Die Attach Adhesive

Description: of precious metal flakes and powders to the global semiconductor die attach industry.

• Type: Electrically Conductive
• Industry: Electronics (PCB / SMT Assembly)

Description: LOCTITE ABLESTIK 2030SCM, Proprietary Hybrid Chemistry, Die attach LOCTITE® ABLESTIK 2030SCM die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage

• Viscosity: 14,000 cP
• Thermal Conductivity: 2.29 W/m-K

Description: LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It’s

• Viscosity: 150,000 cP
• Use Temperature: -58 to 356 F
• Thermal Conductivity: 2 W/m-K
• Form / Shape: Die Bonding Adhesive / Compound, Grease / Paste

Description: EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional

• Viscosity: 400,000 cP
• Use Temperature: -80 to 400 F
• Thermal Conductivity: 5.7 to 6.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 13,333,333.333333332 to 15,555,555.555555556 µin/in-F

Description: (Known as ABLESTIK ABP 8611 Die attach adhesive ) LOCTITE ABLESTIK ABP 8611 adhesive is designed for die attach applications as well as component attach. Its high dielectric property helps eliminate current leakage and short circuit occurence in the

• Industry: Electronics

Description: Dow DOWSIL™ ME-1070 Silicone Die Attach Adhesive Black is a one component, heat curing, microelectronics adhesive that provides high temperature stability, stress relief, seals packaging, and bonds with a variety of substrates. It offers unprimed adhesion, high strength,

• Viscosity: 18,000 cP
• Features: Electrically Insulating / Dielectric
• Chemical System: Silicone
• Cure / Technology: Single Component System

Description: Henkel Loctite Ablestik 789-3 Epoxy Die Attach Adhesive Amber is a one component adhesive used for microelectronic applications. It offers good moisture resistance, high bond strength, and is non-conductive. 3 cc Syringe.

• Viscosity: 36,500 cP
• Thermal Conductivity: 0.3 W/m-K
• Features: Electrical Insulating / Dielectric
• Chemical System: Epoxy (EP)

Description: LOCTITE® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications Electrically conductive Thermally conductive Good dispensing characteristics Hydrophobic

• Coeff. of Thermal Expansion (CTE): 34.44444444444444 µin/in-F
• Tensile Strength (Break): 107,037.187445611 psi
• Features: Electrically Conductive Compound (Adhesive, Grease), Electronics
• Industry: OEM / Industrial

Description: Henkel Loctite Ablestik 84-1 LMINB1 Epoxy Die Attach Adhesive Silver is used to bond difficult-to-wet surfaces. It offers a long work life, electric conductivity, and reduces capacitor shorting problems caused by resin bleed. 2.5 cc/5 cc Syringe.

• Viscosity: 50,000 cP
• Thermal Conductivity: 3.9 W/m-K
• Features: Electrical Insulating / Dielectric
• Chemical System: Epoxy (EP)

Description: Product Overview ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity, designed for high power semiconductor packages. Its low resin bleed out and low condensable organics ensure excellent package reliability.

• Form / Shape: Die Bonding Adhesive / Compound, Grease / Paste
• Type: Electrically Conductive
• Features: Electronics, Thermal Compound / Interface (Thermally Conductive)
• Industry: Semiconductors / IC Packaging

Description: LOCTITE® ABLESTIK 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed. Electrically conductive Long work life Bonds

• Coeff. of Thermal Expansion (CTE): 27.77777777777778 µin/in-F
• Water Absorption: 1.1 %
• Features: Die Bonding Adhesive / Compound
• Industry: Electronics, OEM / Industrial

Description: LOCTITE® ABLESTIK 84-1LMIT1 adhesive is designed for medium die attach applications. It is designed for screen printing using 325 mesh. Electrically conductive High thermal conductivity Solvent-free formulation Low viscosity

• Viscosity: 22,000 cP
• Features: Die Bonding Adhesive / Compound, Specialty / Other
• Industry: Electronics, OEM / Industrial
• Chemical System: Epoxy (EP)

Description: Product Overview ATROX® CD 560-1 offers excellent substrate compatibility and low Resin Bleed-Out (RBO), ensuring reliable bonding to Pre-Plated Frame (PPF) and copper lead frames. It provides a long pot life of over 24 hours at room temperature and maintains a 12-month shelf life when stored at

• Form / Shape: Die Bonding Adhesive / Compound, Grease / Paste
• Features: Electrically Conductive Compound (Adhesive, Grease), Electronics, Film / Sheet
• Industry: Semiconductors / IC Packaging
• Cure / Technology: Thermosetting / Crosslinking

Description: LOCTITE ABLESTIK SSP 2020 is a sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated from power devices. It maintains high adhesion at operating temperatures as

• Type: Electrically Conductive
• Industry: Electronics (PCB / SMT Assembly)

Description: Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures.

• Use Temperature: -80 to 550 F
• Thermal Conductivity: 2.2 to 2.9 W/m-K
• Coeff. of Thermal Expansion (CTE): 12,777,777.777777778 to 14,444,444.444444444 µin/in-F
• Tensile Strength (Break): 7,000 to 8,000 psi

Description: Master Bond EP17HTDA-2 is a one component, heat cured epoxy system for bonding, sealing, and die attach. It is recommended when its exceptionally high Tg of 185-190°C is a critical factor in die attach applications.

• Viscosity: 1,000,000 cP
• Use Temperature: -80 to 600 F
• Thermal Conductivity: 1.3 to 1.44 W/m-K
• Coeff. of Thermal Expansion (CTE): 11.11111111111111 to 13.88888888888889 µin/in-F

Description: LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control Provides RF/EMI shielding Electrically conductive in x, y, z axes Excellent electrical and

• Thermal Conductivity: 6.5 W/m-K
• Chemical System: Epoxy (EP)
• Industry: OEM / Industrial
• Cure / Technology: Thermosetting / Crosslinking

Description: Single component Supreme 3HTND-2DA offers convenient processing and dispensing with no tailing or bleed out and only requires simple refrigeration for storage. It cures rapidly in 5-10 minutes at 150°C. This toughened system has high die shear strength, superior electrical insulation

• Viscosity: 300,000 cP
• Use Temperature: -100 to 400 F
• Thermal Conductivity: 1.3 to 1.44 W/m-K
• Coeff. of Thermal Expansion (CTE): 13.889999999999999 to 16.669999999999998 µin/in-F

Description: (Known as Ablestik CDF 815P6B ) LOCTITE ABLESTIK CDF 800 Series are high filled, conductive die attach adhesive film designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It exhibits strong

• Type: Electrically Conductive
• Industry: Electronics (PCB / SMT Assembly)

Description: LOCTITE DSP 3806, Acrylic, Silver-filled, Conductive, Die attach LOCTITE® DSP 3806 silver filled, conductive die attach adhesive is specifically designed for use in crystal oscillator manufacturing applications. Low modulus Low weight loss

• Viscosity: 10,000 cP
• Cure / Technology: Single Component System

Description: LOCTITE ABLESTIK 2053S, Epoxy, Die Attach LOCTITE® ABLESTIK 2053S die attach adhesive is designed for use in array packaging. Low stress Non-conductive

• Viscosity: 13,000 cP
• Coeff. of Thermal Expansion (CTE): 82.77777777777777 µin/in-F
• Features: Electrically Insulating / Dielectric
• Cure / Technology: Single Component System

Description: PVIC ACE34033 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb rheology

• Viscosity: 8,500 cP
• Thermal Conductivity: 9.23 W/m-K
• Form / Shape: Die Bonding Adhesive / Compound
• Features: Electrical Power / HV, Electronics, Liquid, Metal, Thermal / Heat Conductive

Description: LOCTITE ABLESTIK 958-7, Epoxy, Die attach LOCTITE® ABLESTIK 958-7 electrically conductive epoxy adhesive is designed for hybrid die attach. This adhesive provides better adhesion to gold than other versions of ABLEBOND 958 adhesive series.

• Viscosity: 90,000 cP
• Chemical System: Epoxy (EP)
• Cure / Technology: Single Component System

Description: Filled one-part system with 30 days of storage at room temperature. Electronics grade, offers excellent bond strength while dissipating heat up to 1Wm°K. Often used as a die & lid attach material.Requires low heat assist for cure. Ideal for applications requiring low-heat curing.

• Use Temperature: -55 to 155 F
• Thermal Conductivity: 1 W/m-K
• Tensile Strength (Break): 3,000 psi
• Dielectric Strength: 381.0000000000008 kV/in

Description: ISO 16525-1:2014 specifies general test methods for isotropic electrically conductive adhesives used in wiring, die attach of semiconductors, and surface assembly of printed circuit boards.

Description: Transfer Tape Clear Acrylic Adhesive Transfer Tape 3M™ Adhesive Transfer Tape 9462P is a 2.0 mil 100 high temperature acrylic adhesive on a 3.2 mil 55 lb densified kraft paper liner. The 3MTM Adhesive Transfer Tapes with 3MTM High Temperature Acrylic Adhesive 100

• Width: 48 inches
• Adhesive: Pressure Sensitive (PSA), Transfer

Description: Acrylic foam tapes are high-performance bonding tapes are effective at reducing buzz, squeak, and rattle because they absorb vibrations at the tape’s core instead of at the bond line. In addition, these tapes are also often used to: Replace mechanical fasteners Attach decals emblems Join

• Backing: Acrylic / Acrylate, Foam, Plastic / Polymer

Description: ISO 16525-2:2014 specifies test methods for isotropic electrically conductive adhesives used in wiring, die attach, and surface assembly of printed circuit boards of electronic devices. The test methods focus on volume and interfacial contact resistivity.

Description: (Known as Ablestik ABLEBOND 8900NC ) LOCTITE ABLESTIK 8900NC is a die attach adhesive has been formulated for use in high throughput die attach applications. Actual performance will depend on die size, aspect ratio and package design.

• Thermal Conductivity: 0.3 W/m-K
• Industry: Electronics

Description: IEC/TR 62258-3:2010 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - and minimally or partially encapsulated die and wafers.

Description: IEC/TR 62258-3:2010 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - and minimally or partially encapsulated die and wafers.

Description: Non-filled Dielectric Interposer Film Product Overview STAYSTIK 482 thermoplastic adhesive film is designed for use in a variety of electronic applications, and is characterized by excellent bonding properties. STAYSTIK 482 can be used for die attach and/or substrate

Description: Aluminum Nitride-filled Thermally Enhanced Film Product Overview STAYSTIK 682 thermoplastic adhesive film is designed for use in a variety of electronic applications, and is characterized by excellent bonding. This film can be used for die attach and/or substrate attach

• Industry: Electronics, Semiconductors / ICs
• Form / Shape: Film / Sheet
• Features: Thermoplastic

Description: Rugged #ADC-12 Alloy Die Cast Aluminum Box with NEMA 1, 2, 4, 4x, 12, 13 and IP65 Ratings Available in Natural Finish (Other Finishes Available Upon Request) Self-Adhesive Gasket Easily Attaches to Cover Cover Attaches with 4 or 6 Screws for a Secure and Tight Seal Many Sizes have