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Description: It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Industry: Electronics
- Use Temperature: -40 to 302 F
- Viscosity: 9000 to 12000 cP
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Supplier: Norplex-Micarta
Description: NP512 combines a woven glass fabric and an epoxy resin system. The product provides high flexural, impact, and tensile strength at room temperatures along with a very high flexural modulus. NP512 is suitable for applications requiring enhanced flexural modulus and physical strength
- Dielectric Strength: 750 to 800 kV/in
- Form / Shape: Film / Sheet
- Industry: Electronics, General Industrial
- Material Type / Grade: Flame Retardant (e.g. UL 94 Rated), UL Approved
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Supplier: Epoxies Etc...
Description: 20-3061 is a 100% reactive epoxy resin system which does not contain any solvents or additives which downgrade physical, thermal, and electrical insulation properties. This is a filled low viscosity system which provides good flow and wet out characteristics. 20-3061 is designed
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 21.11 µin/in-F
- Composition: Two Component System, Filled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: Norplex-Micarta
Description: NP500CR is composed of a woven glass fabric combined with a halogen-free epoxy resin system. The product also offers superior physical properties and excellent electrical characteristics that are maintained in high-humidity conditions. In addition, it is not flame retardant.
- Coeff. of Thermal Expansion (CTE): 5.56 to 7.22 µin/in-F
- Dielectric Strength: 660 to 670 kV/in
- Form / Shape: Film / Sheet
- Industry: Electronics, General Industrial
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Supplier: Norplex-Micarta
Description: NP500A (NEMA G-10) is a glass fabric combined with a halogen-free epoxy resin system. The product offers a combination of excellent electrical characteristics and superior physical properties. In addition, it is not flame retardant and meets NEMA G-10 requirements. NP500A is
- Coeff. of Thermal Expansion (CTE): 5.33 to 6.72 µin/in-F
- Dielectric Strength: 690 kV/in
- Form / Shape: Film / Sheet
- Industry: Electronics, General Industrial
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Description: It is a two-component epoxy resin structural adhesive. At room temperature (25°C), the operating time is 20 minutes, the curing position is 90 minutes, and the curing is complete in 24 hours. After being fully cured, it has the characteristics of high shear, high peeling, and
- Cure Type / Technology: Two Component System, Room Temperature Curing
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Supplier: Norplex-Micarta
Description: NP511EM (NEMA G-11) is very much like NP511 with the exception that it is easier to machine. It has the same thermal and electrical characteristics, meets all of the physical and electrical properties of NEMA G-11 and has higher arc resistance than NP511. NP511EM can be used in most
- Dielectric Strength: 350 to 400 kV/in
- Form / Shape: Film / Sheet
- Industry: Electronics, General Industrial
- Material Type / Grade: Flame Retardant (e.g. UL 94 Rated), UL Approved
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP19HTLV is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnates and liners. It feature remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.9
- Elongation: 3.5 %
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting
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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 17.22 to 53.89 µin/in-F
- Compound Type: Casting Resin
- Features: Electrically Conductive
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Supplier: Techsil Limited
Description: MG Chemicals 832HT is a high temperature epoxy designed for encapsulating and potting electronics in high temperature environments. It is also an ideal encapsulant for very chemically aggressive environments and applications where extreme physical strength is required. It protects against
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Electronics
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Supplier: Techsil Limited
Description: MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior shock insulation and
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Electronics
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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 29.44 to 44.44 µin/in-F
- Compound Type: Casting Resin
- Features: Electrically Conductive, Thermally Conductive
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Supplier: ThreeBond International, Inc.
Description: conductive filler. They are used to connect various electrical contacts and for conduction. Silver, nickel, carbon, etc. are used as the electro-conductive fillers, and epoxy resin, urethane resin, silicone resin, and synthetic rubber are used as binders. With different
- Features: Electrically Conductive
- Industry: Automotive, Electronics
- Substrate / Material Compatibility: Rubber / Elastomer
- Viscosity: 25000 cP
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Description: It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System
- Cure Type / Technology: Reactive / Moisture Cured
- Industry: Electronics
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Supplier: PPG Protective & Marine Coatings
Description: -building, maintenance and maintenance. The products are designed with a high level of tolerance in order to accommodate ships with a variety of operational characteristics; low to high activity and deep-sea to coastal. The SIGMA ALPHAGEN 230 and SIGMA ALPHAGEN 240 products
- Chemistry: Epoxy, Resin Base / Polymer Binder
- Features: Protective
- Industry: OEM / Industrial, Marine
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Supplier: Techsil Limited
Description: harsh chemicals. Product Benefits Optically Clear (allows visual inspection) UV Stable (non-yellowing) Convenient 2:1 mix ratio Excellent electrical insulation characteristics Good adhesion for a wide variety of substrates Broad
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Electronics
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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 28.89 to 49.44 µin/in-F
- Compound Type: Casting Resin
- Features: Electrically Conductive, EMI / RFI Shielding, Thermally Conductive
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Supplier: Ellsworth Adhesives
Description: Miller-Stephenson EPON™ 815C Yellow is a low-viscosity, liquid epoxy resin blend diluted with HELOXY 61 – Butyl Glycidyl Ether, which provides superb wetting characteristics. 1 qt Bottle.
- Cure Type / Technology: Single Component System
- Substrate / Material Compatibility: Composites
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Supplier: Techsil Limited
Description: MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Electronics
- Use: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: Parker LORD® 304-1 General Purpose Epoxy Adhesive Resin Part A Gray is a two component, high viscosity adhesive used for gap filling or non-sag characteristics on a vertical surface. It offers durability, resists moisture and weathering, and contains no solvent. 1 gal Can.
- Cure Type / Technology: Two Component System
- Elongation: 10 %
- Tensile Strength (Break): 4360 psi
- Viscosity: 40000 to 400000 cP
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Supplier: Ellsworth Adhesives
Description: Parker LORD® 306-1 General Purpose Epoxy Adhesive Resin Part A Gray is a two component, high viscosity adhesive. It is used for gap filling or non-sag characteristics on a vertical surface. It offers durability, resists moisture and weathering, and contains no solvent. 1 gal
- Cure Type / Technology: Two Component System
- Elongation: 10 %
- Tensile Strength (Break): 4360 psi
- Viscosity: 40000 to 400000 cP
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Supplier: Toray Composite Materials America, Inc.
Description: 4000 prepreg system features a toughened bismaleimide (BMI) resin system specifically formulated for aircraft primary structures demanding enhanced strength and toughness in high service temperature environments up to 450°F (232°C).When compared to other BMI prepregs on the market, Toray's
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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 17.22 to 66.67 µin/in-F
- Compound Type: Casting Resin
- Features: Electrically Conductive Compound, Thermally Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP126 is a two component toughened epoxy resin based high temperature resistant adhesive system with continuous service capability at 500°F and outstanding chemical resistance. This unique high performance epoxy adhesive compound can also withstand
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Features: Flame Retardant (e.g. UL 94 Rated), Non-corrosive Cure
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
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Description: Pro Industrial Precatalyzed Waterbased Epoxies are revolutionary, single-component pre-catalyzed water-borne acrylic epoxies that offers the adhesion, durability, and resistance to stains and most cleaning solvents usually characteristic of two-component waterborne acrylic
- Chemistry: Resin Base / Polymer Binder, Acrylic / Latex, Epoxy, Water Based, Other
- Cure / Dry Temperature: 77 F
- Industry: Food and Beverage, Medical / Healthcare, OEM / Industrial, Other
- Type: Coating
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Supplier: PPG Protective & Marine Coatings
Description: -building, maintenance and maintenance. The products are designed with a high level of tolerance in order to accommodate ships with a variety of operational characteristics; low to high activity and deep-sea to coastal. The SIGMA ALPHAGEN 230 and SIGMA ALPHAGEN 240 products
- Chemistry: Resin Base / Polymer Binder, Epoxy
- Industry: Marine, OEM / Industrial
- Type: Coating
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30-3 is a two component, low viscosity, epoxy resin system featuring optical clarity, high physical strength properties, outstanding chemical resistance and superior high temperature properties. Excellent mechanical strength characteristics and
- Coeff. of Thermal Expansion (CTE): 16 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: Over 400 kV/in
- Dissimilar Substrates: Yes
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required.
- Chemical / Polymer System Type: Epoxy, Specialty / Other
- Compound Type: Casting Resin
- Dielectric Constant: 3.5 to 4
- Dielectric Strength: 440 kV/in
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Description: Low VOC Fast dry Superior penetrating characteristics Improved visibility during application RECOMMENDED USAGE CoroBond™ 100 can be used on all bare concrete surfaces where a 2 part epoxy, penetrating primer is recommended. Its low
- Chemistry: Epoxy, Resin Base / Polymer Binder
- Cure / Dry Temperature: 77 F
- Features: Other
- Form: Liquid
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Supplier: Bio-Rad Laboratories, Inc.
Description: nucleophiles, such as amino, thiol, or hydroxyl groups. These groups couple to the epoxy groups on the support, which is then used for the purification of proteins, carbohydrates, or DNA. Profinity epoxide resin is based on UNOsphere beads, which have structural characteristics
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Supplier: Bio-Rad Laboratories, Inc.
Description: nucleophiles, such as amino, thiol, or hydroxyl groups. These groups couple to the epoxy groups on the support, which is then used for the purification of proteins, carbohydrates, or DNA. Profinity epoxide resin is based on UNOsphere beads, which have structural characteristics
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Supplier: Fosroc Limited
Description: Nitomortar FC is a two-component thixotropic material based on high quality solvent-free epoxy resin systems. The colour coded material is supplied in pre-weighed quantities ready for on-site mixing and use. Nitomortar FC can be applied to damp surfaces and quickly cures to form a
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Supplier: PPG Protective & Marine Coatings
Description: -building, maintenance and maintenance. The products are designed with a high level of tolerance in order to accommodate ships with a variety of operational characteristics; low to high activity and deep-sea to coastal. The SIGMA ALPHAGEN 230 and SIGMA ALPHAGEN 240 products
- Chemistry: Epoxy, Formaldehyde Resins (Phenolic, Furan, Melamine), Metal / Metal Filled, Resin Base / Polymer Binder, Zinc
- Features: Protective
- Type: Coating, Clear Coat / Top Coat
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Description: COR-COTE E.N. 7000 is a 100% solids, two component, high build, epoxy novolac coating designed to protect substrates against severe chemical attack. Low viscosity and excellent adhesion characteristics ensure a tight bond to properly prepared concrete and steel surfaces. High build
- Chemical / Polymer System Type: Epoxy (EP), Phenolics / Formaldehyde Resins
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Industry: OEM / Industrial, Other
- Substrate / Material Compatibility: Concrete / Masonry, Metal
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1046 is a low cost, epoxy potting and casting system. Major characteristics include: low viscosity, low shrinkage, low exotherm, excellent resistance to thermal shock, and very good electrical insulation properties. When cured with any of the hardeners presented below, a
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Browse Polymers and Plastic Resins Datasheets for ExxonMobil - Polypropylene Products -
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Browse Polypropylene Resins Datasheets for ExxonMobil - Polypropylene Products -
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Browse Specialty Polymers and Resins Datasheets for Mitsui Chemicals America, Inc. -
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Reference Guide: Resin Plates Characteristics
Characteristics of Bakelite Plates. MISUMI's Bakelite Plates are products which can be used as insulating plates for switch boards, controllers, breakers and other parts. Paper base type is available in natural color and black, and a strong cloth type is also available. Characteristics of Epoxy
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Is Epoxy Stronger than Adhesive?
network that imparts superior mechanical, thermal, and electrical properties to the finished material. Due to their unique physical and chemical characteristics, epoxy resins are utilized in various applications. They are commonly used as adhesives, binders, coatings, and sealants in the electronics
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Isomandrel Thermally Enhanced Mandrels for Filament Wound Pipes, Tubes and Fibre Reinforced Plastics
Hollow composite tube or pipe sections are typically manufactured using a filament winding process. Rotating mandrels are covered with continuous strand glass or carbon fibers which are impregnated with an uncured resin generally an epoxy. After winding, the mandrel covered with the resin and fiber
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Isomandrel Heat Pipe Technical Paper
Hollow composite tube or pipe sections are typically manufactured using a filament winding process. Rotating mandrels are covered with continuous strand glass or carbon fibers which are impregnated with an uncured resin generally an epoxy. After winding, the mandrel covered with the resin and fiber
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Seaming Technique for Chemically Resistant, Reusable, Vacuum Bag Material
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Manual fiber composite plastics
1: Comparison with a conventional epoxy resin property .
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Zeit‐ and temperature dependent system behavior of adhesive reinforcing
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Designing multi‐viscosity embedding media utilizing novel resin/anhydride/catalyst combinations
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Report of the literature review committee
… & ttowe-- Product Finishing, London, 9, No. 9, 78), structure of epoxy resins and their reactions with fatty acids, anhydrides of dibasic acids, and phenol-formaldehyde resins (Bruin Pein- tures, pigments, vernis 33, 622), stearylamine- epoxide resin characteristics of the polyamide-epoxy …
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A package-process-oriented multilevel 5-/spl mu/m-thick Cu wiring technology with pulse periodic reverse electroplating and photosensitive resin
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A New Insulation Experience in Large Rotating Machinery in Japan
E. Mechanical Characteristics Epoxy resin , depending on the compounding of hard- eners with the resin, offers a wide range of mechanical properties, from flexible resin to very hard resin.
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Sealing of cracks and cavities in waterproof buildings of concrete
The injection materials on polyurethane resin base with thermosetting properties are similar in its deformation properties epoxy resins .
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B‐stage characterization of o‐cresol novolac epoxy resin system using raman spectroscopy and matrix‐assisted laser desorption/ionization mass spectrometry
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