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  • Effect of Voids on Thermomechanical Reliability of Solder Joints
    The size and location of macro-voids are not the primary factor affecting solder joint mechanical and thermal fatigue life. When void areas conform to IPC Standards, macro voids do not have any significant impact on thermal cycling or drop shock performance.
  • Rigid-Flex Power Distribution Control Circuits Application
    did not meet IPC standards for materials and construction. A solution was needed that solved these problems while maintaining existing price targets at the same time.
  • Designing VME Power Systems from Standard Modules
    For military, avionics and other high reliability applications it is best to choose DC-DC converters from a manufacturer who focuses on these applications. Look for high quality standards such as J-STD-001 and IPC-A- 610 class 3, or for the most critical applications, MIL-PRF-38534 class H or K
  • PCB Design Recommendations for Medical Electronics
    When medical devices fail, patients can suffer. So every effort must be made to ensure the devices operate as planned during their entire service lives. To that end, IPC provides several relevant standards documents that dictate design decisions for high-quality, high-reliability PCBs.
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    The long feud between the IPC packaging-industry institute and Valor Computerized Systems Inc. over which organization's CAD-to-CAM data transfer format should become the industry standard seems to be headed toward a peaceful resolution. Cadence boasts stellar Q3 results With revenues up 47 percent
  • The Low Mass Solution to 0402 Tombstoning
    Suntron shares a common goal of Quality with its Customers. IPC workmanship standards are used to provide uniformity and consistency in the product that is built. To ensure that the Quality level is maintained, the Cost of Poor Quality is monitored with respect to internal process controls
  • ANN-8803 - Recommended Soldering Techniques
    are designed to be soldered in accordance with the IPC-A-. 610 standard.
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    data close to the antenna and will enable the same receiver to process signals from different wireless standards. The long feud between the IPC packaging-industry institute and Valor Computerized Systems Inc. over which organization's CAD-to-CAM data transfer format should become the industry
  • Soldering Techniques When Soldering to CT (Matte Tin) Finish
    Standard IPC-A-610. This standard is quite extensive and is available for purchase at www.ipc.org, but for the purposes of this discussion, a few of the key elements will be highlighted. IPC-A-610 defines an acceptable solder joint to have the following characteristics. - A solder fillet will appear
  • S2083: Surface Mounting Instructions for PQFN Packages
    to a board is the layout of metalized pads. The USbased trade association, IPC, has developed land pad design standards contained in the document IPC-SM-782 entitled Surface Mount Design and Land Pattern Standards.