of a wafer-level burn-in test socket for fine-pitch BGA interconnect
Technit offers a Micro- BGA test socket , specifically for Tessera’s package.
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CSP Test Sockets
• BGA Test Sockets (4 .